Composite and transistor

ABSTRACT

A novel material is provided. A composite oxide semiconductor in which a first region and a plurality of second regions are mixed is provided. Note that the first region contains at least indium, an element M (the element M is one or more of Al, Ga, Y, and Sn), and zinc, and the plurality of second regions contain indium and zinc. Since the plurality of second regions have a higher concentration of indium than the first region, the plurality of second regions have a higher conductivity than the first region. An end portion of one of the plurality of second regions overlaps with an end portion of another one of the plurality of second regions. The plurality of second regions are three-dimensionally surrounded with the first region.

TECHNICAL FIELD

The present invention relates to an object, a method, or a manufacturingmethod. The present invention relates to a process, a machine,manufacture, or a composition of matter. One embodiment of the presentinvention particularly relates to an oxide semiconductor or amanufacturing method of the oxide semiconductor. One embodiment of thepresent invention relates to a semiconductor device, a display device, aliquid crystal display device, a light-emitting device, a power storagedevice, a memory device, a driving method thereof, or a manufacturingmethod thereof.

In this specification and the like, the term “semiconductor device”means all devices which can operate by utilizing semiconductorcharacteristics. A semiconductor element such as a transistor, asemiconductor circuit, an arithmetic device, and a memory device areeach an embodiment of a semiconductor device. An imaging device, adisplay device, a liquid crystal display device, a light-emittingdevice, an electro-optical device, a power generation device (includinga thin film solar cell, an organic thin film solar cell, and the like),and an electronic device may have a semiconductor device.

BACKGROUND ART

Non-Patent Document 1 discloses a homologous series represented byIn_(1-x)Ga_(1+x)O₃(ZnO)_(m) (−1≤x≤1, and m is a natural number).Furthermore, Non-Patent Document 1 discloses a solid solution range ofthe homologous series. For example, in the solid solution range of thehomologous series in the case where m is 1, x ranges from −0.33 to 0.08,and in the solid solution range of the homologous series in the casewhere m is 2, x ranges from −0.68 to 0.32.

A technique for forming a transistor using an In—Ga—Zn-based oxidesemiconductor is disclosed (see, for example, Patent Document 1).

REFERENCES Patent Document

-   [Patent Document 1] Japanese Published Patent Application No.    2007-96055

Non-Patent Document

-   [Non-Patent Document 1] M. Nakamura, N. Kimizuka, and T. Mohri, “The    Phase Relations in the In₂O₃—Ga₂ZnO₄—ZnO System at 1350° C.,”J.    Solid State Chem., 1991, Vol. 93, pp. 298-315

DISCLOSURE OF INVENTION

Non-Patent Document 1 discloses an example of In_(x)Zn_(y)Ga_(z)O_(w),and when x, y, and z are set such that a composition in the neighborhoodof ZnGa₂O₄ is obtained, that is, when x, y, and z are close to 0, 1, and2, respectively, a spinel crystal structure is likely to be formed ormixed. A compound represented by AB₂O₄ (A and B are metals) is known asa compound having a spinel crystal structure.

However, when a spinel crystal structure is formed or mixed in anIn—Ga—Zn-based oxide semiconductor, electrical characteristics orreliability of a semiconductor device (e.g., a transistor) including theIn—Ga—Zn-based oxide semiconductor is adversely affected by the spinelcrystal structure in some cases.

In view of the above problem, an object of one embodiment of the presentinvention is to provide a novel oxide semiconductor. Another object ofone embodiment of the present invention is to provide a semiconductordevice with favorable electrical characteristics. Another object is toprovide a highly reliable semiconductor device. Another object is toprovide a semiconductor device with a novel structure. Another object isto provide a display device having a novel structure.

Note that the descriptions of these objects do not disturb the existenceof other objects. In one embodiment of the present invention, there isno need to achieve all the objects. Other objects will be apparent fromand can be derived from the description of the specification, thedrawings, the claims, and the like.

One embodiment of the present invention is a composite oxidesemiconductor in which a first region and a plurality of second regionsare mixed. The first region contains at least indium, an element M (theelement M is one or more of Al, Ga, Y, and Sn), and zinc. The pluralityof second regions contain indium and zinc. The plurality of secondregions have a higher concentration of indium than the first region. Theplurality of second regions have a higher conductivity than the firstregion. An end portion of one of the plurality of second regionsoverlaps with an end portion of another one of the plurality of secondregions. The plurality of second regions are three-dimensionallysurrounded with the first region.

In the composite oxide semiconductor of the above-described embodiment,the atomic ratio of indium to the element M and zinc (In:M:Zn) is 5:1:6or a neighborhood thereof.

In the above-described embodiment, the atomic ratio of indium to theelement M and zinc (In:M:Zn) in the first region is 4:2:3 or aneighborhood thereof.

In the above-described embodiment, the atomic ratio of indium to theelement M and zinc (In:M:Zn) in the plurality of second regions is 2:0:3or a neighborhood thereof.

In the composite oxide semiconductor of the above-described embodiment,the atomic ratio of indium to the element M and zinc (In:M:Zn) is 4:2:3or a neighborhood thereof.

In the above-described embodiment, the atomic ratio of indium to theelement M and zinc (In:M:Zn) in the first region is 1:1:1 or aneighborhood thereof.

In the above-described embodiment, the atomic ratio of indium to theelement M and zinc (In:M:Zn) in the plurality of second regions is 2:0:1or a neighborhood thereof.

In the above-described embodiment, the thickness of each of theplurality of second regions in the c-axis direction is more than orequal to 0.1 nm and less than 1 nm.

In the above-described embodiment, the first region isnon-single-crystal.

In the above-described embodiment, the first region includes a crystalportion and includes a portion where the c-axis of the crystal portionis parallel to a normal vector to a surface on which a film of thecomposite oxide semiconductor is formed.

In the above-described embodiment, the plurality of second regions arenon-single-crystal.

Another embodiment of the present invention is a transistorcharacterized by containing the composite oxide semiconductor of theabove-described embodiment.

Another embodiment of the present invention is a display deviceincluding the oxide semiconductor in any of the above embodiments and adisplay element. Another embodiment of the present invention is adisplay module including the display device and a touch sensor. Anotherembodiment of the present invention is an electronic device includingthe oxide semiconductor in any of the above embodiments, thesemiconductor device, the display device, or the display module and anoperation key or a battery.

According to one embodiment of the present invention, a novel oxidesemiconductor can be provided. According to one embodiment of thepresent invention, a semiconductor device can be provided with favorableelectrical characteristics. A highly reliable semiconductor device canbe provided. A semiconductor device with a novel structure can beprovided. A display device with a novel structure can be provided.

Note that the descriptions of these effects do not disturb the existenceof other effects. One embodiment of the present invention does notnecessarily achieve all the effects. Other effects will be apparent fromand can be derived from the description of the specification, thedrawings, the claims, and the like.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1A and 1B are conceptual diagrams of a structure of an oxidesemiconductor.

FIGS. 2A and 2B are conceptual diagrams of a structure of an oxidesemiconductor.

FIGS. 3A and 3B are conceptual diagrams of a structure of an oxidesemiconductor.

FIGS. 4A and 4B are conceptual diagrams of a structure of an oxidesemiconductor.

FIG. 5 illustrates an atomic ratio of an oxide semiconductor.

FIGS. 6A and 6B illustrate a sputtering apparatus.

FIGS. 7A and 7B illustrate a sputtering apparatus.

FIGS. 8A to 8C illustrate a sputtering apparatus.

FIGS. 9A and 9B illustrate a sputtering apparatus.

FIG. 10 is a top view illustrating an example of a deposition apparatus.

FIGS. 11A to 11C are cross-sectional views illustrating an example of adeposition apparatus.

FIGS. 12A to 12C illustrate a top view and a cross-sectional structureof a transistor of one embodiment.

FIGS. 13A to 13C illustrate a top view and a cross-sectional structureof a transistor of one embodiment.

FIGS. 14A to 14C illustrate a top view and a cross-sectional structureof a transistor of one embodiment.

FIGS. 15A to 15C illustrate a top view and a cross-sectional structureof a transistor of one embodiment.

FIGS. 16A to 16C illustrate a top view and a cross-sectional structureof a transistor of one embodiment.

FIGS. 17A to 17C illustrate a top view and a cross-sectional structureof a transistor of one embodiment.

FIGS. 18A to 18C illustrate a top view and a cross-sectional structureof a transistor of one embodiment.

FIGS. 19A to 19E illustrate an example of a method for manufacturing atransistor of one embodiment.

FIGS. 20A to 20D illustrate an example of a method for manufacturing atransistor of one embodiment.

FIGS. 21A to 21C illustrate an example of a method for manufacturing atransistor of one embodiment.

FIGS. 22A to 22C illustrate an example of a method for manufacturing atransistor of one embodiment.

FIG. 23 illustrates a cross-sectional structure of a semiconductordevice of one embodiment.

FIG. 24 illustrates a cross-sectional structure of a semiconductordevice of one embodiment.

FIG. 25 illustrates a cross-sectional structure of a semiconductordevice of one embodiment.

FIG. 26 illustrates a cross-sectional structure of a semiconductordevice of one embodiment.

FIG. 27 illustrates a cross-sectional structure of a semiconductordevice of one embodiment.

FIG. 28 illustrates a cross-sectional structure of a semiconductordevice of one embodiment.

FIGS. 29A and 29B each illustrate a cross-sectional structure of asemiconductor device of one embodiment.

FIGS. 30A and 30B are circuit diagrams of semiconductor devices of oneembodiment.

FIGS. 31A and 31B illustrate a cross-sectional structure of asemiconductor device of one embodiment.

FIGS. 32A and 32B illustrate a circuit diagram and a cross-sectionalstructure of a semiconductor device of one embodiment.

FIG. 33 illustrates a cross-sectional structure of a semiconductordevice of one embodiment.

FIG. 34 is a circuit diagram illustrating a memory device of oneembodiment of the present invention.

FIG. 35 is a circuit diagram illustrating a memory device of oneembodiment of the present invention.

FIGS. 36A to 36C are circuit diagrams and a timing chart illustratingone embodiment of the present invention.

FIGS. 37A to 37C are a graph and circuit diagrams illustrating oneembodiment of the present invention.

FIGS. 38A and 38B are a circuit diagram and a timing chart illustratingone embodiment of the present invention.

FIGS. 39A and 39B are a circuit diagram and a timing chart illustratingone embodiment of the present invention.

FIGS. 40A to 40E are a block diagram, circuit diagrams, and waveformcharts illustrating one embodiment of the present invention.

FIGS. 41A and 41B are a circuit diagram and a timing chart illustratingone embodiment of the present invention.

FIGS. 42A and 42B are circuit diagrams each illustrating one embodimentof the present invention.

FIGS. 43A to 43C are circuit diagrams each illustrating one embodimentof the present invention.

FIGS. 44A and 44B are circuit diagrams each illustrating one embodimentof the present invention.

FIGS. 45A to 45C are circuit diagrams each illustrating one embodimentof the present invention.

FIGS. 46A and 46B are circuit diagrams each illustrating one embodimentof the present invention.

FIG. 47 is a block diagram illustrating a semiconductor device of oneembodiment of the present invention.

FIG. 48 is a circuit diagram illustrating a semiconductor device of oneembodiment of the present invention.

FIGS. 49A and 49B are top views each illustrating a semiconductor deviceof one embodiment of the present invention.

FIGS. 50A and 50B are block diagrams illustrating a semiconductor deviceof one embodiment of the present invention.

FIGS. 51A and 51B are cross-sectional views each illustrating asemiconductor device of one embodiment of the present invention.

FIG. 52 is a cross-sectional view illustrating a semiconductor device ofone embodiment of the present invention.

FIGS. 53A and 53B are top views illustrating a semiconductor device ofone embodiment of the present invention.

FIGS. 54A and 54B are a flow chart illustrating one embodiment of thepresent invention and a perspective view illustrating a semiconductordevice.

FIGS. 55A to 55F are perspective views each illustrating an electronicdevice of one embodiment of the present invention.

FIG. 56 is an EDX mapping image of a cross section of a sample of oneexample.

FIGS. 57A and 57B are BF-STEM images of cross sections of samples of oneexample.

FIGS. 58A and 58B illustrate XRD measurement results and XRD analysispositions of samples of one example.

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiments will be hereinafter described with reference to drawings.Note that the embodiments can be implemented in many different modes. Itwill be readily appreciated by those skilled in the art that modes anddetails can be changed in various ways without departing from the spiritand scope of the present invention. Therefore, the present inventionshould not be interpreted as being limited to the description in thefollowing embodiments.

In the drawings, the size, the layer thickness, or the region isexaggerated for clarity in some cases. Therefore, embodiments of thepresent invention are not limited to such a scale. Note that thedrawings are schematic views showing ideal examples, and embodiments ofthe present invention are not limited to shapes or values shown in thedrawings.

Ordinal numbers such as “first,” “second,” and “third” in thisspecification are used in order to avoid confusion among components, andthe terms do not limit the components numerically.

In this specification, terms for describing arrangement, such as “over”and “under,” are used for convenience for describing the positionalrelation between components with reference to drawings. The positionalrelation between components is changed as appropriate in accordance witha direction in which each component is described. Thus, there is nolimitation on terms used in this specification, and description can bemade appropriately depending on the situation.

In this specification and the like, a transistor is an element having atleast three terminals of a gate, a drain, and a source. The transistorincludes a channel region between the drain (a drain terminal, a drainregion, or a drain electrode) and the source (a source terminal, asource region, or a source electrode) and current can flow between thesource and the drain through the channel region. Note that in thisspecification and the like, a channel region refers to a region throughwhich current mainly flows.

Functions of a “source” and a “drain” are sometimes interchanged witheach other when a transistor of opposite polarity is used or when thedirection of current flow is changed in circuit operation, for example.Therefore, the terms “source” and “drain” can be interchanged with eachother in this specification and the like.

In this specification and the like, the term “electrically connected”includes the case where components are connected through an “objecthaving any electric function.” There is no particular limitation on an“object having any electric function” as long as electric signals can betransmitted and received between components that are connected throughthe object. Examples of an “object having any electric function” includea switching element such as a transistor, a resistor, an inductor, acapacitor, and an element with a variety of functions, as well as anelectrode and a wiring.

In this specification and the like, a “silicon oxynitride film” refersto a film that contains oxygen at a higher proportion than nitrogen, anda “silicon nitride oxide film” refers to a film that contains nitrogenat a higher proportion than oxygen.

In the description of modes of the present invention with reference tothe drawings in this specification and the like, the same components indifferent diagrams are commonly denoted by the same reference numeral insome cases.

In this specification and the like, the term “parallel” indicates thatthe angle formed between two straight lines is greater than or equal to−10° and less than or equal to 10°, and accordingly also includes thecase where the angle is greater than or equal to −5° and less than orequal to 5°. In addition, the term “substantially parallel” indicatesthat the angle formed between two straight lines is greater than orequal to −30° and less than or equal to 30°. In addition, the term“perpendicular” indicates that the angle formed between two straightlines is greater than or equal to 80° and less than or equal to 100°,and accordingly also includes the case where the angle is greater thanor equal to 85° and less than or equal to 95°. In addition, the term“substantially perpendicular” indicates that the angle formed betweentwo straight lines is greater than or equal to 60° and less than orequal to 120°.

In this specification and the like, the terms “film” and “layer” can beinterchanged with each other depending on the case. For example, theterm “conductive layer” can be changed into the term “conductive film”in some cases. Also, the term “insulating film” can be changed into theterm “insulating layer” in some cases.

Note that a “semiconductor” includes characteristics of an “insulator”in some cases when, for example, the conductivity is sufficiently low.Furthermore, a “semiconductor” and an “insulator” cannot be strictlydistinguished from each other in some cases because the border betweenthe “semiconductor” and the “insulator” is not clear. Accordingly, a“semiconductor” in this specification can be called an “insulator” insome cases. Similarly, an “insulator” in this specification can becalled a “semiconductor” in some cases.

Embodiment 1

In this embodiment, an oxide semiconductor which is one embodiment ofthe present invention will be described.

An oxide semiconductor preferably contains at least indium. Inparticular, indium and zinc are preferably contained. In addition,aluminum, gallium, yttrium, tin, or the like is preferably contained.Furthermore, one or more elements selected from boron, silicon,titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum,cerium, neodymium, hafnium, tantalum, tungsten, magnesium, or the likemay be contained.

Here, the case where an oxide semiconductor contains indium, an elementM, and zinc is considered. The element M is aluminum, gallium, yttrium,tin, or the like. Alternatively, the element M can be boron, silicon,titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum,cerium, neodymium, hafnium, tantalum, tungsten, magnesium, or the like.Note that two or more of the above elements may be used in combinationas the element M. Note that the terms of the atomic ratio of indium tothe element M and zinc in the oxide semiconductor are denoted by [In],[M], and [Zn], respectively.

<Structure of Oxide Semiconductor>

Conceptual diagrams of oxide semiconductors of the present invention areillustrated in FIGS. 1A and 1B, FIGS. 2A and 2B, FIGS. 3A and 3B, andFIGS. 4A and 4B.

Conceptual diagrams of oxide semiconductors of the present invention areillustrated in FIGS. 1A to 4B. Note that FIGS. 1A, 2A, 3A, and 4A areeach a conceptual diagram of an upper surface (here, referred to as a-bplane direction) of an oxide semiconductor, and FIGS. 1B, 2B, 3B, and 4Bare each a conceptual diagram of a cross section (here, referred to asc-axis direction) of the oxide semiconductor formed over a substrateSub.

Note that FIGS. 1A to 4B each illustrate the case where the oxidesemiconductor is formed over the substrate; however, one embodiment ofthe present invention is not limited to this example. An insulating filmsuch as a base film or an interlayer film or another semiconductor filmsuch as an oxide semiconductor may be formed between the substrate andthe oxide semiconductor.

The oxide semiconductor of the present invention is a composite oxidesemiconductor having a structure in which a region A1 and a region B1are mixed as illustrated in FIGS. 1A and 1B. The region A1 is high in Inwith [In]:[M]:[Zn]=x:y:z (x>0, y≥0, z≥0). In contrast, the region B1 islow in In with [In]:[M]:[Zn]=a:b:c (a>0, b>0, c>0).

Note that in this specification, when the atomic ratio of In to theelement M in the region A1 is greater than the atomic ratio of In to theelement Min the region B1, the region A1 has a higher In concentrationthan the region B1. Therefore, in this specification, the region A1 isalso referred to as an In-rich region, and the region B1 is alsoreferred to as an In-poor region.

For example, the In concentration in the region A1 is 1.1 or more times,preferably 2 to 10 times that in the region B1. The region A1 is anoxide containing at least In and does not necessarily contain theelement M and Zn.

<Atomic Ratio>

The atomic ratio of elements included in the composite oxidesemiconductor of one embodiment of the present invention will bedescribed here.

A phase diagram in FIG. 5 can be used to show the atomic ratio ofelements in the case where the region A1 in the oxide semiconductor ofthe present invention contains In, the element M, and Zn. The atomicratio of In to the element M and Zn is denoted by x:y:z. This atomicratio can be shown as coordinates (x:y:z) in FIG. 5 . Note that theproportion of oxygen atoms is not illustrated in FIG. 5 .

In FIG. 5 , dashed lines correspond to a line representing the atomicratio of [In]:[M]:[Zn]=(1+α):(1−α):1 (−1≤α≤1), a line representing theatomic ratio of [In]:[M]: [Zn]=(1+α):(1−α):2, a line representing theatomic ratio of [In]:[M]:[Zn]=(1+α):(1−α):3, a line representing theatomic ratio of [In]:[M]:[Zn]=(1+α):(1−α):4, and a line representing theatomic ratio of [In]:[M]: [Zn]=(1+α):(1−α):5.

Dashed-dotted lines correspond to a line representing the atomic ratioof [In]:[M]:[Zn]=1:1:β (β≥0), a line representing the atomic ratio of[In]:[M]:[Zn]=1:2:β, a line representing the atomic ratio of[In]:[M]:[Zn]=1:3:β, a line representing the atomic ratio of [In]:[M]:[Zn]=1:4:β, a line representing the atomic ratio of [In]:[M]:[Zn]=1:7:β, a line representing the atomic ratio of [In]:[M]:[Zn]=2:1:β,and a line representing the atomic ratio of [In]:[M]:[Zn]=5:1:β.

An oxide semiconductor having the atomic ratio of [In]:[M]:[Zn]=0:2:1 ora neighborhood thereof in FIG. 5 tends to have a spinel crystalstructure.

A region A2 in FIG. 5 represents an example of a preferred range ofatomic ratios of indium to the element M and zinc contained in theregion A1. Note that the region A2 includes atomic ratios on a linerepresenting the atomic ratio of [In]:[M]:[Zn]=(1+γ):0:(1−γ) (−1≤γ≤1).

A region B2 in FIG. 5 represents an example of a preferred range ofatomic ratios of indium to the element M and zinc contained in theregion B1. Note that the region B2 includes atomic ratios from[In]:[M]:[Zn]=4:2:3 to [In]:[M]:[Zn]=4:2:4.1 and a neighborhood thereof.

The neighborhood includes an atomic ratio of [In]:[M]:[Zn]=5:3:4. Theregion B2 includes an atomic ratio of [In]:[M]:[Zn]=5:1:6 and aneighborhood thereof.

The region A2 with high In concentrations provides a higher conductivitythan the region B2 and has a function of increasing carrier mobility(field-effect mobility). Therefore, the on-state current and carriermobility of a transistor using an oxide semiconductor including theregion A1 can be increased.

In contrast, the region B2 with low In concentrations provides a lowerconductivity than the region A2 and has a function of decreasing leakagecurrent. Therefore, the off-state current of a transistor using an oxidesemiconductor including the region B1 can be decreased.

In the oxide semiconductor of the present invention, the region A1 andthe region B1 form a composite. That is, carrier movement occurs easilyin the region A1, whereas carrier movement does not occur easily in theregion B1. Therefore, the oxide semiconductor of the present inventioncan be used as a material with high carrier mobility, excellentswitching characteristics, and favorable semiconductor characteristics.

In one example, as illustrated in FIG. 1A, the region A1 is basicallyformed in a shape close to a circle in the a-b plane direction. Inaddition, as illustrated in FIG. 1B, the region A1 is basically formedin a shape close to an ellipse in the c-axis direction. Therefore, theregion A1 has an island-like shape and can exist in a state of beingthree-dimensionally surrounded with the region B1. That is, the regionA1 is enclosed by the region B1.

Furthermore, as illustrated in FIGS. 1A and 1B, the region A1 isdistributed unevenly and irregularly in the region B1. Therefore, aplurality of regions A1 connected to each other may exist. That is, insome cases, the plurality of regions A1 may have a shape of overlappingcircles in the a-b plane direction or a shape of ellipses whose endportions are connected in the c-axis direction. In the case where allthe regions A1 are connected in the a-b plane direction, the switchingcharacteristics of a transistor, e.g., the off-state current of thetransistor, are increased. Thus, the regions A1 are preferably scatteredin the region B1 as illustrated in FIGS. 1A and 1B.

Note that the proportion of scattered regions A1 can be adjusted bychanging formation conditions or composition of the composite oxidesemiconductor. For example, it is possible to form a composite oxidesemiconductor with a low proportion of regions A1 as illustrated inFIGS. 2A and 2B or a composite oxide semiconductor with a highproportion of regions A1 as illustrated in FIGS. 3A and 3B. Thecomposite oxide semiconductor of the present invention does notnecessarily have a low proportion of regions A1 to the region B1. In acomposite oxide semiconductor with a very high proportion of regions A1,depending on the observation range, the region B1 is sometimes formed inthe region A1.

The size of the island-like shape of the region A1 can be adjusted asappropriate by changing, for example, the formation conditions orcomposition of the composite oxide semiconductor. Although theisland-like regions have various sizes in the conceptual diagrams inFIGS. 1A to 3B, the regions A1 with substantially the same size arescattered as shown in FIGS. 4A and 4B in some cases.

In some cases, a boundary between the region A1 and the region B1 is notclearly observed. Note that the sizes of the region A1 and the region B1can be obtained by EDX mapping. For example, the thickness (alsoreferred to as diameter) of the region A1 is greater than or equal to0.1 nm and less than or equal to 5 nm, or greater than or equal to 0.3nm and less than or equal to 3 nm in a cross-sectional EDX mapping imagein some cases. Note that the thickness of the region A1 is preferablygreater than or equal to 0.1 nm and less than or equal to 1 nm.

As described above, an oxide semiconductor of one embodiment of thepresent invention is a composite oxide semiconductor in which the regionA1 and the region B1 are mixed and have different functions that arecomplementary to each other. For example, when an oxide semiconductor ofone embodiment of the present invention is an In—Ga—Zn oxide(hereinafter referred to as IGZO), in which Ga is used as the element M,the oxide semiconductor can be called complementary IGZO (abbreviation:C/IGZO).

In contrast, when the region A1 and the region B1 are stacked in alayered manner, for example, interaction does not take place or isunlikely to take place between the region A1 and the region B1, so thatthe function of the region A1 and that of the region B1 areindependently performed in some cases. In that case, even when thecarrier mobility is increased owing to the region A1, the off-statecurrent of the transistor might be increased. Therefore, in the casewhere the above-described composite oxide semiconductor or C/IGZO isused, a function of achieving high carrier mobility and a function ofachieving excellent switching characteristics can be obtained at thesame time. This is an advantageous effect obtained by using thecomposite oxide semiconductor of the present invention.

Note that in the case where the oxide semiconductor is deposited with asputtering apparatus, a film having an atomic ratio deviated from theatomic ratio of the target is formed. Especially for zinc, [Zn] in theatomic ratio of a deposited film is smaller than that in the atomicratio of the target in some cases depending on the substrate temperatureduring deposition.

Note that characteristics of the composite oxide semiconductor of oneembodiment of the present invention are not uniquely determined by theatomic ratio. Therefore, the illustrated regions represent preferredatomic ratios of the region A1 and the region B1 of the composite oxidesemiconductor; a boundary therebetween is not clear.

Oxide semiconductors can be classified into a single crystal oxidesemiconductor and a non-single-crystal oxide semiconductor. Examples ofthe non-single-crystal oxide semiconductor include a c-axis-alignedcrystalline oxide semiconductor (CAAC-OS), a polycrystalline oxidesemiconductor, a nanocrystalline oxide semiconductor (nc-OS), anamorphous-like oxide semiconductor (a-like OS), and an amorphous oxidesemiconductor.

The CAAC-OS has c-axis alignment, its nanocrystals are connected in thea-b plane direction, and its crystal structure has distortion.

In the nc-OS, a microscopic region (for example, a region with a sizegreater than or equal to 1 nm and less than or equal to 10 nm, inparticular, a region with a size greater than or equal to 1 nm and lessthan or equal to 3 nm) has a periodic atomic arrangement. There is noregularity of crystal orientation between different nanocrystals in thenc-OS. Thus, the orientation of the whole film is not observed.Accordingly, in some cases, the nc-OS cannot be distinguished from ana-like OS or an amorphous oxide semiconductor, depending on an analysismethod.

The a-like OS has a structure intermediate between those of the nc-OSand the amorphous oxide semiconductor. The a-like OS has a void or alow-density region. That is, the a-like OS has an unstable structure ascompared with the nc-OS and the CAAC-OS.

Oxide semiconductors have various structures and various properties. Theoxide semiconductor of the present invention may be a composite oxidesemiconductor including two or more of an amorphous oxide semiconductor,an a-like OS, an nc-OS, and a CAAC-OS.

For example, the region A1 is preferably non-single-crystal. The regionB1 preferably includes at least one of regions of the CAAC-OS, thepolycrystalline oxide semiconductor, the nc-OS, and the like. The regionA1 and the region B1 may include different crystals.

<Transistor Including Oxide Semiconductor>

Next, the case where the oxide semiconductor is used for a transistorwill be described.

Note that when the composite oxide semiconductor is used for atransistor, the transistor can have high carrier mobility and excellentswitching characteristics. In addition, the transistor can have highreliability.

An oxide semiconductor with low carrier density is preferably used forthe transistor. For example, an oxide semiconductor whose carrierdensity is lower than 8×10¹¹/cm³, preferably lower than 1×10¹¹/cm³,further preferably lower than 1×10¹⁰/cm³, and greater than or equal to1×10⁻⁹/cm³ is used.

A highly purified intrinsic or substantially highly purified intrinsicoxide semiconductor has few carrier generation sources, and thus canhave a low carrier density. A highly purified intrinsic or substantiallyhighly purified intrinsic oxide semiconductor has a low density ofdefect states and accordingly has a low density of trap states in somecases.

Charges trapped by the trap states in the oxide semiconductor take along time to be released and may behave like fixed charges. Thus, thetransistor whose channel region is formed in the oxide semiconductorhaving a high density of trap states has unstable electricalcharacteristics in some cases.

To obtain stable electrical characteristics of the transistor, it iseffective to reduce the concentration of impurities in the oxidesemiconductor. In addition, to reduce the concentration of impurities inthe oxide semiconductor, the concentration of impurities in a film thatis adjacent to the oxide semiconductor is preferably reduced. Examplesof impurities include hydrogen, nitrogen, alkali metal, alkaline earthmetal, iron, nickel, and silicon.

Here, the influence of impurities in the oxide semiconductor will bedescribed.

When silicon or carbon that is one of Group 14 elements is contained inthe oxide semiconductor, defect states are formed. Thus, theconcentration of silicon or carbon in the oxide semiconductor and aroundan interface with the oxide semiconductor (measured by secondary ionmass spectrometry (SIMS)) is set lower than or equal to 2×10¹⁸atoms/cm³, and preferably lower than or equal to 2×10¹⁷ atoms/cm³.

When the oxide semiconductor contains alkali metal or alkaline earthmetal, defect states are formed and carriers are generated, in somecases. Thus, a transistor including an oxide semiconductor whichcontains alkali metal or alkaline earth metal is likely to benormally-on. Therefore, it is preferable to reduce the concentration ofalkali metal or alkaline earth metal in the oxide semiconductor.Specifically, the concentration of alkali metal or alkaline earth metalin the oxide semiconductor, which is measured by SIMS, is lower than orequal to 1×10¹⁸ atoms/cm³, preferably lower than or equal to 2×10¹⁶atoms/cm³.

When the oxide semiconductor contains nitrogen, the oxide semiconductoreasily becomes n-type by generation of electrons serving as carriers andan increase of carrier density. Thus, a transistor including an oxidesemiconductor which contains nitrogen is likely to be normally-on. Forthis reason, nitrogen in the oxide semiconductor is preferably reducedas much as possible; the nitrogen concentration measured by SIMS is set,for example, lower than 5×10¹⁹ atoms/cm³, preferably lower than or equalto 5×10¹⁸ atoms/cm³, further preferably lower than or equal to 1×10¹⁸atoms/cm³, and still further preferably lower than or equal to 5×10¹⁷atoms/cm³.

Hydrogen contained in an oxide semiconductor reacts with oxygen bondedto a metal atom to be water, and thus causes an oxygen vacancy (Vo), insome cases. Due to entry of hydrogen into the oxygen vacancy (Vo), anelectron serving as a carrier is generated in some cases. Furthermore,in some cases, bonding of part of hydrogen to oxygen bonded to a metalatom causes generation of an electron serving as a carrier. Thus, atransistor including an oxide semiconductor that contains hydrogen islikely to be normally-on. Accordingly, it is preferable that hydrogen inthe oxide semiconductor be reduced as much as possible. Specifically,the hydrogen concentration measured by SIMS is set lower than 1×10²⁰atoms/cm³, preferably lower than 1×10¹⁹ atoms/cm³, further preferablylower than 5×10¹⁸ atoms/cm³, and still further preferably lower than1×10¹⁸ atoms/cm³.

Note that oxygen vacancies (Vo) in the oxide semiconductor can bereduced by introduction of oxygen into the oxide semiconductor. That is,the oxygen vacancies (Vo) in the oxide semiconductor disappear when theoxygen vacancies (Vo) are filled with oxygen. Accordingly, diffusion ofoxygen in the oxide semiconductor can reduce the oxygen vacancies (Vo)in a transistor and improve the reliability of the transistor.

As a method for introducing oxygen into the oxide semiconductor, forexample, an oxide in which oxygen content is higher than that in thestoichiometric composition is provided in contact with the oxidesemiconductor. That is, in the oxide, a region including oxygen inexcess of that in the stoichiometric composition (hereinafter alsoreferred to as an excess-oxygen region) is preferably formed. Inparticular, in the case of using an oxide semiconductor in a transistor,an oxide including an excess-oxygen region is provided in a base film,an interlayer film, or the like in the vicinity of the transistor,whereby oxygen vacancies in the transistor are reduced, and thereliability can be improved.

When an oxide semiconductor with sufficiently reduced impurityconcentration is used for a channel formation region in a transistor,the transistor can have stable electrical characteristics.

<Method for Depositing Oxide Semiconductor>

An example of a method for depositing an oxide semiconductor by asputtering method will be described below.

The oxide semiconductor is preferably deposited at a temperature higherthan or equal to room temperature and lower than 140° C. Note that roomtemperature includes not only the case where temperature control is notperformed but also the case where temperature control is performed.

As a sputtering gas, a rare gas (typically argon), oxygen, or a mixedgas of a rare gas and oxygen is used as appropriate. In the mixed gas,the proportion of oxygen to the rare gas is more than or equal to 5% andless than or equal to 30%, preferably more than or equal to 7% and lessthan or equal to 20%.

When the sputtering gas contains oxygen, oxygen can be added to a filmunder the oxide semiconductor and an excess-oxygen region can beprovided at the same time as the deposition of the oxide semiconductor.In addition, increasing the purity of a sputtering gas is necessary. Forexample, when a gas which is highly purified to have a dew point of −40°C. or lower, preferably −80° C. or lower, further preferably −100° C. orlower, still further preferably −120° C. or lower, is used as asputtering gas, i.e., the oxygen gas or the argon gas, entry of moistureor the like into the oxide semiconductor can be minimized.

In the case where the oxide semiconductor is deposited by a sputteringmethod, a chamber in a sputtering apparatus is preferably evacuated tobe a high vacuum state (to the degree of about 5×10⁻⁷ Pa to 1×10⁻⁴ Pa)with an adsorption vacuum evacuation pump such as a cryopump in order toremove water or the like, which serves as an impurity for the oxidesemiconductor, as much as possible. Alternatively, a turbo molecularpump and a cold trap are preferably combined so as to prevent a backflowof a gas, especially a gas containing carbon or hydrogen from an exhaustsystem to the inside of the chamber.

As a target, an In—Ga—Zn metal oxide target can be used. For example, ametal oxide target having an atomic ratio of [In]:[Ga]:[Zn]=4:2:4.1,[In]:[Ga]:[Zn]=5:1:6, or a neighborhood thereof is preferably used.

In the sputtering apparatus, the target may be rotated or moved. Forexample, a magnet unit is oscillated vertically and/or horizontallyduring the deposition, whereby the composite oxide semiconductor of thepresent invention can be formed. For example, the target may be rotatedor moved with a beat (also referred to as rhythm, pulse, frequency,period, cycle, or the like) of greater than or equal to 0.1 Hz and lessthan or equal to 1 kHz. Alternatively, the magnet unit may be oscillatedwith a beat of greater than or equal to 0.1 Hz and less than or equal to1 kHz. Note that the details of the sputtering apparatus will bedescribed in a later embodiment.

The oxide semiconductor of the present invention can be formed, forexample, in the following manner: a mixed gas of oxygen and a rare gasin which the proportion of oxygen is approximately 10% is used; thesubstrate temperature is 130° C.; and an In—Ga—Zn metal oxide targethaving an atomic ratio of [In]:[Ga]:[Zn]=4:2:4.1 is oscillated duringthe deposition.

First, in a deposition chamber, the rare gas or the oxygen gas isionized to be separated into cations and electrons, and plasma iscreated. The cations in the plasma are accelerated toward the target bya potential applied to a target holder. Sputtered particles aregenerated when the cations collide with the In—Ga—Zn metal oxide target,and the sputtered particles are deposited on the substrate.

When the cations collide with the In—Ga—Zn metal oxide target, Ga andZn, which have lower relative atomic masses than In, are preferentiallysputtered from the target. The sputtered In, Ga, and Zn are bonded tooxygen and then deposited to the substrate, whereby the region B1 isdeposited. At this time, In is segregated at the surface of the target.

Next, In segregated at the surface of the target is sputtered from thetarget as a structure like a plurality of particles. The segregated Inhaving a structure like a plurality of particles is bonded to oxygen,collides with the region B1 deposited earlier, and spreads into a shapeclose to a circle, whereby the region A1 having an island-like shape isdeposited. Note that since the segregated In is sputtered, In, Ga, andZn exist at the surface of the target in a state close to the originalatomic ratio.

When the cations further collide with the target, Ga and Zn, which havelower relative atomic masses than In, are preferentially sputtered fromthe target. At this time, In is segregated at the surface of the target.The region B1 is deposited again over the regions B1 and Al depositedearlier, whereby the region B1 is formed such that the region A1 issurrounded therewith.

Note that in one region of the target surface, In is segregated, and inanother region of the target surface, segregated In is sputtered. Thatis, a mechanism of In segregation and a mechanism of sputtering ofsegregated In occur at the same time, leading to a structure in whichthe region A1 is surrounded with the region B1 and distributed unevenlyand irregularly.

The composite oxide semiconductor in which the region A1 and the regionB1 are mixed as illustrated in FIGS. 1A and 1B, FIGS. 2A and 2B, FIGS.3A and 3B, or FIGS. 4A and 4B is presumed to be formed after theabove-described deposition model.

In the oxide semiconductor of the present invention, the region A1 whichis high in In and has an atomic ratio shown in the region A2 and theregion B1 which is low in In and has an atomic ratio shown in the regionB2 are mixed to form a composite oxide semiconductor. That is, carriermovement occurs easily in the region A1, whereas carrier movement doesnot occur easily in the region B1. Therefore, the oxide semiconductor ofthe present invention can be used as a material with high carriermobility, excellent switching characteristics, and favorablesemiconductor characteristics.

The structure described in this embodiment can be combined with any ofthe structures described in the other embodiments and examples asappropriate.

Embodiment 2

In this embodiment, sputtering apparatuses and a deposition apparatuswith which the oxide of one embodiment of the present invention can bedeposited are described with reference to FIGS. 6A and 6B, FIGS. 7A and7B, FIGS. 8A to 8C, FIGS. 9A and 9B, FIG. 10 , and FIGS. 11A to 11C. Thefollowing descriptions of the sputtering apparatuses are made for easyunderstanding or the explanation of the operation during deposition, onthe assumption that a substrate, a target, and the like are provided.Note that the substrate, the target, and the like are provided by auser; thus, the sputtering apparatus of one embodiment of the presentinvention does not necessarily include the substrate and the target.

<Sputtering Apparatus>

Examples of sputtering apparatuses include a parallel-plate-typesputtering apparatus and a facing-targets sputtering apparatus. Notethat deposition using a parallel-plate-type sputtering apparatus canalso be referred to as parallel electrode sputtering (PESP), anddeposition using a facing-targets sputtering apparatus can also bereferred to as vapor deposition sputtering (VDSP).

[Parallel-Plate-Type Sputtering Apparatus (PESP)]

First, the parallel-plate-type sputtering apparatus is described. FIG.6A is a cross-sectional view of a deposition chamber 601 that is aparallel-plate-type sputtering apparatus. The deposition chamber 601 inFIG. 6A includes a target holder 620, a backing plate 610, a target 600,a magnet unit 630, and a substrate holder 670. Note that the target 600is placed over the backing plate 610. The backing plate 610 is placedover the target holder 620. The magnet unit 630 is placed under thetarget 600 with the backing plate 610 positioned therebetween. Thesubstrate holder 670 faces the target 600. Note that in thisspecification, a magnet unit means a group of magnets. The term “magnetunit” can be replaced with “cathode,” “cathode magnet,” “magneticmember,” “magnetic part,” or the like. The magnet unit 630 includes amagnet 630N, a magnet 630S, and a magnet holder 632. Note that in themagnet unit 630, the magnet 630N and the magnet 630S are placed over themagnet holder 632. The magnet 630N and the magnet 630S are spaced. Whena substrate 660 is transferred into the deposition chamber 601, thesubstrate 660 is placed on the substrate holder 670.

The target holder 620 and the backing plate 610 are fixed to each otherwith a screw (e.g., a bolt) and have the same potential. The targetholder 620 has a function of supporting the target 600 with the backingplate 610 positioned therebetween.

The target 600 is fixed to the backing plate 610. For example, thetarget 600 can be fixed to the backing plate 610 with a bonding membercontaining a low-melting-point metal such as indium.

FIG. 6A illustrates a magnetic line of force 680 a and a magnetic lineof force 680 b formed by the magnet unit 630.

The magnetic line of force 680 a is one of magnetic lines of force thatform a horizontal magnetic field in the vicinity of the top surface ofthe target 600. The vicinity of the top surface of the target 600corresponds to a region in which the vertical distance from the target600 is, for example, greater than or equal to 0 mm and less than orequal to 10 mm, in particular, greater than or equal to 0 mm and lessthan or equal to 5 mm.

The magnetic line of force 680 b is one of magnetic lines of force thatform a horizontal magnetic field in a plane apart from the top surfaceof the magnet unit 630 by a vertical distance d. The vertical distance dis, for example, greater than or equal to 0 mm and less than or equal to20 mm or greater than or equal to 5 mm and less than or equal to 15 mm.

Here, with the use of the strong magnet 630N and the strong magnet 630S,an intense magnetic field can be generated in the vicinity of the topsurface of the substrate 660. Specifically, the magnetic flux density ofthe horizontal magnetic field on the top surface of the substrate 660can be greater than or equal to 10 G and less than or equal to 100 G,preferably greater than or equal to 15 G and less than or equal to 60 G,further preferably greater than or equal to 20 G and less than or equalto 40 G.

Note that the magnetic flux density of the horizontal magnetic field maybe measured when the magnetic flux density of the vertical magneticfield is 0 G.

By setting the magnetic flux density of the magnetic field in thedeposition chamber 601 to be in the above range, an oxide with highdensity and high crystallinity can be deposited. The deposited oxidehardly includes a plurality of kinds of crystalline phases and has asubstantially single crystalline phase.

FIG. 6B is a top view of the magnet unit 630. In the magnet unit 630,the magnet 630N having a circular or substantially circular shape andthe magnet 630S having a circular or substantially circular shape arefixed to the magnet holder 632. The magnet unit 630 can be rotated abouta normal vector at the center of the top surface of the magnet unit 630or a normal vector substantially at the center of the top surface of themagnet unit 630. For example, the magnet unit 630 may be rotated with abeat (also referred to as rhythm, pulse, frequency, period, cycle, orthe like) of greater than or equal to 0.1 Hz and less than or equal to 1kHz.

Thus, a region where a magnetic field on the target 600 is intensechanges as the magnet unit 630 is rotated. The region with an intensemagnetic field is a high-density plasma region; thus, sputtering of thetarget 600 easily occurs in the vicinity of the region. For example,when the region with an intense magnetic field is fixed, only a specificregion of the target 600 is used. In contrast, when the magnet unit 630is rotated as shown in FIG. 6B, plasma 640 is generated between thetarget 600 and the substrate 660, and the target 600 can be uniformlyused. By rotating the magnet unit 630, a film with a uniform thicknessand uniform quality can be deposited.

By rotating the magnet unit 630, the direction of the magnetic line offorce on the top surface of the substrate 660 can also be changed.

Although the magnet unit 630 is rotated in this example, one embodimentof the present invention is not limited to this example. For example,the magnet unit 630 may be oscillated vertically and/or horizontally.For example, the magnet unit 630 may be oscillated with a beat ofgreater than or equal to 0.1 Hz and less than or equal to 1 kHz.Alternatively, the target 600 may be rotated or moved. For example, thetarget 600 may be rotated or moved with a beat of greater than or equalto 0.1 Hz and less than or equal to 1 kHz. Further alternatively, thedirection of a magnetic line of force on the top surface of thesubstrate 660 may be changed relatively by rotating the substrate 660.These methods may be combined.

The deposition chamber 601 may have a water channel inside or under thebacking plate 610. By making a fluid (air, nitrogen, a rare gas, water,oil, or the like) flow through the water channel, discharge anomaly dueto an increase in the temperature of the target 600 or damage to thedeposition chamber 601 due to deformation of a component can beprevented in the sputtering. In that case, the backing plate 610 and thetarget 600 are preferably adhered to each other with a bonding memberbecause the cooling capability is increased.

A gasket is preferably provided between the target holder 620 and thebacking plate 610, in which case an impurity is less likely to enter thedeposition chamber 601 from the outside, the water channel, or the like.

In the magnet unit 630, the magnet 630N and the magnet 630S are placedsuch that their surfaces on the target 600 side have oppositepolarities. Here, the case where the pole of the magnet 630N on thetarget 600 side is the north pole and the pole of the magnet 630S on thetarget 600 side is the south pole is described. Note that the layout ofthe magnets and the poles in the magnet unit 630 is not limited to thatdescribed here or that illustrated in FIG. 6A.

In the deposition, a potential V1 applied to a terminal V1 connected tothe target holder 620 is, for example, lower than a potential V2 appliedto a terminal V2 connected to the substrate holder 670. The potential V2applied to the terminal V2 connected to the substrate holder 670 is, forexample, the ground potential. A potential V3 applied to a terminal V3connected to the magnet holder 632 is, for example, the groundpotential. Note that the potentials applied to the terminals V1, V2, andV3 are not limited to the above description. Not all the target holder620, the substrate holder 670, and the magnet holder 632 are necessarilysupplied with potentials. For example, the substrate holder 670 may beelectrically floating. Note that although the potential V1 is applied tothe terminal V1 connected to the target holder 620 (i.e., a DCsputtering method is employed) in the example illustrated in FIG. 6A,one embodiment of the present invention is not limited thereto. Forexample, it is possible to employ what is called an RF sputteringmethod, in which case a high-frequency power supply with a frequency of13.56 MHz or 27.12 MHz, for example, is connected to the target holder620.

FIG. 6A illustrates an example where the backing plate 610 and thetarget holder 620 are not electrically connected to the magnet unit 630and the magnet holder 632, but electrical connection is not limitedthereto. For example, the backing plate 610 and the target holder 620may be electrically connected to the magnet unit 630 and the magnetholder 632, and the backing plate 610, the target holder 620, the magnetunit 630, and the magnet holder 632 may have the same potential.

To increase the crystallinity of the oxide to be obtained, thetemperature of the substrate 660 may be set high. By setting thetemperature of the substrate 660 high, migration of sputtered particleson the top surface of the substrate 660 can be promoted. Thus, an oxidewith higher density and higher crystallinity can be deposited. Note thatthe temperature of the substrate 660 is, for example, higher than orequal to 100° C. and lower than or equal to 450° C., preferably higherthan or equal to 150° C. and lower than or equal to 400° C., morepreferably higher than or equal to 170° C. and lower than or equal to350° C.

When the partial pressure of oxygen in the deposition gas is too high,an oxide including a plurality of kinds of crystalline phases is likelyto be deposited; therefore, a mixed gas of oxygen and a rare gas such asargon (other examples of the rare gas are helium, neon, krypton, andxenon) is preferably used as the deposition gas. For example, theproportion of oxygen in the whole deposition gas is less than 50 vol %,preferably less than or equal to 33 vol %, further preferably less thanor equal to 20 vol %, and still further preferably less than or equal to15 vol %.

The vertical distance between the target 600 and the substrate 660 isgreater than or equal to 10 mm and less than or equal to 600 mm,preferably greater than or equal to 20 mm and less than or equal to 400mm, more preferably greater than or equal to 30 mm and less than orequal to 200 mm, further more preferably greater than or equal to 40 mmand less than or equal to 100 mm. Within the above range, the verticaldistance between the target 600 and the substrate 660 can be, in somecases, small enough to suppress a decrease in the energy of thesputtered particles until the sputtered particles reach the substrate660. Within the above range, the vertical distance between the target600 and the substrate 660 can be, in some cases, large enough to makethe incident direction of the sputtered particle substantially verticalto the substrate 660, so that damage to the substrate 660 caused bycollision of the sputtered particles can be reduced.

FIG. 7A illustrates an example of a deposition chamber different fromthat in FIG. 6A.

The deposition chamber 601 in FIG. 7A includes a target holder 620 a, atarget holder 620 b, a backing plate 610 a, a backing plate 610 b, atarget 600 a, a target 600 b, a magnet unit 630 a, a magnet unit 630 b,a member 642, and the substrate holder 670. Note that the target 600 ais placed over the backing plate 610 a. The backing plate 610 a isplaced over the target holder 620 a. The magnet unit 630 a is placedunder the target 600 a with the backing plate 610 a positionedtherebetween. The target 600 b is placed over the backing plate 610 b.The backing plate 610 b is placed over the target holder 620 b. Themagnet unit 630 b is placed under the target 600 b with the backingplate 610 b positioned therebetween.

The magnet unit 630 a includes a magnet 630N1, a magnet 630N2, themagnet 630S, and the magnet holder 632. Note that in the magnet unit 630a, the magnet 630N1, the magnet 630N2, and the magnet 630S are placedover the magnet holder 632. The magnet 630N1, the magnet 630N2, and themagnet 630S are spaced. Note that the magnet unit 630 b has a structuresimilar to that of the magnet unit 630 a. When the substrate 660 istransferred into the deposition chamber 601, the substrate 660 is placedon the substrate holder 670.

The target 600 a, the backing plate 610 a, and the target holder 620 aare separated from the target 600 b, the backing plate 610 b, and thetarget holder 620 b by the member 642. Note that the member 642 ispreferably an insulator. However, the member 642 may be a conductor or asemiconductor. The member 642 may be a conductor or a semiconductorwhose surface is covered with an insulator.

The target holder 620 a and the backing plate 610 a are fixed to eachother with a screw (e.g., a bolt) and have the same potential. Thetarget holder 620 a has a function of supporting the target 600 a withthe backing plate 610 a positioned therebetween. The target holder 620 band the backing plate 610 b are fixed to each other with a screw (e.g.,a bolt) and have the same potential. The target holder 620 b has afunction of supporting the target 600 b with the backing plate 610 bpositioned therebetween.

The backing plate 610 a has a function of fixing the target 600 a. Thebacking plate 610 b has a function of fixing the target 600 b.

FIG. 7A illustrates the magnetic line of force 680 a and the magneticline of force 680 b formed by the magnet unit 630 a.

The magnetic line of force 680 a is one of magnetic lines of force thatform a horizontal magnetic field in the vicinity of the top surface ofthe target 600 a. The vicinity of the top surface of the target 600 acorresponds to a region in which the vertical distance from the target600 a is, for example, greater than or equal to 0 mm and less than orequal to 10 mm, in particular, greater than or equal to 0 mm and lessthan or equal to 5 mm.

The magnetic line of force 680 b is one of magnetic lines of force thatform a horizontal magnetic field in a plane apart from the top surfaceof the magnet unit 630 a by a vertical distance d. The vertical distanced is, for example, greater than or equal to 0 mm and less than or equalto 20 mm or greater than or equal to 5 mm and less than or equal to 15mm.

Here, with the use of the strong magnet 630N1, the strong magnet 630N2,and the strong magnet 630S, an intense magnetic field can be generatedin the vicinity of the top surface of the substrate 660. Specifically,the magnetic flux density of the horizontal magnetic field on the topsurface of the substrate 660 can be greater than or equal to 10 G andless than or equal to 100 G, preferably greater than or equal to 15 Gand less than or equal to 60 G, further preferably greater than or equalto 20 G and less than or equal to 40 G.

By setting the magnetic flux density of the magnetic field in thedeposition chamber 601 to be in the above range, an oxide with highdensity and high crystallinity can be deposited. The deposited oxidehardly includes a plurality of kinds of crystalline phases and has asubstantially single crystalline phase.

Note that the magnet unit 630 b forms magnetic lines of force similar tothose formed by the magnet unit 630 a.

FIG. 7B is a top view of the magnet units 630 a and 630 b. In the magnetunit 630 a, the magnet 630N1 having a rectangular or substantiallyrectangular shape, the magnet 630N2 having a rectangular orsubstantially rectangular shape, and the magnet 630S having arectangular or substantially rectangular shape are fixed to the magnetholder 632. The magnet unit 630 a can be oscillated horizontally asshown in FIG. 7B. For example, the magnet unit 630 a may be oscillatedwith a beat of greater than or equal to 0.1 Hz and less than or equal to1 kHz.

Thus, a region where a magnetic field on the target 600 a is intensechanges as the magnet unit 630 a is oscillated. The region with anintense magnetic field is a high-density plasma region; thus, sputteringof the target 600 a easily occurs in the vicinity of the region. Forexample, when the region with an intense magnetic field is fixed, only aspecific region of the target 600 a is used. In contrast, when themagnet unit 630 a is oscillated as shown in FIG. 7B, plasma 640 isgenerated between the target 600 a and the substrate 660, and the target600 a can be uniformly used. By oscillating the magnet unit 630 a, afilm with a uniform thickness and uniform quality can be deposited.

By oscillating the magnet unit 630 a, the state of the magnetic lines offorce on the top surface of the substrate 660 can also be changed. Thesame applies to the magnet unit 630 b.

Although the magnet unit 630 a and the magnet unit 630 b are oscillatedin this example, one embodiment of the present invention is not limitedto this example. For example, the magnet unit 630 a and the magnet unit630 b may be rotated. For example, the magnet unit 630 a and the magnetunit 630 b may be rotated with a beat of greater than or equal to 0.1 Hzand less than or equal to 1 kHz. Alternatively, the target 600 may berotated or moved. For example, the target 600 may be rotated or movedwith a beat of greater than or equal to 0.1 Hz and less than or equal to1 kHz. Further alternatively, the state of magnetic lines of force onthe top surface of the substrate 660 can be changed relatively byrotating the substrate 660. These methods may be combined.

The deposition chamber 601 may have a water channel inside or under thebacking plate 610 a and the backing plate 610 b. By making a fluid (air,nitrogen, a rare gas, water, oil, or the like) flow through the waterchannel, discharge anomaly due to an increase in the temperature of thetarget 600 a and the target 600 b or damage to the deposition chamber601 due to deformation of a component can be prevented in thesputtering. In that case, the backing plate 610 a and the target 600 aare preferably adhered to each other with a bonding member because thecooling capability is increased. Furthermore, the backing plate 610 band the target 600 b are preferably adhered to each other with a bondingmember because the cooling capability is increased.

A gasket is preferably provided between the target holder 620 a and thebacking plate 610 a, in which case an impurity is less likely to enterthe deposition chamber 601 from the outside, the water channel, or thelike. A gasket is preferably provided between the target holder 620 band the backing plate 610 b, in which case an impurity is less likely toenter the deposition chamber 601 from the outside, the water channel, orthe like.

In the magnet unit 630 a, the magnets 630N1 and 630N2 and the magnet630S are placed such that their surfaces on the target 600 a side haveopposite polarities. Here, the case where the pole of each of themagnets 630N1 and 630N2 on the target 600 a side is the north pole andthe pole of the magnet 630S on the target 600 a side is the south poleis described. Note that the layout of the magnets and the poles in themagnet unit 630 a is not limited to that described here or thatillustrated in FIG. 7A. The same applies to the magnet unit 630 b.

In the deposition, a potential applied to the terminal V1 connected tothe target holder 620 a and a potential applied to the terminal V4connected to the target holder 620 b may be alternately switched betweena high level and a low level. When the potential applied to the terminalV1 is one of the high level and the low level, the potential applied tothe terminal V4 is the other of the high level and the low level. Apotential applied to the terminal V2 connected to the substrate holder670 is, for example, the ground potential. A potential applied to theterminal V3 connected to the magnet holder 632 is, for example, theground potential. Note that the potentials applied to the terminals V1,V2, V3, and V4 are not limited to the above description. Not all thetarget holder 620 a, the target holder 620 b, the substrate holder 670,and the magnet holder 632 are necessarily supplied with potentials. Forexample, the substrate holder 670 may be electrically floating. Notethat the potential applied to the terminal V1 connected to the targetholder 620 a and the potential applied to the terminal V4 connected tothe target holder 620 b are alternately switched between the high leveland the low level (i.e., an AC sputtering method) in the exampleillustrated in FIG. 7A; however, one embodiment of the present inventionis not limited thereto.

FIG. 7A illustrates an example where the backing plate 610 a and thetarget holder 620 a are not electrically connected to the magnet unit630 a and the magnet holder 632, but electrical connection is notlimited thereto. For example, the backing plate 610 a and the targetholder 620 a may be electrically connected to the magnet unit 630 a andthe magnet holder 632, and the backing plate 610 a, the target holder620 a, the magnet unit 630 a, and the magnet holder 632 may have thesame potential. The backing plate 610 b and the target holder 620 b arenot electrically connected to the magnet unit 630 b and the magnetholder 632 in the example, but electrical connection is not limitedthereto. For example, the backing plate 610 b and the target holder 620b may be electrically connected to the magnet unit 630 b and the magnetholder 632, and the backing plate 610 b, the target holder 620 b, themagnet unit 630 b, and the magnet holder 632 may have the samepotential.

To increase the crystallinity of the oxide to be obtained, thetemperature of the substrate 660 may be set high. By setting thetemperature of the substrate 660 high, migration of sputtered particleson the top surface of the substrate 660 can be promoted. Thus, an oxidewith higher density and higher crystallinity can be deposited. Note thatthe temperature of the substrate 660 is, for example, higher than orequal to 100° C. and lower than or equal to 450° C., preferably higherthan or equal to 150° C. and lower than or equal to 400° C., morepreferably higher than or equal to 170° C. and lower than or equal to350° C.

When the partial pressure of oxygen in the deposition gas is too high,an oxide including a plurality of kinds of crystalline phases is likelyto be deposited; therefore, a mixed gas of oxygen and a rare gas such asargon (other examples of the rare gas are helium, neon, krypton, andxenon) is preferably used as the deposition gas. For example, theproportion of oxygen in the whole deposition gas is less than 50 vol %,preferably less than or equal to 33 vol %, further preferably less thanor equal to 20 vol %, and still further preferably less than or equal to15 vol %.

The vertical distance between the target 600 a and the substrate 660 isgreater than or equal to 10 mm and less than or equal to 600 mm,preferably greater than or equal to 20 mm and less than or equal to 400mm, more preferably greater than or equal to 30 mm and less than orequal to 200 mm, further more preferably greater than or equal to 40 mmand less than or equal to 100 mm. Within the above range, the verticaldistance between the target 600 a and the substrate 660 can be, in somecases, small enough to suppress a decrease in the energy of thesputtered particles until the sputtered particles reach the substrate660. Within the above range, the vertical distance between the target600 a and the substrate 660 can be, in some cases, large enough to makethe incident direction of the sputtered particle substantially verticalto the substrate 660, so that damage to the substrate 660 caused bycollision of the sputtered particles can be reduced.

The vertical distance between the target 600 b and the substrate 660 isgreater than or equal to 10 mm and less than or equal to 600 mm,preferably greater than or equal to 20 mm and less than or equal to 400mm, more preferably greater than or equal to 30 mm and less than orequal to 200 mm, further more preferably greater than or equal to 40 mmand less than or equal to 100 mm. Within the above range, the verticaldistance between the target 600 b and the substrate 660 can be, in somecases, small enough to suppress a decrease in the energy of thesputtered particles until the sputtered particles reach the substrate660. Within the above range, the vertical distance between the target600 b and the substrate 660 can be, in some cases, large enough to makethe incident direction of the sputtered particle substantially verticalto the substrate 660, so that damage to the substrate 660 caused bycollision of the sputtered particles can be reduced.

[Facing-Targets Sputtering Apparatus (VDSP)]

Next, the facing-targets sputtering apparatus is described. FIG. 8A is across-sectional view of a deposition chamber in a facing-targetssputtering apparatus. The deposition chamber illustrated in FIG. 8Aincludes the target 600 a, the target 600 b, the backing plate 610 a forholding the target 600 a, the backing plate 610 b for holding the target600 b, the magnet unit 630 a placed behind the target 600 a with thebacking plate 610 a positioned therebetween, and the magnet unit 630 bplaced behind the target 600 b with the backing plate 610 b positionedtherebetween. The substrate holder 670 is placed between the target 600a and the target 600 b. The substrate holder 670 is placed above aregion where the target 600 a and the target 600 b face each other (alsoreferred to as a region between targets). The substrate 660 istransferred into the deposition chamber, and then the substrate 660 isfixed to the substrate holder 670.

As illustrated in FIG. 8A, the substrate holder 670 is placed above theregion between targets, but may be placed below the region.Alternatively, the substrate holders 670 may be placed above and belowthe region. Providing the substrate holders 670 above and below theregion allows deposition on two or more substrates at once, leading toan increase in productivity.

As illustrated in FIG. 8A, a power source 690 and a power source 691 forapplying potentials are connected to the backing plates 610 a and 610 b.It is preferable to use AC power sources, which alternately apply ahigh-level potential and a low-level potential to the backing plate 610a and the backing plate 610 b. Although AC power sources are used as thepower sources 690 and 691 illustrated in FIG. 8A, one embodiment of thepresent invention is not limited thereto. For example, RF power sources,DC power sources, or the like can be used as the power sources 690 and691. Alternatively, different kinds of power sources may be used as thepower sources 690 and 691.

The substrate holder 670 is preferably connected to GND. The substrateholder 670 may be in a floating state.

FIGS. 8B and 8C each show potential distribution of plasma 640 alongdashed-dotted line A-B in FIG. 8A. FIG. 8B shows the potentialdistribution in the case where a high potential is applied to thebacking plate 610 a and a low potential is applied to the backing plate610 b. In that case, a cation is accelerated toward the target 600 b.FIG. 8C shows the potential distribution in the case where a lowpotential is applied to the backing plate 610 a and a high potential isapplied to the backing plate 610 b. In that case, a cation isaccelerated toward the target 600 a. The deposition can be performed byalternating the state in FIG. 8B and the state in FIG. 8C.

In FIG. 8A, the target 600 a and the target 600 b are parallel to eachother. Moreover, the magnet unit 630 a and the magnet unit 630 b areplaced so that opposite poles face each other. Magnetic lines of forcerun from the magnet unit 630 b to the magnet unit 630 a. Therefore, inthe deposition, the plasma 640 is confined in the magnetic field formedby the magnet units 630 a and 630 b. Thus, the substrate holder 670 andthe substrate 660 are located outside the plasma 640. The substrate 660is not exposed to a high electric field region of the plasma 640,leading to a reduction in damage due to the plasma 640.

The facing-targets sputtering apparatus can stably generate plasma evenin a high vacuum. Thus, deposition can be performed at a pressure higherthan or equal to 0.005 Pa and lower than or equal to 0.09 Pa, forexample. As a result, the concentration of impurities contained duringdeposition can be reduced.

The use of the facing-targets sputtering apparatus allows deposition ina high vacuum or deposition with less plasma damage and thus can providea film with high crystallinity even when the temperature of thesubstrate 660 is low (e.g., higher than or equal to 10° C. and lowerthan 100° C.).

A structure illustrated in FIG. 9A is different from that illustrated inFIG. 8A in that the target 600 a and the target 600 b that face eachother are not parallel but inclined to each other (in V-shape). Thus,the description for FIG. 8A is referred to for the description exceptfor the arrangement of the targets. The magnet unit 630 a and the magnetunit 630 b are placed so that opposite poles face each other. Thesubstrate holder 670 and the substrate 660 are placed above the regionbetween targets. With the targets 600 a and 600 b placed as illustratedin FIG. 9A, the proportion of sputtered particles that reach thesubstrate 660 can be increased; accordingly, the deposition rate can beincreased.

FIG. 9B illustrates another example of a facing-targets sputteringapparatus.

FIG. 9B is a schematic cross-sectional view of a deposition chamber of afacing-targets sputtering apparatus. Unlike in the deposition chamberillustrated in FIG. 8A, a target shield 622 and a target shield 623 areprovided. The power source 691 connected to the backing plates 610 a and610 b is also provided. The substrate holder 670 is placed above theregion between targets. Thus, the substrate 660 is not exposed to a highelectric field region of the plasma 640, leading to a reduction indamage due to the plasma 640.

As illustrated in FIG. 9B, the substrate holder 670 is placed above theregion between targets, but may be placed below the region.Alternatively, the substrate holders 670 may be placed above and belowthe region. Providing the substrate holders 670 above and below theregion allows deposition on two or more substrates at once, leading toan increase in productivity.

The target shields 622 and 623 are connected to GND as illustrated inFIG. 9B. This means that the plasma 640 is generated by a potentialdifference between the backing plates 610 a and 610 b to which apotential of the power source 691 is applied and the target shields 622and 623 to which GND is applied.

In the above-described facing-targets sputtering apparatuses, plasma isconfined by magnetic fields between targets; thus, plasma damage to asubstrate can be reduced. Furthermore, a deposited film can provideimproved step coverage because an incident angle of a sputtered particleto a substrate can be made smaller by the inclination of the target.Moreover, deposition in a high vacuum enables the concentration ofimpurities contained in the film to be reduced.

Note that a parallel-plate-type sputtering apparatus or an ion beamsputtering apparatus may be provided in the deposition chamber.

<Deposition Apparatus>

A deposition apparatus of one embodiment of the present inventionincluding a deposition chamber in which a sputtering target can beplaced will be described below.

First, a structure of a deposition apparatus which allows the entry offew impurities into a film at the time of the deposition or the like isdescribed with reference to FIG. 10 and FIGS. 11A to 11C.

FIG. 10 is a schematic top view of a single wafer multi-chamberdeposition apparatus 2700. The deposition apparatus 2700 includes anatmosphere-side substrate supply chamber 2701 including a cassette port2761 for storing substrates and an alignment port 2762 for performingalignment of substrates, an atmosphere-side substrate transfer chamber2702 through which a substrate is transferred from the atmosphere-sidesubstrate supply chamber 2701, a load lock chamber 2703 a where asubstrate is carried in and the pressure is switched from atmosphericpressure to reduced pressure or from reduced pressure to atmosphericpressure, an unload lock chamber 2703 b where a substrate is carried outand the pressure is switched from reduced pressure to atmosphericpressure or from atmospheric pressure to reduced pressure, a transferchamber 2704 where a substrate is transferred in a vacuum, a substrateheating chamber 2705 where a substrate is heated, and depositionchambers 2706 a, 2706 b, and 2706 c in each of which a sputtering targetis placed for deposition. Note that for the deposition chambers 2706 a,2706 b, and 2706 c, the structure of the above-described depositionchamber can be referred to.

The atmosphere-side substrate transfer chamber 2702 is connected to theload lock chamber 2703 a and the unload lock chamber 2703 b, the loadlock chamber 2703 a and the unload lock chamber 2703 b are connected tothe transfer chamber 2704, and the transfer chamber 2704 is connected tothe substrate heating chamber 2705 and the deposition chambers 2706 a,2706 b, and 2706 c.

Note that gate valves 2764 are provided in connecting portions betweenthe chambers so that each chamber excluding the atmosphere-sidesubstrate supply chamber 2701 and the atmosphere-side substrate transferchamber 2702 can be independently kept in a vacuum state. In each of theatmosphere-side substrate transfer chamber 2702 and the transfer chamber2704, a transfer robot 2763 is provided, which is capable oftransferring substrates.

It is preferable that the substrate heating chamber 2705 also serve as aplasma treatment chamber. In the deposition apparatus 2700, substratescan be transferred without being exposed to the air between treatments,and adsorption of impurities to substrates can be suppressed. Inaddition, the order of deposition, heat treatment, or the like can befreely determined. Note that the number of the transfer chambers, thenumber of the deposition chambers, the number of the load lock chambers,the number of the unload lock chambers, and the number of the substrateheating chambers are not limited to the above, and the numbers thereofcan be set as appropriate depending on the space for placement and theprocess conditions.

Next, FIG. 11A, FIG. 11B, and FIG. 11C are a cross-sectional view takenalong dashed-dotted line X1-X2, a cross-sectional view taken alongdashed-dotted line Y1-Y2, and a cross-sectional view taken alongdashed-dotted line Y2-Y3, respectively, in the deposition apparatus 2700illustrated in FIG. 10 .

FIG. 11A illustrates a cross section of the substrate heating chamber2705 and the transfer chamber 2704, and the substrate heating chamber2705 includes a plurality of heating stages 2765 which can hold asubstrate. Note that the substrate heating chamber 2705 is connected toa vacuum pump 2770 through a valve. As the vacuum pump 2770, a dry pumpand a mechanical booster pump can be used, for example.

As a heating mechanism which can be used for the substrate heatingchamber 2705, a resistance heater may be used for heating, for example.Alternatively, heat conduction or heat radiation from a medium such as aheated gas may be used as the heating mechanism. For example, rapidthermal annealing (RTA) such as gas rapid thermal annealing (GRTA) orlamp rapid thermal annealing (LRTA) can be used. The LRTA is a methodfor heating an object by radiation of light (an electromagnetic wave)emitted from a lamp such as a halogen lamp, a metal halide lamp, a xenonarc lamp, a carbon arc lamp, a high-pressure sodium lamp, or ahigh-pressure mercury lamp. In the GRTA, heat treatment is performedusing a high-temperature gas. An inert gas is used as the gas.

Moreover, the substrate heating chamber 2705 is connected to a refiner2781 through a mass flow controller 2780. Note that although the massflow controller 2780 and the refiner 2781 can be provided for each of aplurality of kinds of gases, only one mass flow controller 2780 and onerefiner 2781 are provided for easy understanding. As the gas introducedto the substrate heating chamber 2705, a gas whose dew point is −80° C.or lower, preferably −100° C. or lower can be used; for example, anoxygen gas, a nitrogen gas, and a rare gas (e.g., an argon gas) areused.

The transfer chamber 2704 includes the transfer robot 2763. The transferrobot 2763 can transfer a substrate to each chamber. Furthermore, thetransfer chamber 2704 is connected to the vacuum pump 2770 and acryopump 2771 through valves. Owing to such a structure, exhaust isperformed using the vacuum pump 2770 from the atmospheric pressure tolow or medium vacuum (approximately 0.1 Pa to several hundred pascals)and then the valves are switched and exhaust is performed using thecryopump 2771 from the medium vacuum to high or ultra-high vacuum (0.1Pa to 1×10⁻⁷ Pa).

Alternatively, two or more cryopumps 2771 may be connected in parallelto the transfer chamber 2704. With such a structure, even when one ofthe cryopumps is in regeneration, exhaust can be performed using any ofthe other cryopumps. Note that the above regeneration refers totreatment for discharging molecules (or atoms) entrapped in thecryopump. When molecules (or atoms) are entrapped too much in acryopump, the exhaust capability of the cryopump is lowered; therefore,regeneration is performed regularly.

FIG. 11B illustrates a cross section of the deposition chamber 2706 b,the transfer chamber 2704, and the load lock chamber 2703 a.

Here, the details of the deposition chamber (sputtering chamber) aredescribed with reference to FIG. 11B. The deposition chamber 2706 billustrated in FIG. 11B includes a target 2766 a, a target 2766 b, atarget shield 2767 a, a target shield 2767 b, a magnet unit 2790 a, amagnet unit 2790 b, a substrate holder 2768, and power sources 2791.Although not illustrated, each of the targets 2766 a and 2766 b is fixedto a target holder with a backing plate provided therebetween. The powersource 2791 is electrically connected to each of the targets 2766 a and2766 b. The magnet unit 2790 a is placed on a back side of the target2766 a, and the magnet unit 2790 b is placed on a back side of thetarget 2766 b. The target shield 2767 a is provided so as to surround anend portion of the target 2766 a, and the target shield 2767 b isprovided so as to surround an end portion of target 2766 b. Note thathere, a substrate 2769 is supported by the substrate holder 2768. Thesubstrate holder 2768 is fixed to the deposition chamber 2706 b by anadjustment member 2784. Owing to the adjustment member 2784, thesubstrate holder 2768 can be moved. The substrate holder 2768 is placedabove a region between the target 2766 a and the target 2766 b (alsoreferred to as a region between targets). Providing the substrate holder2768 supporting the substrate 2769 above the region between targets canreduce damage due to plasma, for example. Although not illustrated, thesubstrate holder 2768 may include a substrate holding mechanism whichholds the substrate 2769, a heater which heats the substrate 2769 fromthe back side, or the like.

As illustrated in FIG. 11B, the substrate holder 2768 is placed abovethe region between targets, but may be placed below the region.Alternatively, the substrate holders 2768 may be placed above and belowthe region. Providing the substrate holders 2768 above and below theregion allows deposition on two or more substrates at once, leading toan increase in productivity.

The target shields 2767 can suppress deposition of a particle which issputtered from the target 2766 on a region where deposition is notneeded. Moreover, the target shields 2767 are preferably processed toprevent accumulated sputtered particles from being separated. Forexample, blasting treatment which increases surface roughness may beperformed, or roughness may be formed on the surfaces of the targetshields 2767.

The deposition chamber 2706 b is connected to the mass flow controller2780 through a gas heating mechanism 2782, and the gas heating mechanism2782 is connected to the refiner 2781 through the mass flow controller2780. With the gas heating mechanism 2782, a gas which is introduced tothe deposition chamber 2706 b can be heated to a temperature higher thanor equal to 40° C. and lower than or equal to 400° C. Note that althoughthe gas heating mechanism 2782, the mass flow controller 2780, and therefiner 2781 can be provided for each of a plurality of kinds of gases,only one gas heating mechanism 2782, one mass flow controller 2780, andone refiner 2781 are provided for easy understanding. As the gasintroduced to the deposition chamber 2706 b, a gas whose dew point is−80° C. or lower, preferably −100° C. or lower can be used; for example,an oxygen gas, a nitrogen gas, and a rare gas (e.g., an argon gas) areused.

In the case where the refiner is provided near a gas inlet, the lengthof a pipe between the refiner and the deposition chamber 2706 b is lessthan or equal to 10 m, preferably less than or equal to 5 m, and furtherpreferably less than or equal to 1 m. When the length of the pipe isless than or equal to 10 m, less than or equal to 5 m, or less than orequal to 1 m, the effect of the release of gas from the pipe can bereduced accordingly. As the pipe for the gas, a metal pipe the inside ofwhich is covered with iron fluoride, aluminum oxide, chromium oxide, orthe like can be used. With the above pipe, the amount of released gascontaining impurities is made small and the entry of impurities into thegas can be reduced as compared with a SUS316L-EP pipe, for example.Furthermore, a high-performance ultra-compact metal gasket joint (UPGjoint) may be used as a joint of the pipe. A structure where all thematerials of the pipe are metals is preferable because the effect of thegenerated released gas or the external leakage can be reduced ascompared with a structure where a resin or the like is used.

The deposition chamber 2706 b is connected to a turbo molecular pump2772 and the vacuum pump 2770 through valves.

In addition, the deposition chamber 2706 b is provided with a cryotrap2751.

The cryotrap 2751 is a mechanism which can adsorb a molecule (or anatom) having a relatively high melting point, such as water. The turbomolecular pump 2772 is capable of stably removing a large-sized molecule(or atom), needs low frequency of maintenance, and thus enables highproductivity, whereas it has a low capability in removing hydrogen andwater. Hence, the cryotrap 2751 is connected to the deposition chamber2706 b so as to have a high capability in removing water or the like.The temperature of a freezer of the cryotrap 2751 is set to be lowerthan or equal to 100 K, preferably lower than or equal to 80 K. In thecase where the cryotrap 2751 includes a plurality of freezers, it ispreferable to set the temperatures of the freezers at differenttemperatures because efficient exhaust is possible. For example, thetemperature of a first-stage freezer may be set to be lower than orequal to 100 K and the temperature of a second-stage freezer may be setto be lower than or equal to 20 K. Note that when a titanium sublimationpump is used instead of the cryotrap, a higher vacuum can be achieved insome cases. Using an ion pump instead of a cryopump or a turbo molecularpump can also achieve higher vacuum in some cases.

Note that the exhaust method of the deposition chamber 2706 b is notlimited to the above, and a structure similar to that in the exhaustmethod described above for the transfer chamber 2704 (the exhaust methodusing the cryopump and the vacuum pump) may be employed. Needless tosay, the exhaust method of the transfer chamber 2704 may have astructure similar to that of the deposition chamber 2706 b (the exhaustmethod using the turbo molecular pump and the vacuum pump).

Note that in each of the transfer chamber 2704, the substrate heatingchamber 2705, and the deposition chamber 2706 b which are describedabove, the back pressure (total pressure) and the partial pressure ofeach gas molecule (atom) are preferably set as follows. In particular,the back pressure and the partial pressure of each gas molecule (atom)in the deposition chamber 2706 b need to be noted because impuritiesmight enter a film to be formed.

In each of the above chambers, the back pressure (total pressure) isless than or equal to 1×10⁻⁴ Pa, preferably less than or equal to 3×10⁻⁵Pa, and further preferably less than or equal to 1×10⁻⁵ Pa. In each ofthe above chambers, the partial pressure of a gas molecule (atom) havinga mass-to-charge ratio (m/z) of 18 is less than or equal to 3×10⁻⁵ Pa,preferably less than or equal to 1×10⁻⁵ Pa, and further preferably lessthan or equal to 3×10⁻⁶ Pa. Moreover, in each of the above chambers, thepartial pressure of a gas molecule (atom) having a mass-to-charge ratio(m/z) of 28 is less than or equal to 3×10⁻⁵ Pa, preferably less than orequal to 1×10⁻⁵ Pa, and further preferably less than or equal to 3×10⁻⁶Pa. Furthermore, in each of the above chambers, the partial pressure ofa gas molecule (atom) having a mass-to-charge ratio (m/z) of 44 is lessthan or equal to 3×10⁻⁵ Pa, preferably less than or equal to 1×10⁻⁵ Pa,and further preferably less than or equal to 3×10⁻⁶ Pa.

Note that a total pressure and a partial pressure in a vacuum chambercan be measured using a mass analyzer. For example, Qulee CGM-051, aquadrupole mass analyzer (also referred to as Q-mass) manufactured byULVAC, Inc. may be used.

Moreover, the transfer chamber 2704, the substrate heating chamber 2705,and the deposition chamber 2706 b which are described above preferablyhave a small amount of external leakage or internal leakage.

For example, in each of the transfer chamber 2704, the substrate heatingchamber 2705, and the deposition chamber 2706 b which are describedabove, the leakage rate is less than or equal to 3×10⁻⁶ Pa·m³/s,preferably less than or equal to 1×10⁻⁶ Pa·m³/s. The leakage rate of agas molecule (atom) having a mass-to-charge ratio (m/z) of 18 is lessthan or equal to 1×10⁻⁷ Pa·m³/s, preferably less than or equal to 3×10⁻⁸Pa·m³/s. The leakage rate of a gas molecule (atom) having amass-to-charge ratio (m/z) of 28 is less than or equal to 1×10⁻⁵Pa·m³/s, preferably less than or equal to 1×10⁻⁶ Pa·m³/s. The leakagerate of a gas molecule (atom) having a mass-to-charge ratio (m/z) of 44is less than or equal to 3×10⁻⁶ Pa·m³/s, preferably less than or equalto 1×10⁻⁶ Pa·m³/s.

Note that a leakage rate can be derived from the total pressure andpartial pressure measured using the mass analyzer.

The leakage rate depends on external leakage and internal leakage. Theexternal leakage refers to inflow of gas from the outside of a vacuumsystem through a minute hole, a sealing defect, or the like. Theinternal leakage is due to leakage through a partition, such as a valve,in a vacuum system or due to released gas from an internal member.Measures need to be taken from both aspects of external leakage andinternal leakage in order that the leakage rate can be set to be lessthan or equal to the above value.

For example, an open/close portion of the deposition chamber 2706 b canbe sealed with a metal gasket. For the metal gasket, metal covered withiron fluoride, aluminum oxide, or chromium oxide is preferably used. Themetal gasket realizes higher adhesion than an O-ring, and can reduce theexternal leakage. Furthermore, with the use of the metal covered withiron fluoride, aluminum oxide, chromium oxide, or the like, which is inthe passive state, the release of gas containing impurities releasedfrom the metal gasket is suppressed, so that the internal leakage can bereduced.

For a member of the deposition apparatus 2700, aluminum, chromium,titanium, zirconium, nickel, or vanadium, which releases a smalleramount of gas containing impurities, is used. Alternatively, for theabove member, an alloy containing iron, chromium, nickel, and the likecovered with the above material may be used. The alloy containing iron,chromium, nickel, and the like is rigid, resistant to heat, and suitablefor processing. Here, when surface unevenness of the member is decreasedby polishing or the like to reduce the surface area, the release of gascan be reduced.

Alternatively, the above member of the deposition apparatus 2700 may becovered with iron fluoride, aluminum oxide, chromium oxide, or the like.

The member of the deposition apparatus 2700 is preferably formed usingonly metal when possible. For example, in the case where a viewingwindow formed with quartz or the like is provided, it is preferable thatthe surface of the viewing window be thinly covered with iron fluoride,aluminum oxide, chromium oxide, or the like so as to suppress release ofgas.

When an adsorbed substance is present in the deposition chamber, theadsorbed substance does not affect the pressure in the depositionchamber because it is adsorbed onto an inner wall or the like; however,the adsorbed substance causes gas to be released when the inside of thedeposition chamber is evacuated. Therefore, although there is nocorrelation between the leakage rate and the exhaust rate, it isimportant that the adsorbed substance present in the deposition chamberbe desorbed as much as possible and exhaust be performed in advance withthe use of a pump with high exhaust capability. Note that the depositionchamber may be subjected to baking to promote desorption of the adsorbedsubstance. By the baking, the desorption rate of the adsorbed substancecan be increased about tenfold. The baking can be performed at atemperature in the range of 100° C. to 450° C. At this time, when theadsorbed substance is removed while an inert gas is introduced to thedeposition chamber, the desorption rate of water or the like, which isdifficult to desorb simply by exhaust, can be further increased. Notethat when the inert gas which is introduced is heated to substantiallythe same temperature as the baking temperature, the desorption rate ofthe adsorbed substance can be further increased. Here, a rare gas ispreferably used as an inert gas. Depending on the kind of a film to bedeposited, oxygen or the like may be used instead of an inert gas. Forexample, in deposition of an oxide, the use of oxygen which is a maincomponent of the oxide is preferable in some cases. The baking ispreferably performed using a lamp.

Alternatively, treatment for evacuating the inside of the depositionchamber is preferably performed for a certain period of time afterheated oxygen, a heated inert gas such as a heated rare gas, or the likeis introduced to increase a pressure in the deposition chamber. Theintroduction of the heated gas can desorb the adsorbed substance in thedeposition chamber, and the impurities present in the deposition chambercan be reduced. Note that an advantageous effect can be achieved whenthis treatment is repeated more than or equal to 2 times and less thanor equal to 30 times, preferably more than or equal to 5 times and lessthan or equal to 15 times. Specifically, an inert gas, oxygen, or thelike with a temperature higher than or equal to 40° C. and lower than orequal to 400° C., preferably higher than or equal to 50° C. and lowerthan or equal to 200° C. is introduced to the deposition chamber, sothat the pressure therein can be kept to be greater than or equal to 0.1Pa and less than or equal to 10 kPa, preferably greater than or equal to1 Pa and less than or equal to 1 kPa, further preferably greater than orequal to 5 Pa and less than or equal to 100 Pa in the time range of 1minute to 300 minutes, preferably 5 minutes to 120 minutes. After that,the inside of the deposition chamber is evacuated in the time range of 5minutes to 300 minutes, preferably 10 minutes to 120 minutes.

The desorption rate of the adsorbed substance can be further increasedalso by dummy deposition. Here, the dummy deposition refers todeposition on a dummy substrate by a sputtering method or the like, inwhich a film is deposited on the dummy substrate and the inner wall ofthe deposition chamber so that impurities in the deposition chamber andan adsorbed substance on the inner wall of the deposition chamber areconfined in the film. As the dummy substrate, a substrate which releasesa smaller amount of gas is preferably used. By performing dummydeposition, the concentration of impurities in a film to be formed latercan be reduced. Note that the dummy deposition may be performed at thesame time as the baking of the deposition chamber.

Next, the details of the transfer chamber 2704 and the load lock chamber2703 a illustrated in FIG. 11B and the atmosphere-side substratetransfer chamber 2702 and the atmosphere-side substrate supply chamber2701 illustrated in FIG. 11C are described. Note that FIG. 11Cillustrates a cross section of the atmosphere-side substrate transferchamber 2702 and the atmosphere-side substrate supply chamber 2701.

For the transfer chamber 2704 illustrated in FIG. 11B, the descriptionof the transfer chamber 2704 illustrated in FIG. 11A can be referred to.

The load lock chamber 2703 a includes a substrate delivery stage 2752.When a pressure in the load lock chamber 2703 a becomes atmosphericpressure by being increased from reduced pressure, the substratedelivery stage 2752 receives a substrate from the transfer robot 2763provided in the atmosphere-side substrate transfer chamber 2702. Afterthat, the load lock chamber 2703 a is evacuated into vacuum so that thepressure therein becomes reduced pressure and then the transfer robot2763 provided in the transfer chamber 2704 receives the substrate fromthe substrate delivery stage 2752.

Furthermore, the load lock chamber 2703 a is connected to the vacuumpump 2770 and the cryopump 2771 through valves. For a method forconnecting exhaust systems such as the vacuum pump 2770 and the cryopump2771, the description of the method for connecting the transfer chamber2704 can be referred to, and the description thereof is omitted here.Note that the unload lock chamber 2703 b illustrated in FIG. 10 can havea structure similar to that of the load lock chamber 2703 a.

The atmosphere-side substrate transfer chamber 2702 includes thetransfer robot 2763. The transfer robot 2763 can deliver a substratefrom the cassette port 2761 to the load lock chamber 2703 a or deliver asubstrate from the load lock chamber 2703 a to the cassette port 2761.Furthermore, a mechanism for suppressing entry of dust or a particle,such as a high-efficiency particulate air (HEPA) filter, may be providedabove the atmosphere-side substrate transfer chamber 2702 and theatmosphere-side substrate supply chamber 2701.

The atmosphere-side substrate supply chamber 2701 includes a pluralityof cassette ports 2761. The cassette port 2761 can hold a plurality ofsubstrates.

The surface temperature of the target is set to be lower than or equalto 100° C., preferably lower than or equal to 50° C., and furtherpreferably about room temperature (typified by 25° C.). In a sputteringapparatus for a large substrate, a large target is often used. However,it is difficult to form a target for a large substrate without ajuncture. In fact, a plurality of targets are arranged so that there isas little space as possible therebetween to obtain a large shape;however, a slight space is inevitably generated. When the surfacetemperature of the target increases, in some cases, zinc or the like isvolatilized from such a slight space and the space might be expandedgradually. When the space expands, a metal of a backing plate or a metalof a bonding material used for adhesion between the backing plate andthe target might be sputtered and might cause an increase in impurityconcentration. Thus, it is preferable that the target be cooledsufficiently.

Specifically, to efficiently cool the target, a metal having highconductivity and a high heat dissipation property (specifically copper)is used for the backing plate, or a sufficient amount of cooling wateris made to flow through a water channel formed in the backing plate.

Note that in the case where the target includes zinc, plasma damage isalleviated by the deposition in an oxygen gas atmosphere; thus, an oxidein which zinc is unlikely to be volatilized can be obtained.

The above-described deposition apparatus enables deposition of an oxidesemiconductor whose hydrogen concentration measured by secondary ionmass spectrometry (SIMS) is lower than or equal to 2×10²⁰ atoms/cm³,preferably lower than or equal to 5×10¹⁹ atoms/cm³, further preferablylower than or equal to 1×10¹⁹ atoms/cm³, and still further preferablylower than or equal to 5×10¹⁸ atoms/cm³.

Furthermore, an oxide semiconductor whose nitrogen concentrationmeasured by SIMS is lower than 5×10¹⁹ atoms/cm³, preferably lower thanor equal to 1×10¹⁹ atoms/cm³, further preferably lower than or equal to5×10¹⁸ atoms/cm³, and still further preferably lower than or equal to1×10¹⁸ atoms/cm³ can be deposited.

Moreover, an oxide semiconductor whose carbon concentration measured bySIMS is lower than 5×10¹⁹ atoms/cm³, preferably lower than or equal to5×10¹⁸ atoms/cm³, further preferably lower than or equal to 1×10¹⁸atoms/cm³, and still further preferably lower than or equal to 5×10¹⁷atoms/cm³ can be deposited.

An oxide having few impurities and oxygen vacancies is an oxide with lowcarrier density (specifically, lower than 8×10¹¹/cm³, preferably lowerthan 1×10¹¹/cm³, further preferably lower than 1×10¹⁰/cm³, and higherthan or equal to 1×10⁻⁹/cm³). Such an oxide semiconductor is referred toas a highly purified intrinsic or substantially highly purifiedintrinsic oxide semiconductor. A CAAC-OS has a low impurityconcentration and a low density of defect states. Thus, the CAAC-OS canbe regarded as an oxide having stable characteristics.

Furthermore, an oxide semiconductor can be deposited in which thereleased amount of each of the following gas molecules (atoms) measuredby TDS is less than or equal to 1×10¹⁹/cm³ and preferably less than orequal to 1×10¹⁸/cm³: a gas molecule (atom) having a mass-to-charge ratio(m/z) of 2 (e.g., a hydrogen molecule), a gas molecule (atom) having amass-to-charge ratio (m/z) of 18, a gas molecule (atom) having amass-to-charge ratio (m/z) of 28, and a gas molecule (atom) having amass-to-charge ratio (m/z) of 44.

With the above deposition apparatus, entry of impurities into the oxidecan be suppressed. Furthermore, when a film in contact with the oxide isformed with the use of the above deposition apparatus, the entry ofimpurities into the oxide from the film in contact therewith can besuppressed.

The structure described in this embodiment can be combined with any ofthe structures described in the other embodiments and examples asappropriate.

Embodiment 3

In this embodiment, one embodiment of a semiconductor device isdescribed with reference to FIGS. 12A to 12C, FIGS. 13A to 13C, FIGS.14A to 14C, FIGS. 15A to 15C, FIGS. 16A to 16C, FIGS. 17A to 17C, FIGS.18A to 18C, FIGS. 19A to 19E, FIGS. 20A to 20D, FIGS. 21A to 21C, andFIGS. 22A to 22C.

<Transistor Structure 1>

An example of a transistor of one embodiment of the present invention isdescribed below. FIGS. 12A to 12C are a top view and cross-sectionalviews of the transistor of one embodiment of the present invention. FIG.12A is a top view. FIG. 12B is a cross-sectional view taken alongdashed-dotted line X1-X2 in FIG. 12A. FIG. 12C is a cross-sectional viewtaken along dashed-dotted line Y1-Y2 in FIG. 12A. Note that forsimplification of the drawing, some components are not illustrated inthe top view in FIG. 12A.

A transistor 200 includes a conductor 205 (conductors 205 a and 205 b)and a conductor 260 which function as gate electrodes, insulators 220,222, and 224 and an insulator 250 which function as gate insulatinglayers, an oxide 230 having a region where a channel is formed (oxides230 a, 230 b, and 230 c), a conductor 240 a functioning as one of asource and a drain, a conductor 240 b functioning as the other of thesource and the drain, an insulator 280 containing excess oxygen, and aninsulator 282 having a barrier property.

The oxide 230 includes the oxide 230 a, the oxide 230 b over the oxide230 a, and the oxide 230 c over the oxide 230 b. When the transistor 200is turned on, current flows (a channel is formed) mainly in the oxide230 b. In contrast, although a current might flow in the vicinity of theinterface (a mixed region in some cases) between the oxide 230 b and theoxide 230 a or 230 c, the rest of the oxides 230 a and 230 c mightfunction as insulators.

As illustrated in FIGS. 12A to 12C, the oxide 230 c is preferablyprovided to cover side surfaces of the oxides 230 a and 230 b. The oxide230 c, which is provided between the insulator 280 and the oxide 230 bincluding the region where the channel is formed, can prevent impuritiessuch as hydrogen, water, and halogen from diffusing from the insulator280 into the oxide 230 b.

The conductor 205 is formed using a metal film containing an elementselected from molybdenum, titanium, tantalum, tungsten, aluminum,copper, chromium, neodymium, and scandium; a metal nitride filmcontaining any of the above elements as its component (e.g., a tantalumnitride film, a titanium nitride film, a molybdenum nitride film, or atungsten nitride film); or the like. In particular, a metal nitride filmsuch as a tantalum nitride film is preferable because it has a barrierproperty against hydrogen or oxygen and is difficult to oxidize (has ahigh oxidation resistance). Alternatively, it is possible to use aconductive material such as indium tin oxide, indium oxide containingtungsten oxide, indium zinc oxide containing tungsten oxide, indiumoxide containing titanium oxide, indium tin oxide containing titaniumoxide, indium zinc oxide, or indium tin oxide to which silicon oxide isadded.

For example, it is preferable that a conductor having a barrier propertyagainst hydrogen, e.g., tantalum nitride, be used as the conductor 205a, and tungsten, which has high conductivity, be stacked thereover asthe conductor 205 b. The use of the combination of the materials canprevent diffusion of hydrogen into the oxide 230 while the conductivityof a wiring is ensured. Note that a two-layer structure of theconductors 205 a and 205 b is illustrated in FIGS. 12A to 12C; however,one embodiment of the present invention is not limited thereto, and asingle-layer structure or a stacked-layer structure of three or morelayers may be used. For example, between a conductor having a barrierproperty and a conductor having high conductivity, a conductor which ishighly adhesive to the conductor having a barrier property and theconductor having high conductivity may be formed.

The insulator 224 is preferably an insulator containing oxygen, such asa silicon oxide film or a silicon oxynitride film. In particular, theinsulator 224 is preferably an insulator containing excess oxygen(containing oxygen in excess of that in the stoichiometric composition).In the case where such an insulator containing excess oxygen is providedin contact with the oxide 230 in the transistor 200, oxygen vacancies inthe oxide 230 can be filled.

Furthermore, when the insulator 224 includes an excess-oxygen region,the insulator 222 preferably has a barrier property against oxygen,hydrogen, and water. When the insulator 222 has a barrier propertyagainst oxygen, oxygen in the excess-oxygen region is not diffused tothe transistor 300 side but supplied to the oxide 230 efficiently. Theconductor 205 can be inhibited from reacting with oxygen of theexcess-oxygen region of the insulator 224.

The insulator 222 preferably has a single-layer structure or astacked-layer structure using an insulator such as silicon oxide,silicon oxynitride, silicon nitride oxide, aluminum oxide, hafniumoxide, tantalum oxide, zirconium oxide, lead zirconate titanate (PZT),strontium titanate (SrTiO₃), or (Ba,Sr)TiO₃ (BST). In particular, aninsulating film having a barrier property against oxygen or hydrogen,e.g., an aluminum oxide film or a hafnium oxide film, is preferablyused. The insulator 222 formed of such a material functions as a layerwhich prevents release of oxygen from the oxide 230 and entry of animpurity such as hydrogen from the outside.

Alternatively, aluminum oxide, bismuth oxide, germanium oxide, niobiumoxide, silicon oxide, titanium oxide, tungsten oxide, yttrium oxide, orzirconium oxide may be added to the insulator, for example.Alternatively, the insulator may be subjected to nitriding treatment.Silicon oxide, silicon oxynitride, or silicon nitride may be stackedover the above insulator.

Note that the insulators 220, 222, and 224 each may have a stacked-layerstructure of two or more layers. In that case, the stacked layers arenot necessarily formed of the same material but may be formed ofdifferent materials.

Since the insulator 222 including a high-k material is provided betweenthe insulator 220 and the insulator 224, electrons can be trapped in theinsulator 222 under specific conditions, and the threshold voltage canbe increased. As a result, the insulator 222 is negatively charged insome cases.

For example, in the case where the insulator 220 and the insulator 224are formed using silicon oxide and the insulator 222 is formed using amaterial having a lot of electron trap states such as hafnium oxide,aluminum oxide, or tantalum oxide, the state where the potential of theconductor 205 is higher than the potential of the source electrode orthe drain electrode is kept at a temperature higher than the operatingtemperature or the storage temperature of the semiconductor device(e.g., at a temperature of 125° C. or higher and 450° C. or lower,typically 150° C. or higher and 300° C. or lower) for 10 milliseconds orlonger, typically one minute or longer. Thus, electrons are moved fromthe oxide in the transistor 200 to the conductor 205. At this time, someof the moving electrons are trapped by the electron trap states of theinsulator 222.

In the transistor in which a necessary amount of electrons is trapped bythe electron trap states in the insulator 222, the threshold voltage isshifted in the positive direction. By controlling the voltage of theconductor 205, the amount of electrons to be trapped can be controlled,and thus the threshold voltage can be controlled. The transistor 200having the structure is a normally-off transistor which is in anon-conduction state (also referred to as an off state) even when thegate voltage is 0 V.

Furthermore, the treatment for trapping the electrons may be performedin the manufacturing process of the transistor. For example, thetreatment is preferably performed at any step before factory shipment,such as after the formation of a conductor connected to the sourceconductor or the drain conductor of the transistor, after pretreatment(wafer processing), after a wafer-dicing step, after packaging, or thelike.

The threshold voltage can be controlled by appropriate adjustment of thethicknesses of the insulators 220, 222, and 224. For example, when thetotal thickness of the insulators 220, 222, and 224 is small, a voltageis efficiently applied from the conductor 205, resulting in low powerconsumption of the transistor. The total thickness of the insulators220, 222, and 224 is less than or equal to 65 nm, preferably less thanor equal to 20 nm.

Thus, a transistor having a low leakage current in an off state can beprovided. A transistor with stable electrical characteristics can beprovided. A transistor having a high on-state current can be provided. Atransistor with a small subthreshold swing value can be provided. Ahighly reliable transistor can be provided.

The oxides 230 a, 230 b, and 230 c are each formed using a metal oxidesuch as In-M-Zn oxide (M is Al, Ga, Y, or Sn). An In—Ga oxide or anIn—Zn oxide may be used as the oxide 230.

Note that the oxide semiconductor described in the above embodiment canbe used as the oxide 230 b.

When the oxides 230 a and 230 b or the oxides 230 b and 230 c containthe same element (as a main component) in addition to oxygen, a mixedlayer with a low density of defect states can be formed. For example, inthe case where the oxide 230 b is an In—Ga—Zn oxide, it is preferable touse an In—Ga—Zn oxide, a Ga—Zn oxide, gallium oxide, or the like as eachof the oxides 230 a and 230 c.

At this time, the oxide 230 b serves as a main carrier path. Since thedensity of defect states at the interface between the oxides 230 a and230 b and the interface between the oxides 230 b and 230 c can be madelow, the influence of interface scattering on carrier conduction issmall, and high on-state current can be obtained.

When an electron is trapped in a trap state, the trapped electronbehaves like fixed charge; thus, the threshold voltage of the transistoris shifted in the positive direction. The oxides 230 a and 230 c canmake the trap state apart from the oxide 230 b. This structure canprevent the positive shift of the threshold voltage of the transistor.

A material whose conductivity is sufficiently lower than that of theoxide 230 b is used for the oxides 230 a and 230 c. In that case, theoxide 230 b, the interface between the oxides 230 b and 230 a, and theinterface between the oxides 230 b and 230 c mainly function as achannel region.

For example, in the case where an oxide in which the region A2 and theregion B2 in FIG. 5 form a composite is used as the oxide 230 b, it ispreferable to use an oxide with [M]/[In] of greater than or equal to 1,preferably greater than or equal to 2, as each of the oxides 230 a and230 c. In addition, it is preferable to use an oxide with sufficientlyhigh insulation performance and [M]/([Zn]+[In]) of greater than or equalto 1 as the oxide 230 c.

As the insulator 250, an insulator such as silicon oxide, siliconoxynitride, silicon nitride oxide, aluminum oxide, hafnium oxide,tantalum oxide, zirconium oxide, lead zirconate titanate (PZT),strontium titanate (SrTiO₃), or (Ba,Sr)TiO₃ (BST) can be used, forexample. The insulator may have a single-layer structure or astacked-layer structure. Alternatively, aluminum oxide, bismuth oxide,germanium oxide, niobium oxide, silicon oxide, titanium oxide, tungstenoxide, yttrium oxide, or zirconium oxide may be added to the insulator,for example. Alternatively, the insulator may be subjected to nitridingtreatment. Silicon oxide, silicon oxynitride, or silicon nitride may bestacked over the above insulator.

As the insulator 250, like the insulator 224, an oxide insulator thatcontains more oxygen than that in the stoichiometric composition ispreferably used. When such an insulator containing excess oxygen isprovided in contact with the oxide 230, oxygen vacancies in the oxide230 can be reduced.

As the insulator 250, an insulating film formed of aluminum oxide,aluminum oxynitride, gallium oxide, gallium oxynitride, yttrium oxide,yttrium oxynitride, hafnium oxide, hafnium oxynitride, silicon nitride,or the like, which has barrier properties against oxygen or hydrogen,can be used. The insulator 250 formed of such a material serves as alayer that prevents release of oxygen from the oxide 230 and entry of animpurity such as hydrogen from the outside.

Note that the insulator 250 may have a stacked-layer structure similarto that of the insulator 220, the insulator 222, and the insulator 224.When the insulator 250 includes an insulator in which a necessary amountof electrons are trapped by electron trap states, the threshold voltageof the transistor 200 can be shifted in the positive direction. Thetransistor 200 having the structure is a normally-off transistor whichis in a non-conduction state (also referred to as an off state) evenwhen the gate voltage is 0 V.

In addition to the insulator 250, a barrier film may be provided betweenthe oxide 230 and the conductor 260 in the transistor illustrated inFIGS. 12A to 12C. Alternatively, the oxide 230 c may have a barrierproperty.

For example, an insulating film containing excess oxygen is provided incontact with the oxide 230 and enclosed with a barrier film, whereby thecomposition of the oxide can be substantially the same as thestoichiometric composition or can be in a supersaturated statecontaining more oxygen than that in the stoichiometric composition. Itis also possible to prevent entry of impurities such as hydrogen intothe oxide 230.

One of the conductors 240 a and 240 b functions as a source electrode,and the other thereof functions as a drain electrode.

Any of metals such as aluminum, titanium, chromium, nickel, copper,yttrium, zirconium, molybdenum, silver, tantalum, and tungsten, or analloy containing any of the metals as its main component can be used foreach of the conductors 240 a and 240 b. In particular, a metal nitridefilm such as a tantalum nitride film is preferable because it has abarrier property against hydrogen or oxygen and has a high oxidationresistance.

Although a single-layer structure is shown in FIGS. 12A to 12C, astacked-layer structure of two or more layers may be used. For example,a tantalum nitride film and a tungsten film may be stacked.Alternatively, a titanium film and an aluminum film may be stacked.Other examples include a two-layer structure where an aluminum film isstacked over a tungsten film, a two-layer structure where a copper filmis stacked over a copper-magnesium-aluminum alloy film, a two-layerstructure where a copper film is stacked over a titanium film, and atwo-layer structure where a copper film is stacked over a tungsten film.

Other examples include a three-layer structure where a titanium film ora titanium nitride film is formed, an aluminum film or a copper film isstacked over the titanium film or the titanium nitride film, and atitanium film or a titanium nitride film is formed over the aluminumfilm or the copper film; and a three-layer structure where a molybdenumfilm or a molybdenum nitride film is formed, an aluminum film or acopper film is stacked over the molybdenum film or the molybdenumnitride film, and a molybdenum film or a molybdenum nitride film isformed over the aluminum film or the copper film. Note that atransparent conductive material containing indium oxide, tin oxide, orzinc oxide may be used.

The conductor 260 functioning as a gate electrode can be formed using,for example, a metal selected from aluminum, chromium, copper, tantalum,titanium, molybdenum, and tungsten, an alloy containing any of thesemetals as its component, an alloy containing any of these metals incombination, or the like. In particular, a metal nitride film such as atantalum nitride film is preferable because it has a barrier propertyagainst hydrogen or oxygen and has a high oxidation resistance.Furthermore, one or both of manganese and zirconium may be used.Alternatively, a semiconductor typified by polycrystalline silicon dopedwith an impurity element such as phosphorus, or a silicide such asnickel silicide may be used. Although a single-layer structure is shownin FIGS. 12A to 12C, a stacked-layer structure of two or more layers maybe used.

A two-layer structure where a titanium film is stacked over an aluminumfilm may be employed, for example. Other examples include a two-layerstructure where a titanium film is stacked over a titanium nitride film,a two-layer structure where a tungsten film is stacked over a titaniumnitride film, and a two-layer structure where a tungsten film is stackedover a tantalum nitride film or a tungsten nitride film.

Other examples include a three-layer structure where a titanium film isformed, an aluminum film is stacked over the titanium film, and atitanium film is formed over the aluminum film. Alternatively, an alloyfilm or a nitride film that contains aluminum and one or more elementsselected from titanium, tantalum, tungsten, molybdenum, chromium,neodymium, and scandium may be used.

The conductor 260 can also be formed using a light-transmittingconductive material such as indium tin oxide, indium oxide containingtungsten oxide, indium zinc oxide containing tungsten oxide, indiumoxide containing titanium oxide, indium tin oxide containing titaniumoxide, indium zinc oxide, or indium tin oxide to which silicon oxide isadded. The conductor 260 can have a stacked-layer structure using any ofthe above-described light-transmitting conductive materials and any ofthe above-described metals.

Next, the insulator 280 and the insulator 282 are provided over thetransistor 200.

The insulator 280 preferably includes an oxide containing oxygen inexcess of that in the stoichiometric composition. That is, in theinsulator 280, a region containing oxygen in excess of that in thestoichiometric composition (hereinafter also referred to asexcess-oxygen region) is preferably formed. In particular, in the caseof using an oxide semiconductor in the transistor 200, when an insulatorincluding an excess-oxygen region is provided in an interlayer film orthe like in the vicinity of the transistor 200, oxygen vacancies in thetransistor 200 are reduced, whereby the reliability can be improved.

As the insulator including the excess-oxygen region, specifically, anoxide material that releases part of oxygen by heating is preferablyused. An oxide that releases part of oxygen by heating is an oxide filmin which the amount of released oxygen converted into oxygen atoms isgreater than or equal to 1.0×10¹⁸ atoms/cm³, preferably greater than orequal to 3.0×10²⁰ atoms/cm³ in TDS analysis. Note that the temperatureof the film surface in the TDS analysis is preferably higher than orequal to 100° C. and lower than or equal to 700° C., or higher than orequal to 100° C. and lower than or equal to 500° C.

For example, as such a material, a material containing silicon oxide orsilicon oxynitride is preferably used. Alternatively, a metal oxide canbe used. Note that in this specification, “silicon oxynitride” refers toa material that contains oxygen at a higher proportion than nitrogen,and “silicon nitride oxide” refers to a material that contains nitrogenat a higher proportion than oxygen.

The insulator 280 that covers the transistor 200 may function as aplanarization film that covers a roughness thereunder.

The insulator 282 is preferably formed using an insulating film having abarrier property against oxygen or hydrogen, e.g., an aluminum oxidefilm or a hafnium oxide film. The insulator 282 formed of such amaterial functions as a layer which prevents release of oxygen from theoxide 230 and entry of an impurity such as hydrogen from the outside.

The above structure makes it possible to provide a transistor includingan oxide semiconductor with high on-state current. Alternatively, atransistor including an oxide semiconductor with low off-state currentcan be provided. Furthermore, when the transistor with the abovestructure is used in a semiconductor device, variation in the electricalcharacteristics of the semiconductor device can be reduced, and thereliability thereof can be improved. Alternatively, the powerconsumption of the semiconductor device can be reduced.

<Transistor Structure 2>

FIGS. 13A to 13C illustrate another example applicable to the transistor200. FIG. 13A illustrates a top surface of the transistor 200. Forsimplification of the drawing, some films are not illustrated in FIG.13A. FIG. 13B is a cross-sectional view taken along the dashed-dottedline X1-X2 in FIG. 13A, and FIG. 13C is a cross-sectional view takenalong the dashed-dotted line Y1-Y2 in FIG. 13A.

Note that in the transistor 200 illustrated in FIGS. 13A to 13C,components having the same functions as the components in the transistor200 in FIGS. 12A to 12C are denoted by the same reference numerals.

In the structure illustrated in FIGS. 13A to 13C, the conductor 260 hasa two-layer structure. For example, a conductor 260 a can be formedusing an oxide typified by an In—Ga—Zn oxide. An oxide semiconductortypified by an In—Ga—Zn oxide has an increased carrier density by beingsupplied with nitrogen or hydrogen. In other words, the oxidesemiconductor functions as an oxide conductor (OC). When a metal nitrideis provided as a conductor 260 b, the oxide semiconductor has a highercarrier density and thus, the conductor 260 a functions as a gateelectrode.

An oxide semiconductor typified by an In—Ga—Zn oxide can be used as theconductor 260 a. The conductor 260 a can also be formed using alight-transmitting conductive material such as indium tin oxide (ITO),indium oxide containing tungsten oxide, indium zinc oxide containingtungsten oxide, indium oxide containing titanium oxide, indium tin oxidecontaining titanium oxide, indium zinc oxide, or indium tin oxidecontaining silicon (also referred to as an In—Sn—Si oxide or ITSO).

The use of a metal nitride for the conductor 260 b produces either ofthe following effects: the resistance of the conductor 260 a is reducedby the diffusion of the constituent element (especially, nitrogen) ofthe metal nitride into the conductor 260 a; and the resistance isreduced by damage (e.g., sputtering damage) during the deposition of theconductor 260 b. Note that the conductor 260 b may have a stacked-layerstructure of two or more layers. For example, by stacking alow-resistance metal film over a metal nitride, a transistor driven by alow voltage can be provided.

Furthermore, the conductor 260 a is preferably formed by a sputteringmethod in an atmosphere containing an oxygen gas. In the case where theconductor 260 a is formed in an atmosphere containing an oxygen gas, anexcess-oxygen region can be formed in the insulator 250. Note that amethod for forming the conductor 260 a is not limited to a sputteringmethod, and other methods such as an ALD method may be used.

In the structure illustrated in FIGS. 13A to 13C, an insulator 270 isprovided to cover the conductor 260. In the case where the insulator 280is formed using an oxide material from which oxygen is released, theinsulator 270 is formed using a substance having a barrier propertyagainst oxygen. With this structure, oxygen vacancies in the conductor260 a are filled, which inhibits a reduction in carrier density andprevents oxidation of the conductor 260 b due to diffused oxygen.

For example, the insulator 270 can be formed using a metal oxide such asaluminum oxide. The insulator 270 is formed to a thickness with whichthe oxidation of the conductor 260 is prevented.

As shown in the drawings, a structure may be employed in which theinsulator 220 and the insulator 222 are not provided and the conductor205 c is provided using a conductor with a barrier property. With thisstructure, even when the insulator 224 includes an excess-oxygen region,the conductor 205 b can be inhibited from reacting with oxygen of theexcess-oxygen region and from generating an oxide.

Furthermore, an insulator 243 a and an insulator 243 b may be providedover the conductor 240 a and the conductor 240 b. The insulator 243 aand the insulator 243 b are formed using a substance having a barrierproperty against oxygen. With this structure, the conductor 240 a andthe conductor 240 b can be inhibited from being oxidized when the oxide230 c is deposited. Oxygen of the excess-oxygen region in the insulator280 can be prevented from reacting with the conductor 240 a and theconductor 240 b and from oxidizing them.

The insulator 243 a and the insulator 243 b can be formed using a metaloxide, for example. In particular, an insulating film having a barrierproperty against oxygen or hydrogen, e.g., an aluminum oxide film, ahafnium oxide film, or a gallium oxide film, is preferably used.Alternatively, silicon nitride deposited by a CVD method may be used.

Accordingly, the above structure allows expansion of the range ofchoices for the materials for the conductor 240 a, the conductor 240 b,the conductor 205, and the conductor 260. For example, the conductor 205b and the conductor 260 b can be formed using a material with a lowoxidation resistance and high conductivity, e.g., aluminum. Furthermore,a conductor that can be easily deposited or processed can be used, forexample.

In addition, the oxidation of the conductor 205 and the conductor 260can be prevented, and oxygen released from the insulator 224 and theinsulator 280 can be supplied to the oxide 230 efficiently. Furthermore,a conductor that has high conductivity is used for the conductor 205 andthe conductor 260, whereby the transistor 200 with low power consumptioncan be provided.

<Transistor Structure 3>

FIGS. 14A to 14C illustrate another example applicable to the transistor200. FIG. 14A illustrates a top surface of the transistor 200. Forsimplification of the drawing, some films are not illustrated in FIG.14A. FIG. 14B is a cross-sectional view taken along the dashed-dottedline X1-X2 in FIG. 14A, and FIG. 14C is a cross-sectional view takenalong the dashed-dotted line Y1-Y2 in FIG. 14A.

Note that in the transistor 200 illustrated in FIGS. 14A to 14C,components having the same functions as the components in the transistor200 in FIGS. 12A to 12C are denoted by the same reference numerals.

In the structure illustrated in FIGS. 14A to 14C, the conductor 260 hasa two-layer structure. In the two-layer structure, layers formed usingthe same material may be stacked. For example, the conductor 260 a isformed by a thermal CVD method, an MOCVD method, or an ALD method. Inparticular, the conductor 260 a is preferably formed by an ALD method.

By employing an ALD method or the like, damage to the insulator 250 atthe time of the deposition can be reduced. In addition, by employing anALD method or the like, the conductor 260 a capable of providing highstep coverage can be deposited. Thus, the transistor 200 having highreliability can be provided.

Next, the conductor 260 b is formed by a sputtering method. At thattime, since the conductor 260 a is provided over the insulator 250,damage caused during deposition of the conductor 260 b can be preventedfrom affecting the insulator 250. Since the deposition rate in asputtering method is higher than that in an ALD method, the productivitycan be improved with a high yield.

In the structure illustrated in FIGS. 14A to 14C, the insulator 270 isprovided to cover the conductor 260. In the case where the insulator 280is formed using an oxide material from which oxygen is released, theinsulator 270 is formed using a substance having a barrier propertyagainst oxygen. With this structure, oxygen vacancies in the conductor260 a are filled, which inhibits a reduction in carrier density andprevents oxidation of the conductor 260 b due to diffused oxygen.

For example, the insulator 270 can be formed using a metal oxide such asaluminum oxide. The insulator 270 is formed to a thickness with whichthe oxidation of the conductor 260 is prevented.

<Transistor Structure 4>

FIGS. 15A to 15C illustrate another example applicable to the transistor200. FIG. 15A illustrates a top surface of the transistor 200. Forsimplification of the drawing, some films are not illustrated in FIG.15A. FIG. 15B is a cross-sectional view taken along the dashed-dottedline X1-X2 in FIG. 15A, and FIG. 15C is a cross-sectional view takenalong the dashed-dotted line Y1-Y2 in FIG. 15A.

Note that in the transistor 200 illustrated in FIGS. 15A to 15C,components having the same functions as the components in the transistor200 in FIGS. 12A to 12C are denoted by the same reference numerals.

In the structure shown in FIGS. 15A to 15C, the conductor 260functioning as a gate electrode includes the conductor 260 a, theconductor 260 b, and a conductor 260 c. The oxide 230 c may be cut overthe insulator 224 as long as the oxide 230 c covers a side surface ofthe oxide 230 b.

In the structure illustrated in FIGS. 15A to 15C, the conductor 260 hasa three-layer structure. The conductor 260 may have a single-layerstructure, a two-layer structure, or a stacked-layer structure of fouror more layers. Note that in the case of the two-layer structure, layersformed using the same material may be stacked. For example, theconductor 260 a is formed by a thermal CVD method, an MOCVD method, oran ALD method. In particular, the conductor 260 a is preferably formedby an ALD method. By employing an ALD method or the like, damage to theinsulator 250 at the time of the deposition can be reduced. In addition,by employing an ALD method or the like, the conductor 260 a capable ofproviding high step coverage can be deposited. Thus, the transistor 200having high reliability can be provided.

Next, the conductor 260 b is formed by a sputtering method. At thattime, since the conductor 260 a is provided over the insulator 250,damage caused during deposition of the conductor 260 b can be preventedfrom affecting the insulator 250. Since the deposition rate in asputtering method is higher than that in an ALD method, the productivitycan be improved with a high yield.

The conductor 260 b is formed using a material having high conductivitysuch as tantalum, tungsten, copper, or aluminum. The conductor 260 cformed over the conductor 260 b is preferably formed using a conductorwith a high oxidation resistance, such as tungsten nitride.

For example, when the insulator 280 is formed using an oxide materialfrom which oxygen is released, the use of a conductor with a highoxidation resistance for the conductor 260 c, which is in contact withthe insulator 280 having an excess-oxygen region in a large area, caninhibit oxygen released from the excess-oxygen region from beingabsorbed by the conductor 260. In addition, the oxidation of theconductor 260 can be prevented, and oxygen released from the insulator280 can be supplied to the oxide 230 efficiently. Furthermore, aconductor that has high conductivity is used for the conductor 260 b,whereby the transistor 200 with low power consumption can be provided.

As illustrated in FIG. 15C, the oxide 230 b is covered with theconductor 260 in the channel width direction of the transistor 200. Theinsulator 224 has a projection, whereby the side surface of the oxide230 b is also covered with the conductor 260. For example, the bottomsurface of the conductor 260 in a region where the insulator 224 and theoxide 230 c are in contact with each other is preferably positionedcloser to the substrate than the bottom surface of the oxide 230 b byadjusting the shape of the projection of the insulator 224. In otherwords, the transistor 200 has a structure where the oxide 230 b can beelectrically surrounded by an electric field of the conductor 260. Astructure where the oxide 230 b is electrically surrounded by theelectric field of the conductor is referred to as a surrounded channel(s-channel) structure. In the transistor 200 with an s-channelstructure, the channel can be formed in the whole oxide 230 b (bulk). Inthe s-channel structure, the drain current of the transistor can beincreased, so that a larger amount of on-state current (current whichflows between the source and the drain when the transistor is turned on)can be obtained. Furthermore, the entire channel formation region of theoxide 230 b can be depleted by the electric field of the conductor 260.Accordingly, the off-state current of the s-channel transistor can befurther reduced. When the channel width is shortened, the effects of thes-channel structure, such as an increase in on-state current and areduction in off-state current, can be enhanced.

<Transistor Structure 5>

FIGS. 16A to 16C illustrate another example applicable to the transistor200. FIG. 16A illustrates a top surface of the transistor 200. Forsimplification of the drawing, some films are not illustrated in FIG.16A. FIG. 16B is a cross-sectional view taken along the dashed-dottedline X1-X2 in FIG. 16A, and FIG. 16C is a cross-sectional view takenalong the dashed-dotted line Y1-Y2 in FIG. 16A.

Note that in the transistor 200 illustrated in FIGS. 16A to 16C,components having the same functions as the components in the transistor200 in FIGS. 12A to 12C are denoted by the same reference numerals.

In the structure illustrated in FIGS. 16A to 16C, the conductorsfunctioning as the source and the drain each have a stacked-layeredstructure. It is preferable that a conductor which is highly adhesive tothe oxide 230 b be used as the conductors 240 a and 240 b, and amaterial with high conductivity be used as conductors 241 a and 241 b.The conductors 240 a and 240 b are preferably formed by an ALD method.The use of an ALD method or the like can improve the coverage.

For example, when a metal oxide including indium is used as the oxide230 b, titanium nitride or the like may be used as the conductors 240 aand 240 b. When a material with high conductivity, such as tantalum,tungsten, copper, or aluminum, is used as the conductors 241 a and 241b, the transistor 200 with high reliability and low power consumptioncan be provided.

As illustrated in FIG. 16C, the oxide 230 b is covered with theconductor 260 in the channel width direction of the transistor 200. Theinsulator 222 has a projection, whereby the side surface of the oxide230 b is also covered with the conductor 260.

Here, when a high-k material such as hafnium oxide is used for theinsulator 222, the equivalent oxide (SiO₂) thickness (EOT) of theinsulator 222 can be small because the insulator 222 has a high relativepermittivity. Accordingly, the distance between the conductor 205 andthe oxide 230 can be increased owing to the physical thickness of theinsulator 222, without a reduction in the influence of the electricfield which is applied from the conductor 205 to the oxide 230. Thus,the distance between the conductor 205 and the oxide 230 can be adjustedby changing the thickness of the insulator 222.

For example, the bottom surface of the conductor 260 in a region wherethe insulator 222 and the oxide 230 c are in contact with each other ispreferably positioned closer to the substrate than the bottom surface ofthe oxide 230 b by adjusting the shape of the projection of theinsulator 222. In other words, the transistor 200 has a structure wherethe oxide 230 b can be electrically surrounded by an electric field ofthe conductor 260. A structure where the oxide 230 b is electricallysurrounded by the electric field of the conductor is referred to as asurrounded channel (s-channel) structure. In the transistor 200 with ans-channel structure, the channel can be formed in the whole oxide 230 b(bulk). In the s-channel structure, the drain current of the transistorcan be increased, so that a larger amount of on-state current (currentwhich flows between the source and the drain when the transistor isturned on) can be obtained. Furthermore, the entire channel formationregion of the oxide 230 b can be depleted by the electric field of theconductor 260. Accordingly, the off-state current of the s-channeltransistor can be further reduced. When the channel width is shortened,the effects of the s-channel structure, such as an increase in on-statecurrent and a reduction in off-state current, can be enhanced.

<Transistor Structure 6>

FIGS. 17A to 17C illustrate another example applicable to the transistor200. FIG. 17A illustrates a top surface of the transistor 200. Forsimplification of the drawing, some films are not illustrated in FIG.17A. FIG. 17B is a cross-sectional view taken along the dashed-dottedline X1-X2 in FIG. 17A, and FIG. 17C is a cross-sectional view takenalong the dashed-dotted line Y1-Y2 in FIG. 17A.

Note that in the transistor 200 illustrated in FIGS. 17A to 17C,components having the same functions as the components in the transistor200 in FIGS. 12A to 12C are denoted by the same reference numerals.

In the transistor 200 illustrated in FIGS. 17A to 17C, the oxide 230 c,the insulator 250, and the conductor 260 are formed in an opening formedin the insulator 280. Furthermore, one end portion of each of theconductors 240 a and 240 b is aligned with an end portion of the openingformed in the insulator 280. Furthermore, three end portions of each ofthe conductors 240 a and 240 b are aligned with parts of end portions ofeach of the oxides 230 a and 230 b. Therefore, the conductors 240 a and240 b can be formed concurrently with the oxide 230 or the opening inthe insulator 280. Accordingly, the number of masks and steps can bereduced, and yield and productivity can be improved.

The conductor 240 a, the conductor 240 b, and the oxide 230 b are incontact with the insulator 280 having the excess-oxygen region with anoxide 230 d positioned therebetween. Thus, the oxide 230 d, which isprovided between the insulator 280 and the oxide 230 b including theregion where the channel is formed, can prevent impurities such ashydrogen, water, and halogen from diffusing from the insulator 280 intothe oxide 230 b.

Since the transistor 200 illustrated in FIGS. 17A to 17C has a structurein which the conductors 240 a and 240 b hardly overlap with theconductor 260, the parasitic capacitance generated between the conductor260 and the conductors 240 a and 240 b can be reduced. Thus, thetransistor 200 with a high operation frequency can be provided.

<Transistor Structure 7>

FIGS. 18A to 18C illustrate another example applicable to the transistor200. FIG. 18A illustrates a top surface of the transistor 200. Forsimplification of the drawing, some films are not illustrated in FIG.18A. FIG. 18B is a cross-sectional view taken along the dashed-dottedline X1-X2 in FIG. 18A, and FIG. 18C is a cross-sectional view takenalong the dashed-dotted line Y1-Y2 in FIG. 18A.

Note that in the transistor 200 illustrated in FIGS. 18A to 18C,components having the same functions as the components in the transistor200 in FIGS. 17A to 17C are denoted by the same reference numerals.

The transistor 200 illustrated in FIGS. 18A to 18C does not have theoxide 230 d. For example, when the conductor 240 a and the conductor 240b are formed using a conductor with a high oxidation resistance, theoxide 230 d is not necessarily provided. Accordingly, the number ofmasks and steps can be reduced, and yield and productivity can beimproved.

The insulator 224 may be provided in only the region overlapping withthe oxide 230 a and the oxide 230 b. In that case, the oxide 230 a, theoxide 230 b, and the insulator 224 can be processed using the insulator222 as an etching stopper. As a result, yield and productivity can beimproved.

Since the transistor 200 illustrated in FIGS. 18A to 18C has a structurein which the conductors 240 a and 240 b hardly overlap with theconductor 260, the parasitic capacitance generated between the conductor260 and the conductors 240 a and 240 b can be reduced. Thus, thetransistor 200 with a high operation frequency can be provided.

<Method for Manufacturing Transistor>

An example of a method for manufacturing the transistor illustrated inFIGS. 12A to 12C is described below with reference to FIGS. 19A to 19E,FIGS. 20A to 20D, FIGS. 21A to 21C, and FIGS. 22A to 22C.

First, a substrate is prepared (not illustrated). Although there is noparticular limitation on the substrate, it preferably has heatresistance high enough to withstand heat treatment performed later. Forexample, a glass substrate of barium borosilicate glass,aluminoborosilicate glass, or the like, a ceramic substrate, a quartzsubstrate, or a sapphire substrate can be used. Alternatively, a singlecrystal semiconductor substrate or a polycrystalline semiconductorsubstrate of silicon, silicon carbide, or the like; a compoundsemiconductor substrate of silicon germanium, gallium arsenide, indiumarsenide, or indium gallium arsenide; a silicon-on-insulator (SOI)substrate; a germanium-on-insulator (GOI) substrate; or the like can beused. Further alternatively, any of these substrates provided with asemiconductor element may be used as the substrate.

Further alternatively, a flexible substrate may be used as the substrateto manufacture the semiconductor device. To manufacture a flexiblesemiconductor device, a transistor may be directly formed over aflexible substrate; alternatively, a transistor may be formed over amanufacturing substrate and then separated from the manufacturingsubstrate and transferred to a flexible substrate. In order that thetransistor be separated from the manufacturing substrate to betransferred to the flexible substrate, it is preferable to provide aseparation layer between the manufacturing substrate and the transistorincluding an oxide semiconductor.

Next, an insulator 214 and an insulator 216 are formed. Then, a resistmask 290 is formed over the insulator 216 by a lithography process orthe like to remove unnecessary portions of the insulators 214 and 216(FIG. 19A). After that, the resist mask 290 is removed; thus, an openingcan be formed.

Here, a method for processing a film is described. To process a filmfinely, a variety of fine processing techniques can be used. Forexample, it is possible to use a method in which a resist mask formed bya lithography process or the like is subjected to slimming treatment.Alternatively, a dummy pattern is formed by a lithography process or thelike, the dummy pattern is provided with a sidewall and is then removed,and a film is etched using the remaining sidewall as a resist mask. Inorder to achieve a high aspect ratio, anisotropic dry etching ispreferably used for etching of a film. Alternatively, a hard mask formedof an inorganic film or a metal film may be used.

As light used to form the resist mask, light with an i-line (with awavelength of 365 nm), light with a g-line (with a wavelength of 436nm), light with an h-line (with a wavelength of 405 nm), or light inwhich the i-line, the g-line, and the h-line are mixed can be used.Alternatively, ultraviolet light, KrF laser light, ArF laser light, orthe like can be used. Exposure may be performed by liquid immersionexposure technique. As the light for the exposure, extreme ultra-violetlight (EUV) or X-rays may be used. Instead of the light for theexposure, an electron beam can be used. It is preferable to use extremeultra-violet light (EUV), X-rays, or an electron beam because extremelyminute processing can be performed. Note that in the case of performingexposure by scanning with a beam such as an electron beam, a photomaskis not needed.

An organic resin film having a function of improving the adhesionbetween a film and a resist film may be formed before the resist filmserving as a resist mask is formed. The organic resin film can be formedto planarize a surface by covering a step under the film by a spincoating method or the like, and thus can reduce variation in thicknessof the resist mask over the organic resin film. In the case of fineprocessing, in particular, a material serving as a film preventingreflection of light for the exposure is preferably used for the organicresin film. Examples of the organic resin film having such a functioninclude a bottom anti-reflection coating (BARC) film. The organic resinfilm may be removed at the same time as the removal of the resist maskor after the removal of the resist mask.

Next, a conductor 205A and a conductor 205B are deposited over theinsulator 214 and the insulator 216. The conductor 205A and theconductor 205B can be deposited by, for example, a sputtering method, anevaporation method, or a CVD method (including a thermal CVD method, anMOCVD method, a PECVD method, and the like). It is preferable to use athermal CVD method, an MOCVD method, or an ALD method in order to reduceplasma damage (FIG. 19B).

Then, unnecessary portions of the conductors 205A and 205B are removed.For example, part of the conductor 205A and part of the conductor 205Bare removed by etch-back process, a chemical mechanical polishing (CMP)process, or the like until the insulator 216 is exposed, whereby theconductor 205 is formed (FIG. 19C). At that time, the insulator 216 canbe used as a stopper layer, and the thickness of the insulator 216 isreduced in some cases.

The CMP process is a process for planarizing a surface of an object tobe processed by a combination of chemical and mechanical actions. Morespecifically, the CMP process is a process in which a polishing cloth isattached to a polishing stage, the polishing stage and the object to beprocessed are each rotated or swung while a slurry (an abrasive) issupplied between the object to be processed and the polishing cloth, andthe surface of the object to be processed is polished by chemicalreaction between the slurry and the surface of the object to beprocessed and by action of mechanical polishing between the object to beprocessed and the polishing cloth.

Note that the CMP process may be performed only once or a plurality oftimes. When the CMP process is performed a plurality of times, it ispreferable that first polishing be performed at a high polishing rateand final polishing be performed at a low polishing rate. In thismanner, polishing processes using different polishing rates may be usedin combination.

Then, the insulator 220, the insulator 222, and the insulator 224 areformed (FIG. 19D). Note that the insulator 220 and the insulator 222 arenot necessarily provided. For example, when the insulator 224 has anexcess-oxygen region, a conductor with a barrier property may be formedover the conductor 205. The conductor with a barrier property caninhibit the conductor 205 from reacting with oxygen in the excess-oxygenregion and from generating an oxide.

The insulators 220, 222, and 224 can each be formed using, for example,silicon oxide, silicon oxynitride, silicon nitride oxide, siliconnitride, aluminum oxide, aluminum oxynitride, aluminum nitride oxide,aluminum nitride, or the like. It is particularly preferable to use ahigh-k material such as hafnium oxide as the insulator 222.

The insulators 220, 222, and 224 can be formed using a sputteringmethod, a chemical vapor deposition (CVD) method (including a thermalCVD method, a metal organic CVD (MOCVD) method, a plasma-enhanced CVD(PECVD) method, and the like), a molecular beam epitaxy (MBE) method, anatomic layer deposition (ALD) method, a pulsed laser deposition (PLD)method, or the like. In particular, it is preferable that the insulatorsbe deposited by a CVD method, further preferably an ALD method or thelike, because coverage can be further improved. It is preferable to usea thermal CVD method, an MOCVD method, or an ALD method in order toreduce plasma damage. The insulators can also be formed using a siliconoxide film capable of providing high step coverage that is formed byreacting tetraethyl orthosilicate (TEOS), silane, or the like withoxygen, nitrous oxide, or the like.

Note that the insulators 220, 222, and 224 are preferably depositedsuccessively. By successive deposition, impurities do not attach to theinterfaces between the insulators 220 and 222 and between the insulators222 and 224, resulting in high reliability of the insulators.

Then, an oxide 230A to be the oxide 230 a and an oxide 230B to be theoxide 230 b are sequentially deposited. The oxides are preferablydeposited successively without exposure to the air.

Then, a conductive film 240A to be the conductors 240 a and 240 b isformed over the oxide 230A. As the conductive film 240A, a materialwhich has a barrier property against hydrogen or oxygen and has a highoxidation resistance is preferably used. Although the conductive film240A has a single-layer structure in the drawing, it may have astructure of two or more stacked layers. Then, a resist mask 292 isformed by a method similar to that described above (FIG. 19E).

An unnecessary portion of the conductive film 240A is removed by etchingusing the resist mask 292 to form a conductive layer 240B having anisland shape (FIG. 20A). After that, unnecessary portions of the oxides230A and 230B are removed by etching using the conductive layer 240B asa mask.

At that time, the insulator 224 may also be processed into anisland-shape. For example, even when the total thickness of theinsulators 220, 222, and 224 is small, the use of the insulator 222 witha barrier property as an etching stopper film can prevent over-etchingof the wiring layer positioned below the insulators. In addition, whenthe total thickness of the insulators 220, 222, and 224 is small, avoltage is efficiently applied from the conductor 205; therefore, thetransistor with low power consumption can be obtained.

Then, the resist mask is removed. Thus, a stacked-layer structure of theisland-shaped oxide 230 a, the island-shaped oxide 230 b, and theisland-shaped conductive layer 240B can be formed (FIG. 20B).

Next, heat treatment is preferably performed (arrows in FIG. 20C denotethe heat treatment). The heat treatment may be performed at atemperature higher than or equal to 250° C. and lower than or equal to400° C., preferably higher than or equal to 320° C. and lower than orequal to 380° C., in an inert gas atmosphere, in an atmospherecontaining an oxidizing gas at 10 ppm or more, or under reducedpressure. Alternatively, the heat treatment may be performed in such amanner that heat treatment is performed in an inert gas atmosphere, andthen another heat treatment is performed in an atmosphere containing anoxidization gas at 10 ppm or more, in order to compensate for releasedoxygen. The heat treatment can remove hydrogen that is an impurity forthe oxides 230 a and 230 b. In addition, oxygen is supplied from theinsulator formed below the oxide 230 a to the oxides 230 a and 230 b, sothat oxygen vacancies in the oxides can be reduced.

Next, a resist mask 294 is formed over the island-shaped conductivelayer 240B by a method similar to that described above (FIG. 20D). Then,an unnecessary portion of the conductive layer 240B is removed byetching, and then the resist mask 294 is removed, whereby the conductor240 a and the conductor 240 b are formed (FIG. 21A). At that time, partof the insulator 222 or the insulator 224 may be thinned by etching toobtain an s-channel structure.

Here, heat treatment may be performed. The heat treatment may beperformed under the conditions similar to those of the heat treatmentdescribed with reference to FIG. 20C. The heat treatment can removehydrogen that is an impurity for the oxides 230 a and 230 b. Inaddition, oxygen can be supplied from the insulator formed below theoxide 230 a to the oxides 230 a and 230 b, so that oxygen vacancies inthe oxides can be reduced. In the case where the heat treatment isperformed using an oxidizing gas, an oxidizing gas is in direct contactwith the region where the channel is formed, whereby oxygen vacanciesincluded in the region where the channel is formed can be reducedefficiently.

Next, the oxide 230 c is deposited. Here, heat treatment may beperformed (the arrows in FIG. 21B denote the heat treatment). The heattreatment may be performed under the conditions similar to those of theheat treatment described with reference to FIG. 21C. The heat treatmentcan remove hydrogen that is an impurity for the oxides 230 a and 230 b.In addition, oxygen can be supplied from the insulator formed below theoxide 230 a to the oxides 230 a and 230 b, so that oxygen vacancies inthe oxides can be reduced. In the case where the heat treatment isperformed using an oxidizing gas, an oxidizing gas is in direct contactwith the region where the channel is formed, whereby oxygen vacanciesincluded in the region where the channel is formed can be reducedefficiently.

The insulator 250 and a conductive film 260A to be the conductor 260 aresequentially deposited. As the conductive film 260A, a material whichhas a barrier property against hydrogen or oxygen and has a highoxidation resistance is preferably used. Although the conductive film260A has a single-layer structure in the drawing, it may have astructure of two or more stacked layers.

For example, the stacked two layers may be formed of the same material.A first conductive film is formed by a thermal CVD method, an MOCVDmethod, or an ALD method, for example. In particular, an ALD method ispreferably used. By employing an ALD method or the like, damage to theinsulator 250 at the time of the deposition can be reduced. In addition,by employing an ALD method or the like, the conductive film 260A capableof providing high step coverage can be deposited. Thus, the transistor200 having high reliability can be provided.

Then, a second conductive film is formed by a sputtering method. At thattime, since the first conductive film is provided over the insulator250, damage caused during deposition of the second conductive film canbe prevented from affecting the insulator 250. Since the deposition ratein a sputtering method is higher than that in an ALD method, theproductivity can be improved with a high yield. Note that it ispreferable to use a deposition gas which does not contain chlorine indeposition of the conductive film 260A.

Next, a resist mask 296 is formed over the conductive film 260A by amethod similar to that described above (FIG. 21C). Then, an unnecessaryportion of the conductive film 260A is removed by etching to form theconductor 260. After that, the resist mask 296 is removed (FIG. 22A).

Subsequently, the insulator 280 is formed over the conductor 260. Theinsulator 280 is an insulator containing oxygen, such as a silicon oxidefilm or a silicon oxynitride film. As the insulator containing excessoxygen, a silicon oxide film or a silicon oxynitride film containing alarge amount of oxygen can be formed by a CVD method or a sputteringmethod under the conditions that are set as appropriate. After thesilicon oxide film or the silicon oxynitride film is formed, oxygen maybe added by an ion implantation method, an ion doping method, or plasmatreatment.

In particular, oxygen plasma treatment is preferably performed (arrowsin FIG. 22B denote the plasma treatment). In typical oxygen plasmatreatment, the surface of an oxide semiconductor is processed byradicals generated from an oxygen gas by glow discharge plasma. However,as a gas from which plasma is generated, a mixed gas of an oxygen gasand a rare gas may be used, as well as oxygen. For example, oxygenplasma treatment may be performed at a temperature higher than or equalto 250° C. and lower than or equal to 400° C., preferably higher than orequal to 300° C. and lower than or equal to 400° C., in an atmospherecontaining an oxidizing gas or under reduced pressure.

The oxygen plasma treatment dehydrates or dehydrogenates the insulator280 and the oxide 230 and introduces excess oxygen to the insulator 280;as a result, an excess-oxygen region can be formed. In addition, oxygenvacancies are generated in the dehydrated or dehydrogenated oxide 230and the resistance of the oxide 230 is reduced. Meanwhile, the excessoxygen of the insulator 280 fills oxygen vacancies of the oxide 230.Therefore, owing to the oxygen plasma treatment, hydrogen and water thatserve as impurities can be removed from the insulator 280 while anexcess-oxygen region is formed in the insulator 280. In addition,hydrogen and water that serve as impurities can be removed from theoxide 230 while oxygen vacancies in the oxide 230 are filled. Thus, theelectrical characteristics of the transistor 200 can be improved andvariation in the electrical characteristics thereof can be reduced.

Then, the insulator 282 is formed over the insulator 280 (FIG. 22C). Theinsulator 282 is preferably formed with a sputtering apparatus. By usinga sputtering method, an excess-oxygen region can be formed easily in theinsulator 280 positioned under the insulator 282.

During deposition by a sputtering method, ions and sputtered particlesexist between a target and a substrate. For example, a potential E₀ issupplied to the target, to which a power source is connected. Apotential E₁ such as a ground potential is supplied to the substrate.Note that the substrate may be electrically floating. In addition, thereis a region at a potential E₂ between the target and the substrate. Thepotential relationship is E₂>E₁>E₀.

The ions in plasma are accelerated by a potential difference (E₂−E₀) andcollide with the target; accordingly, sputtered particles are ejectedfrom the target. These sputtered particles attach to a depositionsurface and deposited thereover; as a result, a film is formed. Someions recoil by the target and might be taken, as recoil ions, into theinsulator 280 positioned below the formed film, through the formed film.The ions in the plasma are accelerated by a potential difference (E₂−E₁)and collide with the deposition surface. At that time, some ions reachthe inside of the insulator 280. The ions are taken into the insulator280; accordingly, a region into which the ions are taken is formed inthe insulator 280. That is, an excess-oxygen region is formed in theinsulator 280 in the case where the ions include oxygen.

Introduction of excess oxygen to the insulator 280 can form anexcess-oxygen region. The excess oxygen in the insulator 280 is suppliedto the oxide 230 and can fill oxygen vacancies in the oxide 230. Here,in the case where a conductor with a high oxidation resistance is usedas each of the conductors 240 a and 240 b and the conductor 260 incontact with the insulator 280, excess oxygen in the insulator 280 isnot absorbed by the conductor 260 and the conductors 240 a and 240 b butcan be efficiently supplied to the oxide 230. Thus, the electricalcharacteristics of the transistor 200 can be improved and variation inthe electrical characteristics thereof can be reduced.

Through the above steps, the transistor 200 of one embodiment of thepresent invention can be manufactured.

The structures, the methods, and the like described in this embodimentcan be combined as appropriate with any of the structures, the methods,and the like described in the other embodiments and examples.

Embodiment 4

In this embodiment, one embodiment of a semiconductor device isdescribed with reference to FIGS. 23 to 28 , FIGS. 29A and 29B, FIGS.30A and 30B, FIGS. 31A and 31B, FIGS. 32A and 32B, and FIG. 33 .

Structure Example

Examples of a semiconductor device (a memory device) of one embodimentof the present invention are shown in FIGS. 23 to 28 , FIGS. 29A and29B, and FIGS. 30A and 30B. Note that FIG. 30A is a circuit diagram ofFIGS. 23 to 26 . FIGS. 29A and 29B show end portions of regions wheresemiconductor devices shown in FIGS. 23 to 26 are formed.

<Circuit Configuration of Semiconductor Device>

Semiconductor devices shown in FIG. 30A and FIGS. 23 to 28 each includea transistor 300, a transistor 200, and a capacitor 100.

The transistor 200 is a transistor in which a channel is formed in asemiconductor layer including an oxide semiconductor. Since theoff-state current of the transistor 200 is low, by using the transistor200 in a semiconductor device (a memory device), stored data can beretained for a long time. In other words, such a semiconductor device (amemory device) does not require refresh operation or has an extremelylow frequency of the refresh operation, which leads to a sufficientreduction in power consumption.

In FIG. 30A, a wiring 3001 is electrically connected to a source of thetransistor 300. A wiring 3002 is electrically connected to a drain ofthe transistor 300. A wiring 3003 is electrically connected to one of asource and a drain of the transistor 200. A wiring 3004 is electricallyconnected to a gate of the transistor 200. A gate of the transistor 300and the other of the source and the drain of the transistor 200 areelectrically connected to one electrode of the capacitor 100. A wiring3005 is electrically connected to the other electrode of the capacitor100.

The semiconductor device in FIG. 30A has a feature that the potential ofthe gate of the transistor 300 can be retained, and thus enableswriting, retaining, and reading of data as follows.

Writing and retaining of data will be described. First, the potential ofthe wiring 3004 is set to a potential at which the transistor 200 isturned on, so that the transistor 200 is turned on. Accordingly, thepotential of the wiring 3003 is supplied to a node FG where the gate ofthe transistor 300 and the one electrode of the capacitor 100 areelectrically connected to each other. That is, a predetermined charge issupplied to the gate of the transistor 300 (writing). Here, one of twokinds of charges providing different potential levels (hereinafterreferred to as a low-level charge and a high-level charge) is supplied.After that, the potential of the wiring 3004 is set to a potential atwhich the transistor 200 is turned off, so that the transistor 200 isturned off Thus, the charge is retained at the node FG (retaining).

In the case where the off-state current of the transistor 200 is low,the charge of the node FG is retained for a long time.

Next, reading of data is described. An appropriate potential (a readingpotential) is supplied to the wiring 3005 while a predeterminedpotential (a constant potential) is supplied to the wiring 3001, wherebythe potential of the wiring 3002 varies depending on the amount ofcharge retained in the node FG. This is because in the case of using ann-channel transistor as the transistor 300, an apparent thresholdvoltage V_(th_H) at the time when the high-level charge is given to thegate of the transistor 300 is lower than an apparent threshold voltageV_(th_L) at the time when the low-level charge is given to the gate ofthe transistor 300. Here, an apparent threshold voltage refers to thepotential of the wiring 3005 which is needed to make the transistor 300be in “on state.” Thus, the potential of the wiring 3005 is set to apotential V₀ which is between V_(th_H) and V_(th_L), whereby chargesupplied to the node FG can be determined. For example, in the casewhere the high-level charge is supplied to the node FG in writing andthe potential of the wiring 3005 is V₀ (>V_(th_H)), the transistor 300is brought into “on state.” On the other hand, in the case where thelow-level charge is supplied to the node FG in writing, even when thepotential of the wiring 3005 is V₀ (<V_(th_L)), the transistor 300remains in “off state.” Thus, the data retained in the node FG can beread by determining the potential of the wiring 3002.

By arranging semiconductor devices each having the structure illustratedin FIG. 30A in a matrix, a memory device (a memory cell array) can beformed.

Note that in the case where memory cells are arrayed, it is necessarythat data of a desired memory cell is read in read operation. Forexample, when a p-channel transistor is used as the transistor 300, thememory cell has a NOR-type structure. Thus, only data of a desiredmemory cell can be read by supplying a potential at which the transistor300 is in “off state” regardless of the charge supplied to the node FG,that is, a potential lower than V_(th_H) to the wiring 3005 of memorycells from which data is not read. Alternatively, when an n-channeltransistor is used as the transistor 300, the memory cell has aNAND-type structure. Thus, only data of a desired memory cell can beread by supplying a potential at which the transistor 300 is in “onstate” regardless of the charge supplied to the node FG, that is, apotential higher than V_(th_L) to the wiring 3005 of memory cells fromwhich data is not read.

<Circuit Configuration 2 of Semiconductor Device>

A semiconductor device in FIG. 30B is different from the semiconductordevice in FIG. 30A in that the transistor 300 is not provided. Also inthis case, data can be written and retained in a manner similar to thatof the semiconductor device in FIG. 30A.

Reading of data in the semiconductor device in FIG. 30B is described.When the transistor 200 is brought into an on state, the wiring 3003which is in a floating state and the capacitor 100 are electricallyconnected to each other, and the charge is redistributed between thewiring 3003 and the capacitor 100. As a result, the potential of thewiring 3003 is changed. The amount of change in the potential of thewiring 3003 varies depending on the potential of the one electrode ofthe capacitor 100 (or the charge accumulated in the capacitor 100).

For example, the potential of the wiring 3003 after the chargeredistribution is (C_(B)×V_(B0)+C×V)/(C_(B)+C), where V is the potentialof the one electrode of the capacitor 100, C is the capacitance of thecapacitor 100, C_(B) is the capacitance component of the wiring 3003,and V_(B0) is the potential of the wiring 3003 before the chargeredistribution. Thus, it can be found that, assuming that the memorycell is in either of two states in which the potential of the oneelectrode of the capacitor 100 is V₁ and V₀ (V₁>V₀), the potential ofthe wiring 3003 in the case of retaining the potential V₁(=(C_(B)×V_(B0)+C×V₁)/(C_(B)+C)) is higher than the potential of thewiring 3003 in the case of retaining the potential V₀(=(C_(B)×V_(B0)+C×V₀)/(C_(B)+C)).

Then, by comparing the potential of the wiring 3003 with a predeterminedpotential, data can be read.

In the case of employing the configuration, a transistor using siliconmay be used for a driver circuit for driving a memory cell, and atransistor using an oxide semiconductor may be stacked as the transistor200 over the driver circuit.

When including a transistor using an oxide semiconductor and having alow off-state current, the semiconductor device described above canretain stored data for a long time. In other words, refresh operationbecomes unnecessary or the frequency of the refresh operation can beextremely low, which leads to a sufficient reduction in powerconsumption. Moreover, stored data can be retained for a long time evenwhen power is not supplied (note that a potential is preferably fixed).

Furthermore, in the semiconductor device, high voltage is not needed forwriting data and deterioration of elements is less likely to occur.Unlike in a conventional nonvolatile memory, for example, it is notnecessary to inject and extract electrons into and from a floating gate;thus, a problem such as deterioration of an insulator is not caused.That is, unlike a conventional nonvolatile memory, the semiconductordevice of one embodiment of the present invention does not have a limiton the number of times data can be rewritten, and the reliabilitythereof is drastically improved. Furthermore, data is written dependingon the state of the transistor (on or off), whereby high-speed operationcan be achieved.

<Structure 1 of Semiconductor Device>

The semiconductor device of one embodiment of the present inventionincludes the transistor 300, the transistor 200, and the capacitor 100as shown in FIG. 23 . The transistor 200 is provided above thetransistor 300, and the capacitor 100 is provided above the transistor300 and the transistor 200.

The transistor 300 is provided over a substrate 311 and includes aconductor 316, an insulator 314, a semiconductor region 312 that is apart of the substrate 311, and low-resistance regions 318 a and 318 bfunctioning as a source region and a drain region.

The transistor 300 may be a p-channel transistor or an n-channeltransistor.

It is preferable that a region of the semiconductor region 312 where achannel is formed, a region in the vicinity thereof, the low-resistanceregions 318 a and 318 b functioning as a source region and a drainregion, and the like contain a semiconductor such as a silicon-basedsemiconductor, more preferably single crystal silicon. Alternatively, amaterial including germanium (Ge), silicon germanium (SiGe), galliumarsenide (GaAs), gallium aluminum arsenide (GaAlAs), or the like may becontained. Silicon whose effective mass is controlled by applying stressto the crystal lattice and thereby changing the lattice spacing may becontained. Alternatively, the transistor 300 may be ahigh-electron-mobility transistor (HEMT) with GaAs and GaAlAs, or thelike.

The low-resistance regions 318 a and 318 b contain an element whichimparts n-type conductivity, such as arsenic or phosphorus, or anelement which imparts p-type conductivity, such as boron, in addition toa semiconductor material used for the semiconductor region 312.

The conductor 316 functioning as a gate electrode can be formed using asemiconductor material such as silicon containing the element whichimparts n-type conductivity, such as arsenic or phosphorus, or theelement which imparts p-type conductivity, such as boron, or aconductive material such as a metal material, an alloy material, or ametal oxide material.

Note that a work function of a conductor is determined by a material ofthe conductor, whereby the threshold voltage can be adjusted.Specifically, it is preferable to use titanium nitride, tantalumnitride, or the like as the conductor. Furthermore, in order to ensurethe conductivity and embeddability of the conductor, it is preferable touse a stacked layer of metal materials such as tungsten and aluminum asthe conductor. In particular, tungsten is preferable in terms of heatresistance.

Note that the transistor 300 shown in FIG. 23 is just an example and isnot limited to the structure shown therein; an appropriate transistormay be used in accordance with a circuit configuration or a drivingmethod. In the case of using the circuit configuration shown in FIG.30B, the transistor 300 may be omitted.

An insulator 320, an insulator 322, an insulator 324, and an insulator326 are stacked sequentially so as to cover the transistor 300.

The insulator 320, the insulator 322, the insulator 324, and theinsulator 326 can be formed using, for example, silicon oxide, siliconoxynitride, silicon nitride oxide, silicon nitride, aluminum oxide,aluminum oxynitride, aluminum nitride oxide, aluminum nitride, or thelike.

The insulator 322 may function as a planarization film for eliminating alevel difference caused by the transistor 300 or the like underlying theinsulator 322. For example, a top surface of the insulator 322 may beplanarized by planarization treatment using a chemical mechanicalpolishing (CMP) method or the like to increase the level of planarity.

The insulator 324 is preferably formed using a film having a barrierproperty that prevents impurities such as hydrogen from diffusing fromthe substrate 311, the transistor 300, or the like into a region wherethe transistor 200 is formed. The barrier property herein refers to ahigh oxidation resistance and a function of inhibiting the diffusion ofoxygen and impurities typified by hydrogen, and water. For example, thediffusion length of oxygen or hydrogen in a film with a barrier propertyin an atmosphere at 350° C. or 400° C. is less than or equal to 50 nmper hour. The diffusion length of oxygen or hydrogen in the film with abarrier property at 350° C. or at 400° C. is preferably less than orequal to 30 nm per hour, further preferably less than or equal to 20 nmper hour.

As an example of the film having a barrier property against hydrogen,silicon nitride formed by a CVD method can be given. Diffusion ofhydrogen into a semiconductor element including an oxide semiconductor,such as the transistor 200, degrades the characteristics of thesemiconductor element in some cases. Therefore, a film that preventshydrogen diffusion is preferably provided between the transistor 200 andthe transistor 300. Specifically, the film that prevents hydrogendiffusion is a film from which hydrogen is less likely to be released.

The amount of released hydrogen can be measured by thermal desorptionspectroscopy (TDS), for example. The amount of hydrogen released fromthe insulator 324 that is converted into hydrogen atoms per unit area ofthe insulator 324 is less than or equal to 10×10¹⁵ atoms/cm², preferablyless than or equal to 5×10¹⁵ atoms/cm² in TDS analysis in the range of50° C. to 500° C., for example.

Note that the permittivity of the insulator 326 is preferably lower thanthat of the insulator 324. For example, the relative permittivity of theinsulator 324 is preferably lower than 4, more preferably lower than 3.For example, the relative permittivity of the insulator 326 ispreferably 0.7 times or less that of the insulator 324, more preferably0.6 times or less that of the insulator 324. In the case where amaterial with a low permittivity is used as an interlayer film, theparasitic capacitance between wirings can be reduced.

A conductor 328, a conductor 330, and the like that are electricallyconnected to the capacitor 100 or the transistor 200 are embedded in theinsulator 320, the insulator 322, the insulator 324, and the insulator326. Note that the conductor 328 and the conductor 330 each function asa plug or a wiring. Note that a plurality of structures of conductorsfunctioning as plugs or wirings are collectively denoted by the samereference numeral in some cases, as described later. Furthermore, inthis specification and the like, a wiring and a plug electricallyconnected to the wiring may be a single component. That is, there arecases where a part of a conductor functions as a wiring and a part of aconductor functions as a plug.

As a material of each of plugs and wirings (e.g., the conductor 328 andthe conductor 330), a conductive material such as a metal material, analloy material, a metal nitride material, or a metal oxide material canbe used in a single-layer structure or a stacked-layer structure. It ispreferable to use a high-melting-point material that has both heatresistance and conductivity, such as tungsten or molybdenum, and it isparticularly preferable to use tungsten. Alternatively, a low-resistanceconductive material such as aluminum or copper is preferably used. Theuse of a low-resistance conductive material can reduce wiringresistance.

A wiring layer may be provided over the insulator 326 and the conductor330. For example, in FIG. 23 , an insulator 350, an insulator 352, andan insulator 354 are stacked sequentially. Furthermore, a conductor 356is formed in the insulator 350, the insulator 352, and the insulator354. The conductor 356 functions as a plug or a wiring. Note that theconductor 356 can be formed using a material similar to that used forforming the conductor 328 and the conductor 330.

Note that for example, the insulator 350 is preferably formed using aninsulator having a barrier property against hydrogen, like the insulator324. Furthermore, the conductor 356 preferably includes a conductorhaving a barrier property against hydrogen. The conductor having abarrier property against hydrogen is formed particularly in an openingin the insulator 350 having a barrier property against hydrogen. In sucha structure, the transistor 300 and the transistor 200 can be separatedby a barrier layer, so that diffusion of hydrogen from the transistor300 into the transistor 200 can be prevented.

Note that as the conductor having a barrier property against hydrogen,tantalum nitride may be used, for example. By stacking tantalum nitrideand tungsten, which has high conductivity, diffusion of hydrogen fromthe transistor 300 can be prevented while the conductivity of a wiringis ensured. In this case, a tantalum nitride layer having a barrierproperty against hydrogen is preferably in contact with the insulator350 having a barrier property against hydrogen.

An insulator 358, an insulator 210, an insulator 212, an insulator 213,an insulator 214, and an insulator 216 are stacked sequentially over theinsulator 354. A material having a barrier property against oxygen orhydrogen is preferably used for any of the insulators 358, 210, 212,213, 214, and 216.

The insulators 358 and 212 are preferably formed using, for example, afilm having a barrier property that prevents impurities such as hydrogenfrom diffusing from the substrate 311, a region where the transistor 300is formed, or the like into a region where the transistor 200 is formed.Therefore, the insulators 358 and 212 can be formed using a materialsimilar to that used for forming the insulator 324.

As an example of the film having a barrier property against hydrogen,silicon nitride formed by a CVD method can be given. Diffusion ofhydrogen into a semiconductor element including an oxide semiconductor,such as the transistor 200, degrades the characteristics of thesemiconductor element in some cases. Therefore, a film that preventshydrogen diffusion is preferably provided between the transistor 200 andthe transistor 300. Specifically, the film that prevents hydrogendiffusion is a film from which hydrogen is less likely to be released.

As the film having a barrier property against hydrogen, for example, aseach of the insulators 213 and 214, a metal oxide such as aluminumoxide, hafnium oxide, or tantalum oxide is preferably used.

In particular, aluminum oxide has an excellent blocking effect thatprevents permeation of oxygen and impurities such as hydrogen andmoisture which cause a change in electrical characteristics of thetransistor. Accordingly, the use of aluminum oxide can prevent entry ofimpurities such as hydrogen and moisture into the transistor 200 in andafter a manufacturing process of the transistor. In addition, release ofoxygen from the oxide in the transistor 200 can be prevented. Therefore,aluminum oxide is suitably used as a protective film for the transistor200.

For example, the insulators 210 and 216 can be formed using a materialsimilar to that used for forming the insulator 320. In the case where amaterial with a relatively low permittivity is used as an interlayerfilm, the parasitic capacitance between wirings can be reduced. Forexample, a silicon oxide film, a silicon oxynitride film, or the likecan be used as the insulator 216.

A conductor 218, a conductor (the conductor 205) included in thetransistor 200, and the like are embedded in the insulators 358, 210,212, 213, 214, and 216. Note that the conductor 218 functions as a plugor a wiring that is electrically connected to the capacitor 100 or thetransistor 300. The conductor 218 can be formed using a material similarto that used for forming the conductor 328 and the conductor 330.

In particular, the conductor 218 in a region in contact with theinsulators 358, 212, 213, and 214 is preferably a conductor having abarrier property against oxygen, hydrogen, and water. In such astructure, the transistor 300 and the transistor 200 can be completelyseparated by a layer having a barrier property against oxygen, hydrogen,and water, so that diffusion of hydrogen from the transistor 300 intothe transistor 200 can be prevented.

For example, when the insulator 224 includes an excess-oxygen region,the conductor in contact with the insulator 224, such as the conductor218, is preferably a conductor with a high oxidation resistance. Asshown in the drawing, a conductor 219 with a barrier property may beprovided over the conductor 218 and the conductor (the conductor 205)included in the transistor 200. With this structure, it is possible toinhibit the conductor 218 and the conductor (the conductor 205) includedin the transistor 200 from reacting with oxygen of the excess-oxygenregion and from generating an oxide.

The transistor 200 is provided over the insulator 224. Note that any ofthe transistor structures described in the above-described embodimentcan be used as the structure of the transistor 200. The transistor 200shown in FIG. 23 is just an example and is not limited to the structureshown therein; an appropriate transistor may be used in accordance witha circuit configuration or a driving method.

The insulator 280 is provided over the transistor 200. In the insulator280, an excess-oxygen region is preferably formed. In particular, in thecase of using an oxide semiconductor in the transistor 200, when aninsulator including an excess-oxygen region is provided in an interlayerfilm or the like in the vicinity of the transistor 200, oxygen vacanciesin the transistor 200 are reduced, whereby the reliability can beimproved.

As the insulator including the excess-oxygen region, specifically, anoxide material that releases part of oxygen by heating is preferablyused. An oxide that releases part of oxygen by heating is an oxide filmin which the amount of released oxygen converted into oxygen atoms isgreater than or equal to 1.0×10¹⁸ atoms/cm³, preferably greater than orequal to 3.0×10²⁰ atoms/cm³ in TDS analysis. Note that the temperatureof the film surface in the TDS analysis is preferably higher than orequal to 100° C. and lower than or equal to 700° C., or higher than orequal to 100° C. and lower than or equal to 500° C.

For example, as such a material, a material containing silicon oxide orsilicon oxynitride is preferably used. Alternatively, a metal oxide canbe used. Note that in this specification, “silicon oxynitride” refers toa material that contains oxygen at a higher proportion than nitrogen,and “silicon nitride oxide” refers to a material that contains nitrogenat a higher proportion than oxygen.

The insulator 280 that covers the transistor 200 may function as aplanarization film that covers a roughness thereunder. A conductor 244and the like are embedded in the insulator 280.

The conductor 244 functions as a plug or a wiring that is electricallyconnected to the capacitor 100, the transistor 200, or the transistor300. The conductor 244 can be formed using a material similar to thatused for forming the conductor 328 and the conductor 330.

For example, when the conductor 244 is formed to have a stacked-layerstructure, the conductor 244 preferably includes a conductor that isunlikely to be oxidized (that has a high oxidation resistance). Inparticular, a conductor with a high oxidation resistance is preferablyprovided in a region in contact with the insulator 280 including theexcess-oxygen region. Such a structure can prevent the conductor 244from absorbing excess oxygen from the insulator 280. Furthermore, theconductor 244 preferably includes a conductor having a barrier propertyagainst hydrogen. In particular, a conductor having a barrier propertyagainst an impurity such as hydrogen is provided in a region in contactwith the insulator 280 including the excess-oxygen region, wherebydiffusion of the impurity of the conductor 244, diffusion of part of theconductor 244, and diffusion of an impurity from the outside through theconductor 244 can be prevented.

A conductor 246, a conductor 124, a conductor 112 a, and a conductor 112b may be provided over the conductor 244. The conductor 246 and theconductor 124 function as a plug or a wiring that is electricallyconnected to the capacitor 100, the transistor 200, or the transistor300. The conductor 112 a and the conductor 112 b function as anelectrode of the capacitor 100. The conductor 246 and the conductor 112a can be formed at the same time. The conductor 124 and the conductor112 b can be formed at the same time.

For the conductor 246, the conductor 124, the conductor 112 a, and theconductor 112 b, a metal film containing an element selected frommolybdenum, titanium, tantalum, tungsten, aluminum, copper, chromium,neodymium, and scandium; a metal nitride film containing any of theabove elements as its component (e.g., a tantalum nitride film, atitanium nitride film, a molybdenum nitride film, or a tungsten nitridefilm); or the like can be used. Alternatively, a conductive materialsuch as indium tin oxide, indium oxide containing tungsten oxide, indiumzinc oxide containing tungsten oxide, indium oxide containing titaniumoxide, indium tin oxide containing titanium oxide, indium zinc oxide, orindium tin oxide to which silicon oxide is added can also be used.

It is particularly preferable to use a metal nitride film such as atantalum nitride film for the conductor 246 and the conductor 112 abecause such a metal nitride film has a barrier property againsthydrogen or oxygen and is not easily oxidized (has a high oxidationresistance). Meanwhile, the conductor 124 and the conductor 112 b arepreferably formed by stacking a material with high conductivity such astungsten. The use of the combination of the materials can preventdiffusion of hydrogen into the insulator 280 and the transistor 200while the conductivity of the wiring is ensured. A two-layer structureof the conductor 246 and the conductor 124 is shown in FIG. 23 , but thestructure is not limited thereto, and a single-layer structure or astacked-layer structure of three or more layers may be used. Forexample, between a conductor having a barrier property and a conductorwith high conductivity, a conductor which is highly adhesive to theconductor having a barrier property and the conductor with highconductivity may be formed.

Furthermore, a barrier layer 281 may be provided over the conductor 124.With the barrier layer 281, the conductor 124 can be inhibited frombeing oxidized in a later step. In addition, diffusion of impuritiescontained in the conductor 124 and diffusion of part of the conductor124 can be inhibited. Impurities can be inhibited from penetrating theconductor 124, the conductor 246, and the conductor 244 to be diffusedinto the insulator 280.

Note that the barrier layer 281 can be formed using an insulatingmaterial. In that case, the barrier layer 281 may function as part ofthe dielectric of the capacitor 100. The barrier layer 281 may be formedusing a conductive material. In that case, the barrier layer 281 mayfunction as part of a wiring or an electrode.

A metal oxide such as aluminum oxide, hafnium oxide, or tantalum oxide,a metal nitride such as tantalum nitride, or the like is preferably usedfor the barrier layer 281. In particular, aluminum oxide has anexcellent blocking effect that prevents permeation of oxygen andimpurities such as hydrogen and moisture which cause a change inelectrical characteristics of the transistor. Accordingly, the use ofaluminum oxide can prevent entry of the conductor 124 and impuritiessuch as hydrogen and moisture into the transistor 200 in and after amanufacturing process of the semiconductor device.

The insulator 282 is provided over the barrier layer 281 and theinsulator 280. A material having a barrier property against oxygen orhydrogen is preferably used for the insulator 282. Thus, the insulator282 can be formed using a material similar to that used for forming theinsulator 214. As the insulator 282, a metal oxide such as aluminumoxide, hafnium oxide, or tantalum oxide is preferably used, for example.

In particular, aluminum oxide has an excellent blocking effect thatprevents permeation of oxygen and impurities such as hydrogen andmoisture which cause a change in electrical characteristics of thetransistor. Accordingly, the use of aluminum oxide can prevent entry ofimpurities such as hydrogen and moisture into the transistor 200 in andafter a manufacturing process of the transistor. In addition, release ofoxygen from the oxide in the transistor 200 can be prevented. Therefore,aluminum oxide is suitably used as a protective film for the transistor200.

Therefore, the transistor 200 and the insulator 280 including theexcess-oxygen region can be positioned between a stacked-layer structureof the insulators 212, 213, and 214 and the insulator 282. Theinsulators 212, 213, 214, and 282 each have a barrier property thatprevents diffusion of oxygen or impurities such as hydrogen and water.

Oxygen released from the insulator 280 and the transistor 200 can beprevented from diffusing into the layer where the capacitor 100 isformed or the layer where the transistor 300 is formed. Furthermore,impurities such as hydrogen and water can be prevented from diffusingfrom a layer above the insulator 282 and a layer below the insulator 214into the transistor 200.

That is, oxygen can be efficiently supplied from the excess-oxygenregion of the insulator 280 to the oxide where the channel is formed inthe transistor 200, so that oxygen vacancies can be reduced. Moreover,oxygen vacancies can be prevented from being formed by impurities in theoxide where the channel is formed in the transistor 200. Thus, the oxidewhere the channel is formed in the transistor 200 can be an oxidesemiconductor with a low density of defect states and stablecharacteristics. That is, a change in electrical characteristics of thetransistor 200 can be prevented and the reliability can be improved.

Here, a dicing line (also referred to as a scribe line, a dividing line,or a cutting line) that is provided when a large-sized substrate isdivided into semiconductor elements so that a plurality of semiconductordevices are each formed in a chip form will be described. In an exampleof a dividing method, for example, a groove (a dicing line) forseparating the semiconductor elements is formed on the substrate andthen, the substrate is cut along the dicing line so that a plurality ofsemiconductor devices that are separated are obtained. FIGS. 29A and 29Bare each a cross-sectional view of the vicinity of a dicing line.

For example, as illustrated in FIG. 29A, an opening is provided in theinsulators 212, 213, 214, 216, 224, and 280 in the vicinity of a regionoverlapping with the dicing line (shown by a dashed-dotted line in FIG.29A) formed in an edge of a memory cell including the transistor 200. Inaddition, the insulator 282 is provided to cover the side surfaces ofthe insulators 212, 213, 214, 216, 224, and 280.

Here, when the barrier layer 281 has an insulating property, theinsulator 282 is preferably provided in the opening with the barrierlayer 281 positioned between the insulator 282 and the inner surface ofthe opening. Diffusion of impurities can be more inhibited owing to thebarrier layer 281.

Thus, in the opening, the insulators 212, 213, and 214 are in contactwith the barrier layer 281. At that time, at least one of the insulators212, 213, and 214 is formed using the same material and method as thoseused for forming the insulator 282, whereby adhesion therebetween can beimproved. Note that the barrier layer 281 and the insulator 282 arepreferably formed using the same material. Aluminum oxide can be used,for example. When the barrier layer 281 is formed by a method by which adense film can be formed, e.g., an ALD method, and then the insulator282 is formed by a method with a high deposition rate such as asputtering method, high productivity and a high barrier property can beachieved.

In the structure, the insulator 280 and the transistor 200 can beenclosed with the insulators 212, 213, 214, and 282. Since theinsulators 212, 213, 214, and 282 each have a function of preventingdiffusion of oxygen, hydrogen, and water, entry and diffusion ofimpurities such as hydrogen or water from the direction of the sidesurface of the divided substrate into the transistor 200 can beprevented even when the substrate is divided into circuit regions eachof which is provided with the semiconductor element in this embodimentto form a plurality of chips.

Furthermore, in the structure, excess oxygen in the insulator 280 can beprevented from diffusing into the outside of the insulators 282 and 214.Accordingly, excess oxygen in the insulator 280 is efficiently suppliedto the oxide where the channel is formed in the transistor 200. Theoxygen can reduce oxygen vacancies in the oxide where the channel isformed in the transistor 200. Thus, the oxide where the channel isformed in the transistor 200 can be an oxide semiconductor with a lowdensity of defect states and stable characteristics. That is, a changein electrical characteristics of the transistor 200 can be prevented andthe reliability can be improved.

As another example, as illustrated in FIG. 29B, openings may be providedin the insulators 212, 213, 214, 216, 224, and 280 on both sides of thedicing line (shown by the dashed-dotted line in FIG. 29B). Although thenumber of the openings in the drawing is two, a plurality of openingsmay be provided as needed.

Since the insulators 212, 213, and 214 are in contact with the barrierlayer 281 in at least two regions in the openings provided on both sidesof the dicing line, higher adhesion is obtained. Note that also in thatcase, when at least one of the insulators 212, 213, and 214 is formedusing the same material and method as those used for forming theinsulator 282, the adhesion therebetween can be improved.

Since the plurality of openings are provided, the insulator 282 can bein contact with the insulators 212, 213, and 214 in a plurality ofregions. Therefore, impurities that enter from the dicing line can beprevented from reaching the transistor 200.

In such a structure, the transistor 200 and the insulator 280 can besealed tightly. Thus, the oxide where the channel is formed in thetransistor 200 can be an oxide semiconductor with a low density ofdefect states and stable characteristics. That is, a change inelectrical characteristics of the transistor 200 can be prevented andthe reliability can be improved.

The capacitor 100 is provided above the transistor 200. The capacitor100 includes a conductor 112 (the conductor 112 a and the conductor 112b), the barrier layer 281, the insulator 282, an insulator 130, and aconductor 116.

The conductor 112 functions as the electrode of the capacitor 100. Forexample, in the structure in FIG. 23 , part of the conductor 244functioning as a plug or a wiring that is connected to the transistor200 and the transistor 300 functions as the conductor 112. Note thatwhen the barrier layer 281 has conductivity, the barrier layer 281functions as part of the electrode of the capacitor 100. When thebarrier layer 281 has an insulating property, the barrier layer 281functions as part of the dielectric of the capacitor 100.

Such a structure can increase the productivity owing to a reduction ofthe number of steps in the process as compared to the case where theelectrode and the wiring are formed separately.

A region of the insulator 282 which is located between the conductor 112and the conductor 116 functions as a dielectric. For example, the use ofa high dielectric constant (high-k) material, such as aluminum oxide,for the insulator 282 can ensure a sufficient capacitance of thecapacitor 100.

The insulator 130 may be provided as part of the dielectric. Theinsulator 130 can be formed to have a single-layer structure or astacked-layer structure using, for example, silicon oxide, siliconoxynitride, silicon nitride oxide, silicon nitride, aluminum oxide,aluminum oxynitride, aluminum nitride oxide, aluminum nitride, hafniumoxide, hafnium oxynitride, hafnium nitride oxide, hafnium nitride, orthe like.

For example, in the case where a high dielectric constant (high-k)material, such as aluminum oxide, is used for the insulator 282, amaterial with high dielectric strength, such as silicon oxynitride, ispreferably used for the insulator 130. In the capacitor 100 having thestructure, the dielectric strength can be increased and theelectrostatic breakdown of the capacitor 100 can be prevented because ofthe insulator 130.

The conductor 116 is provided so as to cover the top and side surfacesof the conductor 112 with the barrier layer 281, the insulator 282, andthe insulator 130 located therebetween. In the structure where the sidesurfaces of the conductor 112 are wrapped by the conductor 116 with theinsulators located therebetween, capacitance is also formed on the sidesurfaces of the conductor 112, resulting in an increase in thecapacitance per unit projected area of the capacitor. Thus, thesemiconductor device can be reduced in area, highly integrated, andminiaturized.

Note that the conductor 116 can be formed using a conductive materialsuch as a metal material, an alloy material, or a metal oxide material.It is preferable to use a high-melting-point material which has bothheat resistance and conductivity, such as tungsten or molybdenum, and itis particularly preferable to use tungsten. In the case where theconductor 116 is formed concurrently with another component such as aconductor, Cu (copper), Al (aluminum), or the like which is alow-resistance metal material may be used.

An insulator 150 is provided over the conductor 116 and the insulator130. The insulator 150 can be formed using a material similar to thatused for forming the insulator 320. The insulator 150 may function as aplanarization film that covers roughness due to underlying layers.

The above is the description of the structure example. With the use ofthe structure, a change in electrical characteristics can be preventedand reliability can be improved in a semiconductor device including atransistor including an oxide semiconductor. A transistor including anoxide semiconductor with high on-state current can be provided. Atransistor including an oxide semiconductor with low off-state currentcan be provided. A semiconductor device with low power consumption canbe provided.

Modification Example 1

In a modification example of this embodiment, the conductor 244 and thebarrier layer 281 may be formed as illustrated in FIG. 24 . In otherwords, the conductor 244 serving as a plug or a wiring and the conductor112 serving as part of the electrode of the capacitor 100 may beembedded in the insulator 280, and the barrier layer 281 may be formedusing a conductor or an insulator with a barrier property over theconductor 244. In that case, the barrier layer 281 is preferably formedusing a conductor with not only a high barrier property but also a highoxidation resistance. Since part of the conductor 244 functions as theelectrode (the conductor 112) of the capacitor in this structure, aseparate conductor does not need to be provided.

Thus, as illustrated in FIG. 24 , the capacitor 100 includes theconductor 112 that is a region of the conductor 244, the insulator 282,the insulator 130, and the conductor 116.

The conductor 112 functioning as the electrode of the capacitor 100 canbe formed concurrently with the conductor 244. Such a structure canincrease the productivity. Furthermore, the number of steps in theprocess can be reduced because a mask for forming the electrode of thecapacitor is not needed.

The insulator 220, the insulator 222, and the insulator 224 are stackedin this order over the insulator 216. A material having a barrierproperty against oxygen or hydrogen is preferably used for any of theinsulators 220, 222, and 224. Note that the insulator 220, the insulator222, and the insulator 224 function as part (a gate insulator) of thetransistor 200 in some cases.

The insulator 224 preferably includes an oxide containing oxygen inexcess of that in the stoichiometric composition. That is, in theinsulator 224, a region containing oxygen in excess of that in thestoichiometric composition (hereinafter also referred to asexcess-oxygen region) is preferably formed. In particular, in the caseof using an oxide semiconductor in the transistor 200, when an insulatorincluding an excess-oxygen region is provided in a base film or the likein the vicinity of the transistor 200, oxygen vacancies in thetransistor 200 are reduced, whereby the reliability can be improved.

As the insulator including the excess-oxygen region, specifically, anoxide material that releases part of oxygen by heating is preferablyused. An oxide that releases part of oxygen by heating is an oxide filmin which the amount of released oxygen converted into oxygen atoms isgreater than or equal to 1.0×10¹⁸ atoms/cm³, preferably greater than orequal to 3.0×10²⁰ atoms/cm³ in TDS analysis. Note that the temperatureof the film surface in the TDS analysis is preferably higher than orequal to 100° C. and lower than or equal to 700° C., or higher than orequal to 100° C. and lower than or equal to 500° C.

For example, as such a material, a material containing silicon oxide orsilicon oxynitride is preferably used. Alternatively, a metal oxide canbe used. Note that in this specification, “silicon oxynitride” refers toa material that contains oxygen at a higher proportion than nitrogen,and “silicon nitride oxide” refers to a material that contains nitrogenat a higher proportion than oxygen.

Furthermore, when the insulator 224 includes an excess-oxygen region,the insulator 222 or the insulator 220 preferably has a barrier propertyagainst oxygen, hydrogen, and water. When the insulator 222 or theinsulator 220 has a barrier property against oxygen, oxygen in theexcess-oxygen region is not diffused to the transistor 300 side butsupplied to the oxide 230 of the transistor 200 efficiently. Theconductor 218 and the conductor (the conductor 205) included in thetransistor 200 can be inhibited from reacting with oxygen of theexcess-oxygen region and from generating an oxide.

The above is the description of the modification example. With the useof the structure, a change in electrical characteristics can beprevented and reliability can be improved in a semiconductor deviceincluding a transistor including an oxide semiconductor. A transistorincluding an oxide semiconductor with high on-state current can beprovided. A transistor including an oxide semiconductor with lowoff-state current can be provided. A semiconductor device with low powerconsumption can be provided.

Modification Example 2

In a modification example of this embodiment, the conductor 219, theconductor 244, and the conductor 246 with a barrier property may beformed as illustrated in FIG. 25 . In other words, the conductor 244serving as a plug or a wiring may be embedded in the insulator 280, andthe conductor 246 with a barrier property may be formed over theconductor 244. In that case, the conductor 246 is preferably formedusing a conductor with not only a high barrier property but also a highoxidation resistance. With this structure, the conductor 246 and theconductor 112 serving as the electrode of the capacitor can be formed atthe same time. In addition, since the conductor 246 also functions as abarrier layer in this structure, a separate barrier layer does not needto be provided.

Thus, as illustrated in FIG. 25 , the capacitor 100 includes theconductor 112, the insulator 282, the insulator 130, and the conductor116. The conductor 112 functioning as the electrode of the capacitor 100can be formed concurrently with the conductor 246.

The above is the description of the modification example. With the useof the structure, a change in electrical characteristics can beprevented and reliability can be improved in a semiconductor deviceincluding a transistor including an oxide semiconductor. A transistorincluding an oxide semiconductor with high on-state current can beprovided. A transistor including an oxide semiconductor with lowoff-state current can be provided. A semiconductor device with low powerconsumption can be provided.

Modification Example 3

In a modification example of this embodiment, the capacitor 100 asillustrated in FIG. 26 may be provided. That is, the conductor 244serving as a plug or a wiring is embedded in the insulator 280, thebarrier layer 281 with a barrier property is provided over the conductor244, and then the insulator 282 with a barrier property and an insulator284 are provided. After that, an insulator 286 with high planarity isformed over the insulator 284, whereby the capacitor 100 can be providedover the insulator 286 with high planarity.

The capacitor 100 is provided over the insulator 286 and includes theconductor 112 (the conductor 112 a and the conductor 112 b), theinsulator 130, an insulator 132, an insulator 134, and the conductor116. Note that the conductor 124 functions as a plug or a wiring that iselectrically connected to the capacitor 100, the transistor 200, or thetransistor 300.

The conductor 112 can be formed using a conductive material such as ametal material, an alloy material, or a metal oxide material. It ispreferable to use a high-melting-point material which has both heatresistance and conductivity, such as tungsten or molybdenum, and it isparticularly preferable to use tungsten. In the case where the conductor112 is formed concurrently with another component such as a conductor,Cu (copper), Al (aluminum), or the like which is a low-resistance metalmaterial may be used.

The insulators 130, 132, and 134 are provided over the conductor 112.The insulators 130, 132, and 134 can each be formed using, for example,silicon oxide, silicon oxynitride, silicon nitride oxide, siliconnitride, aluminum oxide, aluminum oxynitride, aluminum nitride oxide,aluminum nitride, hafnium oxide, hafnium oxynitride, hafnium nitrideoxide, hafnium nitride, or the like. Although the three-layer structureis illustrated in the drawing, a single-layer structure, a stacked-layerstructure of two layers, or a stacked-layer structure of four or morelayers may be employed.

For example, a material with high dielectric strength, such as siliconoxynitride, is preferably used for the insulators 130 and 134, and ahigh dielectric constant (high-k) material, such as aluminum oxide, ispreferably used for the insulator 132. In the capacitor 100 having thestructure, a sufficient capacitance can be provided because of the highdielectric constant (high-k) insulator, and the dielectric strength canbe increased and the electrostatic breakdown of the capacitor 100 can beprevented because of the insulator with high dielectric strength.

The conductor 116 is provided over the conductor 112 with the insulators130, 132, and 134 positioned therebetween. Note that the conductor 116can be formed using a conductive material such as a metal material, analloy material, or a metal oxide material. It is preferable to use ahigh-melting-point material which has both heat resistance andconductivity, such as tungsten or molybdenum, and it is particularlypreferable to use tungsten. In the case where the conductor 116 isformed concurrently with another component such as a conductor, Cu(copper), Al (aluminum), or the like which is a low-resistance metalmaterial may be used.

Note that when the conductor 112, which functions as one electrode,includes a projecting structure body like the conductor 112 b, thecapacitance of the capacitor per projected area can be increased. Thus,the semiconductor device can be reduced in area, highly integrated, andminiaturized.

The above is the description of the structure example. With the use ofthe structure, a change in electrical characteristics can be preventedand reliability can be improved in a semiconductor device including atransistor including an oxide semiconductor. A transistor including anoxide semiconductor with high on-state current can be provided. Atransistor including an oxide semiconductor with low off-state currentcan be provided. A semiconductor device with low power consumption canbe provided.

Modification Example 4

FIG. 27 illustrates another modification example of this embodiment.FIG. 27 is different from FIG. 23 in the structures of the transistors300 and 200.

In the transistor 300 illustrated in FIG. 27 , the semiconductor region312 (part of the substrate 311) in which the channel is formed has aprojecting shape. Furthermore, the conductor 316 is provided to covertop and side surfaces of the semiconductor region 312 with the insulator314 positioned therebetween. Note that the conductor 316 may be formedusing a material for adjusting the work function. The transistor 300having such a structure is also referred to as a FIN transistor becausethe projection of the semiconductor substrate is utilized. An insulatorserving as a mask for forming the projection may be provided in contactwith a top surface of the projection. Although the case where theprojection is formed by processing part of the semiconductor substrateis described here, a semiconductor film having a projection may beformed by processing an SOI substrate.

Details of the structure of the transistor 200 in FIG. 27 are describedin the above embodiment. An oxide, a gate insulator, and a conductorserving as a gate are formed in an opening formed in the insulator 280.Thus, it is preferable to form the conductor 246 with a barrier propertyat least over the conductor serving as a gate.

In the case where the conductor 112 (the conductor 246) has astacked-layer structure of a conductor having a barrier property againstoxygen, hydrogen, or water (e.g., tantalum nitride) and a conductorhaving high conductivity (e.g., tungsten or copper), the conductorhaving high conductivity (e.g., tungsten or copper) is completely sealedwith tantalum nitride and the barrier layer 281. Thus, not onlydiffusion of the conductor itself (e.g., copper) but also entry ofimpurities from above the insulator 282 through the conductor 244 can beprevented.

Note that the capacitor 100 is provided above the transistor 200. In thestructure in FIG. 27 , the capacitor 100 includes the conductor 112, theconductor 246 having a barrier property, the insulator 282, theinsulator 130, and the conductor 116.

The conductor 112 functions as the electrode of the capacitor 100. Forexample, in the structure in FIG. 27 , part of the conductor 244functioning as a plug or a wiring that is connected to the transistor200 and the transistor 300 functions as the conductor 112. Note thatwhen the barrier layer 281 has conductivity, the barrier layer 281functions as part of the electrode of the capacitor 100. When thebarrier layer 281 has an insulating property, the barrier layer 281functions as a dielectric of the capacitor 100.

Such a structure can increase the productivity owing to a reduction ofthe number of steps in the process as compared to the case where theelectrode and the wiring are formed separately.

The above is the description of the modification example. With the useof the structure, a change in electrical characteristics can beprevented and reliability can be improved in a semiconductor deviceincluding a transistor including an oxide semiconductor. A transistorincluding an oxide semiconductor with high on-state current can beprovided. A transistor including an oxide semiconductor with lowoff-state current can be provided. A semiconductor device with low powerconsumption can be provided.

Modification Example 5

FIG. 28 illustrates another modification example of this embodiment.FIG. 28 is different from FIG. 26 in the structure of the transistor200.

As illustrated in FIG. 28 , an insulator 279 and a barrier layer 271 maybe provided. The insulator 279 can be formed using a material and amethod similar to those used for forming the insulator 280. That is,like the insulator 280, the insulator 279 preferably includes an oxidecontaining oxygen in excess of that in the stoichiometric composition.Thus, the insulator 279 is an insulator containing oxygen, such as asilicon oxide film or a silicon oxynitride film. As the insulatorcontaining excess oxygen, a silicon oxide film or a silicon oxynitridefilm containing a large amount of oxygen can be formed by a CVD methodor a sputtering method under the conditions that are set as appropriate.After an insulator to be the insulator 279 is formed, planarizationtreatment using a CMP method or the like may be performed to improve theplanarity of a top surface of the insulator. To form an excess-oxygenregion in the insulator 279, for example, oxygen may be added by an ionimplantation method, an ion doping method, or plasma treatment.

The barrier layer 271 is formed using an insulator or a conductor havinga barrier property against oxygen. The barrier layer 271 can be formedusing, for example, aluminum oxide, hafnium oxide, tantalum oxide,tantalum nitride, or the like by a sputtering method or an atomic layerdeposition (ALD) method.

The insulator 280 is provided over the insulator 279 and the barrierlayer 271. In the case where treatment for making an oxygen-excess stateis performed on the insulator 280, excess oxygen which is introduced isdiffused not only into the insulator 280 but also into the insulator 279when the insulator 280 is formed using the same material and method asthose used for forming the insulator 279. To form an excess-oxygenregion in the insulator 280 and the insulator 279, for example, oxygenmay be added to the insulator 280 by an ion implantation method, an iondoping method, or plasma treatment.

The above is the description of the modification example. With the useof the structure, a change in electrical characteristics can beprevented and reliability can be improved in a semiconductor deviceincluding a transistor including an oxide semiconductor. A transistorincluding an oxide semiconductor with high on-state current can beprovided. A transistor including an oxide semiconductor with lowoff-state current can be provided. A semiconductor device with low powerconsumption can be provided.

Modification Example 6

FIGS. 31A and 31B illustrate another modification example of thisembodiment. FIGS. 31A and 31B are cross-sectional views of thetransistor 200 in the channel length direction and in the channel widthdirection, respectively, with the dashed dotted line A1-A2 serving as anaxis.

As illustrated in FIGS. 31A and 31B, the transistor 200 and theinsulator 280 including the excess-oxygen region may be enclosed with astacked-layer structure of the insulators 212 and 214 and astacked-layer structure of the insulators 282 and 284. At that time, ina region between the transistor 200 and a through electrode whichconnects the transistor 300 and the capacitor 100, the stacked-layerstructure of the insulators 212 and 214 is preferably in contact withthe stacked-layer structure of the insulators 282 and 284.

Thus, oxygen released from the insulator 280 and the transistor 200 canbe prevented from diffusing into the layer where the capacitor 100 isformed or the layer where the transistor 300 is formed. Furthermore,impurities such as hydrogen and water can be prevented from diffusingfrom a layer above the insulator 282 and a layer below the insulator 214into the transistor 200.

That is, oxygen can be efficiently supplied from the excess-oxygenregion of the insulator 280 to the oxide where the channel is formed inthe transistor 200, so that oxygen vacancies can be reduced. Moreover,oxygen vacancies can be prevented from being formed by impurities in theoxide where the channel is formed in the transistor 200. Thus, the oxidewhere the channel is formed in the transistor 200 can be an oxidesemiconductor with a low density of defect states and stablecharacteristics. That is, a change in electrical characteristics of thetransistor 200 can be prevented and the reliability can be improved.

Modification Example 7

FIGS. 32A and 32B illustrate another modification example of thisembodiment. FIG. 32A is a circuit diagram which shows part of a row inwhich the semiconductor devices each of which is illustrated in FIG. 30Aare arranged in a matrix. FIG. 32B is a cross-sectional view of thesemiconductor devices which corresponds to FIG. 32A.

In FIGS. 32A and 32B, the semiconductor device which includes thetransistor 300, the transistor 200, and the capacitor 100; thesemiconductor which includes a transistor 301, a transistor 201, and acapacitor 101; and the semiconductor device which includes a transistor302, a transistor 202, and a capacitor 102 are arranged in the same row.

As illustrated in FIG. 32B, a plurality of transistors (the transistors200 and 201 in the drawing) and the insulator 280 including anexcess-oxygen region may be enclosed with the stacked-layer structure ofthe insulators 212 and 214 and the stacked-layer structure of theinsulators 282 and 284. At that time, a structure in which theinsulators 212 and 214 and the insulators 282 and 284 are stacked ispreferably formed between the transistor 200, 201, or 202 and a throughelectrode which connects the transistor 300, 301, or 302 and thecapacitor 100, 101, or 102.

Thus, oxygen released from the insulator 280 and the transistor 200 canbe prevented from diffusing into the layer where the capacitor 100 isformed or the layer where the transistor 300 is formed. Furthermore,impurities such as hydrogen and water can be prevented from diffusingfrom a layer above the insulator 282 and a layer below the insulator 214into the transistor 200.

That is, oxygen can be efficiently supplied from the excess-oxygenregion of the insulator 280 to the oxide where the channel is formed inthe transistor 200, so that oxygen vacancies can be reduced. Moreover,oxygen vacancies can be prevented from being formed by impurities in theoxide where the channel is formed in the transistor 200. Thus, the oxidewhere the channel is formed in the transistor 200 can be an oxidesemiconductor with a low density of defect states and stablecharacteristics. That is, a change in electrical characteristics of thetransistor 200 can be prevented and the reliability can be improved.

Modification Example 8

FIG. 33 illustrates another modification example of this embodiment.FIG. 33 is a cross-sectional view of the semiconductor devicesillustrated in FIGS. 32A and 32B in which the transistor 201 and thetransistor 202 are integrated.

As illustrated in FIG. 33 , the conductor serving as the sourceelectrode or the drain electrode of the transistor 201 may have afunction of the conductor 112 serving as one electrode of the capacitor101. At that time, a region in which the oxide of the transistor 201 andthe insulator serving as the gate insulator of the transistor 201 extendover the conductor serving as the source or drain electrode of thetransistor 201 functions as the insulator of the capacitor 101.Therefore, the conductor 116 serving as the other electrode of thecapacitor 101 may be stacked over the conductor 240 a with the insulator250 and the oxide 230 c positioned therebetween. This structure can leadto a reduction in area, higher integration, and miniaturization of thesemiconductor device.

The transistor 201 and the transistor 202 may overlap with each other.This structure can lead to a reduction in area, higher integration, andminiaturization of the semiconductor device.

A plurality of transistors (the transistors 201 and 202 in the drawing)and the insulator 280 including an excess-oxygen region may be enclosedwith the stacked-layer structure of the insulators 212 and 214 and thestacked-layer structure of the insulators 282 and 284. At that time, astructure in which the insulators 212 and 214 and the insulators 282 and284 are stacked is preferably formed between the transistor 200, 201, or202 and a through electrode which connects the transistor 300, 301, or302 and the capacitor 100, 101, or 102.

Thus, oxygen released from the insulator 280 and the transistor 200 canbe prevented from diffusing into the layer where the capacitor 100 isformed or the layer where the transistor 300 is formed. Furthermore,impurities such as hydrogen and water can be prevented from diffusingfrom a layer above the insulator 282 and a layer below the insulator 214into the transistor 200.

That is, oxygen can be efficiently supplied from the excess-oxygenregion of the insulator 280 to the oxide where the channel is formed inthe transistor 200, so that oxygen vacancies can be reduced. Moreover,oxygen vacancies can be prevented from being formed by impurities in theoxide where the channel is formed in the transistor 200. Thus, the oxidewhere the channel is formed in the transistor 200 can be an oxidesemiconductor with a low density of defect states and stablecharacteristics. That is, a change in electrical characteristics of thetransistor 200 can be prevented and the reliability can be improved.

At least part of this embodiment can be implemented in combination withany of the other embodiments described in this specification asappropriate.

Embodiment 5

In this embodiment, an example of a circuit of a semiconductor deviceincluding the transistor of one embodiment of the present invention orthe like will be described.

<Circuit>

Examples of a circuit of a semiconductor device including the transistoror the like of one embodiment of the present invention will be describedwith reference to FIGS. 34 and 35 .

<Memory Device 1>

The semiconductor device in FIG. 34 is different from the semiconductordevice described in the above embodiment in that a transistor 3400 and awiring 3006 are included.

Also in this case, data can be written and retained in a manner similarto that of the semiconductor device described in the above embodiment. Atransistor similar to the transistor 300 described above can be used asthe transistor 3400.

The wiring 3006 is electrically connected to a gate of the transistor3400, one of a source and a drain of the transistor 3400 is electricallyconnected to a drain of the transistor 300, and the other of the sourceand the drain of the transistor 3400 is electrically connected to thewiring 3003.

<Memory Device 2>

A modification example of the semiconductor device (memory device) isdescribed with reference to a circuit diagram in FIG. 35 .

The semiconductor device illustrated in FIG. 35 includes transistors4100, 4200, 4300, and 4400 and capacitors 4500 and 4600. Here, atransistor similar to the above-described transistor 300 can be used asthe transistor 4100, and transistors similar to the above-describedtransistor 200 can be used as the transistors 4200 to 4400. Capacitorssimilar to the above-described capacitor 100 can be used as thecapacitors 4500 and 4600. Although not illustrated in FIG. 35 , aplurality of the semiconductor devices in FIG. 35 are provided in amatrix. The semiconductor device in FIG. 35 can control writing andreading of a data voltage in accordance with a signal or a potentialsupplied to a wiring 4001, a wiring 4003, and wirings 4005 to 4009.

One of a source and a drain of the transistor 4100 is connected to thewiring 4003. The other of the source and the drain of the transistor4100 is connected to the wiring 4001. Although the transistor 4100 is ap-channel transistor in FIG. 35 , the transistor 4100 may be ann-channel transistor.

The semiconductor device in FIG. 35 includes two data retentionportions. For example, a first data retention portion retains a chargebetween one of a source and a drain of the transistor 4400, oneelectrode of the capacitor 4600, and one of a source and a drain of thetransistor 4200 which are connected to a node FG1. A second dataretention portion retains a charge between a gate of the transistor4100, the other of the source and the drain of the transistor 4200, oneof a source and a drain of the transistor 4300, and one electrode of thecapacitor 4500 which are connected to a node FG2.

The other of the source and the drain of the transistor 4300 isconnected to the wiring 4003. The other of the source and the drain ofthe transistor 4400 is connected to the wiring 4001. A gate of thetransistor 4400 is connected to the wiring 4005. A gate of thetransistor 4200 is connected to the wiring 4006. A gate of thetransistor 4300 is connected to the wiring 4007. The other electrode ofthe capacitor 4600 is connected to the wiring 4008. The other electrodeof the capacitor 4500 is connected to the wiring 4009.

The transistors 4200, 4300, and 4400 each function as a switch forcontrol of writing a data voltage and retaining a charge. Note that, aseach of the transistors 4200, 4300, and 4400, it is preferable to use atransistor having a low current that flows between a source and a drainin an off state (low off-state current). As an example of the transistorwith a low off-state current, a transistor including an oxidesemiconductor in its channel formation region (an OS transistor) ispreferably used. Some advantages of an OS transistor are that it has alow off-state current and can be manufactured to overlap with atransistor including silicon, for example. Although the transistors4200, 4300, and 4400 are n-channel transistors in FIG. 35 , thetransistors 4200, 4300, and 4400 may be p-channel transistors.

The transistor 4200 and the transistor 4300 are preferably provided in alayer different from the layer where the transistor 4400 is providedeven when the transistor 4200, the transistor 4300, and the transistor4400 are transistors including oxide semiconductors. In other words, inthe semiconductor device in FIG. 35 , the transistor 4100, thetransistor 4200 and the transistor 4300, and the transistor 4400 arepreferably stacked. That is, by integrating the transistors, the circuitarea can be reduced, so that the size of the semiconductor device can bereduced.

Next, operation of writing data to the semiconductor device illustratedin FIG. 35 is described.

First, operation of writing a data voltage to the data retention portionconnected to the node FG1 (hereinafter referred to as writingoperation 1) is described. In the following description, the datavoltage written to the data retention portion connected to the node FG1is referred to as V_(D1), and the threshold voltage of the transistor4100 is referred to as V_(th).

In the writing operation 1, the wiring 4003 is set at V_(D1), and afterthe wiring 4001 is set at a ground potential, the wiring 4001 is broughtinto an electrically floating state. The wirings 4005 and 4006 are setat a high level. The wirings 4007 to 4009 are set at a low level. Then,the potential of the node FG2 in the electrically floating state isincreased, so that a current flows through the transistor 4100. By thecurrent flow, the potential of the wiring 4001 is increased. Thetransistors 4400 and 4200 are turned on. Thus, as the potential of thewiring 4001 is increased, the potentials of the nodes FG1 and FG2 areincreased. When the potential of the node FG2 is increased and a voltage(V_(gs)) between the gate and the source of the transistor 4100 reachesthe threshold voltage V_(th) of the transistor 4100, the current flowingthrough the transistor 4100 is decreased. Accordingly, the increase inthe potentials of the wiring 4001 and the nodes FG1 and FG2 is stopped,so that the potentials of the nodes FG1 and FG2 are fixed at“V_(D1)−V_(th),” which is lower than V_(D1) by V_(th).

In other words, when a current flows through the transistor 4100, V_(D1)supplied to the wiring 4003 is supplied to the wiring 4001, so that thepotentials of the nodes FG1 and FG2 are increased. When the potential ofthe node FG2 becomes “V_(D1)−V_(th)” with the increase in thepotentials, V_(gs) of the transistor 4100 becomes V_(th), so that thecurrent flow is stopped.

Next, operation of writing a data voltage to the data retention portionconnected to the node FG2 (hereinafter referred to as writing operation2) is described. In the following description, the data voltage writtento the data retention portion connected to the node FG2 is referred toas V_(D2).

In the writing operation 2, the wiring 4001 is set at V_(D2), and afterthe wiring 4003 is set at a ground potential, the wiring 4003 is broughtinto an electrically floating state. The wiring 4007 is set at the highlevel. The wirings 4005, 4006, 4008, and 4009 are set at the low level.The transistor 4300 is turned on, so that the wiring 4003 is set at thelow level. Thus, the potential of the node FG2 is also decreased to thelow level, so that the current flows through the transistor 4100. By thecurrent flow, the potential of the wiring 4003 is increased. Thetransistor 4300 is turned on. Thus, as the potential of the wiring 4003is increased, the potential of the node FG2 is increased. When thepotential of the node FG2 is increased and V_(gs) of the transistor 4100becomes V_(th) of the transistor 4100, the current flowing through thetransistor 4100 is decreased. Accordingly, the increase in thepotentials of the wiring 4003 and the node FG2 is stopped, so that thepotential of the node FG2 is fixed at “V_(D2)−V_(th),” which is lowerthan V_(D2) by V_(th).

In other words, when a current flows through the transistor 4100, V_(D2)supplied to the wiring 4001 is supplied to the wiring 4003, so that thepotential of the node FG2 is increased. When the potential of the nodeFG2 becomes “V_(D2)−V_(th)” with the increase in the potential, V_(gs)of the transistor 4100 becomes V_(th), so that the current flow isstopped. At this time, the transistors 4200 and 4400 are off and thepotential of the node FG1 remains at “V_(D1)−V_(th)” written in thewriting operation 1.

In the semiconductor device in FIG. 35 , after data voltages are writtento the plurality of data retention portions, the wiring 4009 is set atthe high level, so that the potentials of the nodes FG1 and FG2 areincreased. Then, the transistors are turned off to stop the movement ofcharge; thus, the written data voltages are retained.

By the above-described writing operations of the data voltages to thenodes FG1 and FG2, the data voltages can be retained in the plurality ofdata retention portions. Although examples where “V_(D1)−V_(th)” and“V_(D2)−V_(th)” are used as the written potentials are described, theyare data voltages corresponding to multi-level data. Therefore, in thecase where the data retention portions each retain 4-bit data, 16-level“V_(D1)−V_(th)” and 16-level “V_(D2)−V_(th)” can be obtained.

Next, operation of reading data from the semiconductor deviceillustrated in FIG. 35 is described.

First, operation of reading a data voltage from the data retentionportion connected to the node FG2 (hereinafter referred to as readingoperation 1) is described.

In the reading operation 1, the wiring 4003 which is brought into anelectrically floating state after precharge is discharged. The wirings4005 to 4008 are set at the low level. When the wiring 4009 is set atthe low level, the potential of the node FG2 which is electricallyfloating is set at “V_(D2)−V_(th).” The potential of the node FG2 isdecreased, so that a current flows through the transistor 4100. By thecurrent flow, the potential of the wiring 4003 which is electricallyfloating is decreased. As the potential of the wiring 4003 is decreased,V_(gs) of the transistor 4100 is decreased. When V_(gs) of thetransistor 4100 becomes V_(th) of the transistor 4100, the currentflowing through the transistor 4100 is decreased. In other words, thepotential of the wiring 4003 becomes “V_(D2),” which is higher than thepotential “V_(D2)−V_(th)” of the node FG2 by V_(th). The potential ofthe wiring 4003 corresponds to the data voltage of the data retentionportion connected to the node FG2. The read analog data voltage issubjected to A/D conversion, so that data of the data retention portionconnected to the node FG2 is obtained.

In other words, the wiring 4003 after precharge is brought into afloating state and the potential of the wiring 4009 is changed from thehigh level to the low level, whereby a current flows through thetransistor 4100. When the current flows, the potential of the wiring4003 which is in a floating state is decreased to be “V_(D2).” In thetransistor 4100, V_(gs) between “V_(D2)−V_(th)” of the node FG2 and“V_(D2)” of the wiring 4003 becomes V_(th), so that the current stops.Then, “V_(D2)” written in the writing operation 2 is read to the wiring4003.

After data in the data retention portion connected to the node FG2 isobtained, the transistor 4300 is turned on to discharge “V_(D2)−V_(th)”of the node FG2.

Then, the charges retained in the node FG1 are distributed between thenode FG1 and the node FG2, so that data voltage in the data retentionportion connected to the node FG1 is transferred to the data retentionportion connected to the node FG2. The wirings 4001 and 4003 are set atthe low level. The wiring 4006 is set the high level. The wiring 4005and the wirings 4007 to 4009 are set at the low level. When thetransistor 4200 is turned on, the charges in the node FG1 aredistributed between the node FG1 and the node FG2.

Here, the potential after the charge distribution is decreased from thewritten potential “V_(D1)−V_(th).” Thus, the capacitance of thecapacitor 4600 is preferably larger than the capacitance of thecapacitor 4500. Alternatively, the potential “V_(D1)−V_(th)” written tothe node FG1 is preferably higher than the potential “V_(D2)−V_(th)”corresponding to the same data. By changing the ratio of thecapacitances and setting the written potential higher in advance asdescribed above, a decrease in potential after the charge distributioncan be suppressed. The change in potential due to the chargedistribution is described later.

Next, operation of reading data voltage from the data retention portionconnected to the node FG1 (hereinafter referred to as reading operation2) is described.

In the reading operation 2, the wiring 4003 which is brought into anelectrically floating state after precharge is discharged. The wirings4005 to 4008 are set at the low level. The wiring 4009 is set at thehigh level at the time of precharge and then set at the low level. Whenthe wiring 4009 is set at the low level, the node FG2 which iselectrically floating is set at “V_(D1)−V_(th).” The potential of thenode FG2 is decreased, so that a current flows through the transistor4100. By the current flow, the potential of the wiring 4003 which iselectrically floating is decreased. As the potential of the wiring 4003is decreased, V_(gs) of the transistor 4100 is decreased. When V_(gs) ofthe transistor 4100 becomes V_(th) of the transistor 4100, the currentflowing through the transistor 4100 is decreased. In other words, thepotential of the wiring 4003 becomes “V_(D1)” which is higher than thepotential “V_(D1)−V_(th)” of the node FG2 by V_(th). The potential ofthe wiring 4003 corresponds to the data voltage of the data retentionportion connected to the node FG1. The read analog data voltage issubjected to A/D conversion, so that data of the data retention portionconnected to the node FG1 is obtained. The above is the operation ofreading the data voltage from the data retention portion connected tothe node FG1.

In other words, the wiring 4003 after precharge is brought into afloating state and the potential of the wiring 4009 is changed from thehigh level to the low level, whereby a current flows through thetransistor 4100. When the current flows, the potential of the wiring4003 which is in a floating state is decreased to be “V_(D1).” In thetransistor 4100, V_(gs) between “V_(D1)−V_(th)” of the node FG2 and“V_(D1)” of the wiring 4003 becomes V_(th), so that the current stops.Then, “V_(D1)” written in the writing operation 1 is read to the wiring4003.

In the above-described reading operations of the data voltages from thenodes FG1 and FG2, the data voltages can be read from the plurality ofdata retention portions. For example, 4-bit (16-level) data is retainedin each of the node FG1 and the node FG2, whereby 8-bit (256-level) datacan be retained in total. Although first to third layers 4021 to 4023are provided in the structure illustrated in FIG. 35 , the storagecapacity can be increased by adding layers without increasing the areaof the semiconductor device.

Note that the read potential can be read as a voltage higher than thewritten data voltage by V_(th). Therefore, V_(th) of “V_(D1)−V_(th)” orV_(th) of “V_(D2)−V_(th)” written in the writing operation can becanceled out in reading. As a result, the storage capacity per memorycell can be improved and read data can be close to accurate data; thus,the data reliability becomes excellent.

The structures described in this embodiment can be combined with any ofthe structures described in the other embodiments as appropriate.

Embodiment 6

In this embodiment, circuit configuration examples to which the OStransistors described in the above embodiment can be used are describedwith reference to FIGS. 36A to 36C, FIGS. 37A to 37C, FIGS. 38A and 38B,and FIGS. 39A and 39B.

FIG. 36A is a circuit diagram of an inverter. An inverter 5800 outputs asignal whose logic is inverted from the logic of a signal supplied to aninput terminal IN to an output terminal OUT. The inverter 5800 includesa plurality of OS transistors. A signal S_(BG) can switch electricalcharacteristics of the OS transistors.

FIG. 36B illustrates an example of the inverter 5800. The inverter 5800includes an OS transistor 5810 and an OS transistor 5820. The inverter5800 can be formed using only n-channel transistors; thus, the inverter5800 can be formed at lower cost than an inverter formed using acomplementary metal oxide semiconductor (i.e., a CMOS inverter).

Note that the inverter 5800 including the OS transistors can be providedover a CMOS circuit including Si transistors. Since the inverter 5800can be provided so as to overlap with the CMOS circuit, no additionalarea is required for the inverter 5800, and thus, an increase in thecircuit area can be suppressed.

Each of the OS transistors 5810 and 5820 includes a first gatefunctioning as a front gate, a second gate functioning as a back gate, afirst terminal functioning as one of a source and a drain, and a secondterminal functioning as the other of the source and the drain.

The first gate of the OS transistor 5810 is connected to its secondterminal. The second gate of the OS transistor 5810 is connected to awiring that supplies the signal S_(BG). The first terminal of the OStransistor 5810 is connected to a wiring that supplies a voltage VDD.The second terminal of the OS transistor 5810 is connected to the outputterminal OUT.

The first gate of the OS transistor 5820 is connected to the inputterminal IN. The second gate of the OS transistor 5820 is connected tothe input terminal IN. The first terminal of the OS transistor 5820 isconnected to the output terminal OUT. The second terminal of the OStransistor 5820 is connected to a wiring that supplies a voltage VSS.

FIG. 36C is a timing chart illustrating the operation of the inverter5800. The timing chart in FIG. 36C illustrates changes of a signalwaveform of the input terminal IN, a signal waveform of the outputterminal OUT, a signal waveform of the signal S_(BG), and the thresholdvoltage of the OS transistor 5810 (FET 5810).

The signal S_(BG) can be supplied to the second gate of the OStransistor 5810 to control the threshold voltage of the OS transistor5810.

The signal S_(BG) includes a voltage V_(BG_A) for shifting the thresholdvoltage in the negative direction and a voltage V_(BG_B) for shiftingthe threshold voltage in the positive direction. The threshold voltageof the OS transistor 5810 can be shifted in the negative direction to bea threshold voltage V_(TH_A) when the voltage V_(BG_A) is applied to thesecond gate. The threshold voltage of the OS transistor 5810 can beshifted in the positive direction to be a threshold voltage V_(TH_B)when the voltage V_(BG_B) is applied to the second gate.

To visualize the above description, FIG. 37A shows a V_(g)−I_(d) curve,which is one of indicators of the transistor's electricalcharacteristics.

When a high voltage such as the voltage V_(BG_A) is applied to thesecond gate, the electrical characteristics of the OS transistor 5810can be shifted to match a curve shown by a dashed line 5840 in FIG. 37A.When a low voltage such as the voltage V_(BG_B) is applied to the secondgate, the electrical characteristics of the OS transistor 5810 can beshifted to match a curve shown by a solid line 5841 in FIG. 37A. Asshown in FIG. 37A, switching the signal S_(BG) between the voltageV_(BG_A) and the voltage V_(BG_B) enables the threshold voltage of theOS transistor 5810 to be shifted in the negative direction or thepositive direction.

The shift of the threshold voltage in the positive direction to thethreshold voltage V_(TH_B) can make a current less likely to flow in theOS transistor 5810. FIG. 37B visualizes the state. As illustrated inFIG. 37B, a current h that flows in the OS transistor 5810 can beextremely low. Thus, when a signal supplied to the input terminal IN isat a high level and the OS transistor 5820 is on (ON), the voltage ofthe output terminal OUT can be sharply decreased.

Since a state in which a current is less likely to flow in the OStransistor 5810 as illustrated in FIG. 37B can be obtained, a signalwaveform 5831 of the output terminal in the timing chart in FIG. 36C canbe made steep. Shoot-through current between the wiring that suppliesthe voltage VDD and the wiring that supplies the voltage VSS can be low,leading to low-power operation.

The shift of the threshold voltage in the negative direction to thethreshold voltage V_(TH_A) can make a current flow easily in the OStransistor 5810. FIG. 37C visualizes the state. As illustrated in FIG.37C, a current I_(A) flowing at this time can be higher than at leastthe current I_(B). Thus, when a signal supplied to the input terminal INis at a low level and the OS transistor 5820 is off (OFF), the voltageof the output terminal OUT can be increased sharply.

Since a state in which a current is likely to flow in the OS transistor5810 as illustrated in FIG. 37C can be obtained, a signal waveform 5832of the output terminal in the timing chart in FIG. 36C can be madesteep.

Note that the threshold voltage of the OS transistor 5810 is preferablycontrolled by the signal S_(BG) before the state of the OS transistor5820 is switched, i.e., before time T1 or time T2. For example, as inFIG. 36C, it is preferable that the threshold voltage of the OStransistor 5810 be switched from the threshold voltage V_(TH_A) to thethreshold voltage V_(TH_B) before time T1 at which the level of thesignal supplied to the input terminal IN is switched to the high level.Moreover, as in FIG. 36C, it is preferable that the threshold voltage ofthe OS transistor 5810 be switched from the threshold voltage V_(TH_B)to the threshold voltage V_(TH_A) before time T2 at which the level ofthe signal supplied to the input terminal IN is switched to the lowlevel.

Although the timing chart in FIG. 36C illustrates the configuration inwhich the level of the signal S_(BG) is switched in accordance with thesignal supplied to the input terminal IN, a different configuration maybe employed in which voltage for controlling the threshold voltage isheld by the second gate of the OS transistor 5810 in a floating state,for example. FIG. 38A illustrates an example of such a circuitconfiguration.

The circuit configuration in FIG. 38A is the same as that in FIG. 36B,except that an OS transistor 5850 is added. A first terminal of the OStransistor 5850 is connected to the second gate of the OS transistor5810. A second terminal of the OS transistor 5850 is connected to awiring that supplies the voltage V_(BG_B) (or the voltage V_(BG_A)). Afirst gate of the OS transistor 5850 is connected to a wiring thatsupplies a signal S_(F). A second gate of the OS transistor 5850 isconnected to the wiring that supplies the voltage V_(BG_B) (or thevoltage V_(BG_A)).

The operation with the circuit configuration in FIG. 38A is describedwith reference to a timing chart in FIG. 38B.

The voltage for controlling the threshold voltage of the OS transistor5810 is supplied to the second gate of the OS transistor 5810 beforetime T3 at which the level of the signal supplied to the input terminalIN is switched to a high level. The signal S_(F) is set to a high leveland the OS transistor 5850 is turned on, so that the voltage V_(BG_B)for controlling the threshold voltage is supplied to a node N_(BG).

The OS transistor 5850 is turned off after the voltage of the nodeN_(BG) becomes V_(BG_B). Since the off-state current of the OStransistor 5850 is extremely low, the voltage V_(BG_B) held by the nodeN_(BG) can be retained while the OS transistor 5850 remains off and thenode N_(BG) is in a state that is very close to a floating state.Therefore, the number of times the voltage V_(BG_B) is supplied to thesecond gate of the OS transistor 5850 can be reduced and accordingly,the power consumption for rewriting the voltage V_(BG_B) can be reduced.

Although FIG. 36B and FIG. 38A each illustrate the configuration wherethe voltage is supplied to the second gate of the OS transistor 5810 bycontrol from the outside, a different configuration may be employed inwhich voltage for controlling the threshold voltage is generated on thebasis of the signal supplied to the input terminal IN and supplied tothe second gate of the OS transistor 5810, for example. FIG. 39Aillustrates an example of such a circuit configuration.

The circuit configuration in FIG. 39A is the same as that in FIG. 36B,except that a CMOS inverter 5860 is provided between the input terminalIN and the second gate of the OS transistor 5810. An input terminal ofthe CMOS inverter 5860 is connected to the input terminal IN. An outputterminal of the CMOS inverter 5860 is connected to the second gate ofthe OS transistor 5810.

The operation with the circuit configuration in FIG. 39A is describedwith reference to a timing chart in FIG. 39B. The timing chart in FIG.39B illustrates changes of a signal waveform of the input terminal IN, asignal waveform of the output terminal OUT, an output waveform IN_B ofthe CMOS inverter 5860, and the threshold voltage of the OS transistor5810 (FET 5810).

The output waveform IN_B which corresponds to a signal whose logic isinverted from the logic of the signal supplied to the input terminal INcan be used as a signal that controls the threshold voltage of the OStransistor 5810. Thus, the threshold voltage of the OS transistor 5810can be controlled as described with reference to FIGS. 36A to 36C. Forexample, the signal supplied to the input terminal IN is at a high leveland the OS transistor 5820 is turned on at time T4 in FIG. 39B. At thistime, the output waveform IN_B is at a low level. Accordingly, a currentcan be made less likely to flow in the OS transistor 5810; thus, thevoltage of the output terminal OUT can be sharply decreased.

Moreover, the signal supplied to the input terminal IN is at a low leveland the OS transistor 5820 is turned off at time T5 in FIG. 39B. At thistime, the output waveform IN_B is at a high level. Accordingly, acurrent can easily flow in the OS transistor 5810; thus, the voltage ofthe output terminal OUT can be sharply increased.

As described above, in the configuration of the inverter including theOS transistor in this embodiment, the voltage of the back gate isswitched in accordance with the logic of the signal supplied to theinput terminal IN. In such a configuration, the threshold voltage of theOS transistor can be controlled. The control of the threshold voltage ofthe OS transistor by the signal supplied to the input terminal IN cancause a steep change in the voltage of the output terminal OUT.Moreover, shoot-through current between the wirings that supply powersupply voltages can be reduced. Thus, power consumption can be reduced.

The structures described in this embodiment can be combined with any ofthe structures described in the other embodiments as appropriate.

Embodiment 7

In this embodiment, examples of a semiconductor device which includes aplurality of circuits including OS transistors described in the aboveembodiment are described with reference to FIGS. 40A to 40E, FIGS. 41Aand 41B, FIGS. 42A and 42B, FIGS. 43A to 43C, FIGS. 44A and 44B, FIGS.45A to 45C, and FIGS. 46A and 46B.

FIG. 40A is a block diagram of a semiconductor device 5900. Thesemiconductor device 5900 includes a power supply circuit 5901, acircuit 5902, a voltage generation circuit 5903, a circuit 5904, avoltage generation circuit 5905, and a circuit 5906.

The power supply circuit 5901 is a circuit that generates a voltageV_(ORG) used as a reference. The voltage V_(ORG) is not necessarily onevoltage and can be a plurality of voltages. The voltage V_(ORG) can begenerated on the basis of a voltage V₀ supplied from the outside of thesemiconductor device 5900. The semiconductor device 5900 can generatethe voltage V_(ORG) on the basis of one power supply voltage suppliedfrom the outside. Thus, the semiconductor device 5900 can operatewithout the supply of a plurality of power supply voltages from theoutside.

The circuits 5902, 5904, and 5906 operate with different power supplyvoltages. For example, the power supply voltage of the circuit 5902 is avoltage applied on the basis of the voltage V_(ORG) and the voltageV_(SS) (V_(ORG)>V_(SS)). For example, the power supply voltage of thecircuit 5904 is a voltage applied on the basis of a voltage V_(POG) andthe voltage V_(SS) (V_(POG)>V_(ORG)). For example, the power supplyvoltages of the circuit 5906 are voltages applied on the basis of thevoltage V_(ORG), the voltage V_(SS), and a voltage V_(NEG)(V_(ORG)>V_(SS)>V_(NEG)). When the voltage V_(SS) is equal to a groundpotential (GND), the kinds of voltages generated in the power supplycircuit 5901 can be reduced.

The voltage generation circuit 5903 is a circuit that generates thevoltage V_(POG). The voltage generation circuit 5903 can generate thevoltage V_(POG) on the basis of the voltage V_(ORG) supplied from thepower supply circuit 5901. Thus, the semiconductor device 5900 includingthe circuit 5904 can operate on the basis of one power supply voltagesupplied from the outside.

The voltage generation circuit 5905 is a circuit that generates thevoltage V_(NEG). The voltage generation circuit 5905 can generate thevoltage V_(NEG) on the basis of the voltage V_(ORG) supplied from thepower supply circuit 5901. Thus, the semiconductor device 5900 includingthe circuit 5906 can operate on the basis of one power supply voltagesupplied from the outside.

FIG. 40B illustrates an example of the circuit 5904 that operates withthe voltage V_(POG) and FIG. 40C illustrates an example of a waveform ofa signal for operating the circuit 5904.

FIG. 40B illustrates a transistor 5911. A signal supplied to a gate ofthe transistor 5911 is generated on the basis of, for example, thevoltage V_(POG) and the voltage V_(SS). The signal is generated on thebasis of the voltage V_(POG) at the time when the transistor 5911 isturned on and on the basis of the voltage V_(SS) at the time when thetransistor 5911 is turned off. As shown in FIG. 40C, the voltage V_(POG)is higher than the voltage V_(ORG). Therefore, a conducting statebetween a source (S) and a drain (D) of the transistor 5911 can beobtained more surely. As a result, the frequency of malfunction of thecircuit 5904 can be reduced.

FIG. 40D illustrates an example of the circuit 5906 that operates withthe voltage V_(NEG) and FIG. 40E illustrates an example of a waveform ofa signal for operating the circuit 5906.

FIG. 40D illustrates a transistor 5912 having a back gate. A signalsupplied to a gate of the transistor 5912 is generated on the basis of,for example, the voltage V_(ORG) and the voltage V_(SS). The signal isgenerated on the basis of the voltage V_(ORG) at the time when thetransistor 5911 is turned on and on the basis of the voltage V_(SS) atthe time when the transistor 5911 is turned off. A signal supplied tothe back gate of the transistor 5912 is generated on the basis of thevoltage V_(NEG). As shown in FIG. 40E, the voltage V_(NEG) is lower thanthe voltage V_(SS) (GND). Therefore, the threshold voltage of thetransistor 5912 can be controlled so as to be shifted in the positivedirection. Thus, the transistor 5912 can be surely turned off and acurrent flowing between a source (S) and a drain (D) can be reduced. Asa result, the frequency of malfunction of the circuit 5906 can bereduced and power consumption thereof can be reduced.

The voltage V_(NEG) may be directly supplied to the back gate of thetransistor 5912. Alternatively, a signal supplied to the gate of thetransistor 5912 may be generated on the basis of the voltage V_(ORG) andthe voltage V_(NEG) and the generated signal may be supplied to the backgate of the transistor 5912.

FIGS. 41A and 41B illustrate a modification example of FIGS. 40D and40E.

In a circuit diagram illustrated in FIG. 41A, a transistor 5922 whoseconduction state can be controlled by a control circuit 5921 is providedbetween the voltage generation circuit 5905 and the circuit 5906. Thetransistor 5922 is an n-channel OS transistor. The control signal S_(BG)output from the control circuit 5921 is a signal for controlling theconduction state of the transistor 5922. Transistors 5912A and 5912Bincluded in the circuit 5906 are the same OS transistors as thetransistor 5922.

A timing chart in FIG. 41B shows changes in a potential of the controlsignal S_(BG) and a potential of the node N_(BG). The potential of thenode N_(BG) indicates the states of potentials of back gates of thetransistors 5912A and 5912B. When the control signal S_(BG) is at a highlevel, the transistor 5922 is turned on and the voltage of the nodeN_(BG) becomes the voltage V_(NEG). Then, when the control signal S_(BG)is at a low level, the node N_(BG) is brought into an electricallyfloating state. Since the transistor 5922 is an OS transistor, itsoff-state current is low. Accordingly, even when the node N_(BG) is inan electrically floating state, the voltage V_(NEG) which has beensupplied can be held.

FIG. 42A illustrates an example of a circuit configuration applicable tothe above-described voltage generation circuit 5903. The voltagegeneration circuit 5903 illustrated in FIG. 42A is a five-stage chargepump including diodes D1 to D5, capacitors C1 to C5, and an inverterINV. A clock signal CLK is supplied to the capacitors C1 to C5 directlyor through the inverter INV. When a power supply voltage of the inverterINV is a voltage applied on the basis of the voltage V_(ORG) and thevoltage V_(SS), the voltage V_(POG), which has been increased to apositive voltage having a positively quintupled value of the voltageV_(ORG) by application of the clock signal CLK, can be obtained. Notethat a forward voltage of the diodes D1 to D5 is 0 V. A desired voltageV_(POG) can be obtained when the number of stages of the charge pump ischanged.

FIG. 42B illustrates an example of a circuit configuration applicable tothe above-described voltage generation circuit 5905. The voltagegeneration circuit 5905 illustrated in FIG. 42B is a four-stage chargepump including the diodes D1 to D5, the capacitors C1 to C5, and theinverter INV. The clock signal CLK is supplied to the capacitors C1 toC5 directly or through the inverter INV. When a power supply voltage ofthe inverter INV is a voltage applied on the basis of the voltageV_(ORG) and the voltage V_(SS), the voltage V_(NEG), which has beenreduced from GND (i.e., the voltage V_(SS)) to a negative voltage havinga negatively quadrupled value of the voltage V_(ORG) by application ofthe clock signal CLK, can be obtained. Note that a forward voltage ofthe diodes D1 to D5 is 0 V. A desired voltage V_(NEG) can be obtainedwhen the number of stages of the charge pump is changed.

The circuit configuration of the voltage generation circuit 5903 is notlimited to the configuration of the circuit diagram illustrated in FIG.42A. Modification examples of the voltage generation circuit 5903 areshown in FIGS. 43A to 43C and FIGS. 44A and 44B.

A voltage generation circuit 5903A illustrated in FIG. 43A includestransistors M1 to M10, capacitors C11 to C14, and an inverter INV1. Theclock signal CLK is supplied to gates of the transistors M1 to M10directly or through the inverter INV′. By application of the clocksignal CLK, the voltage V_(POG), which has been increased to a positivevoltage having a positively quadrupled value of the voltage V_(ORG), canbe obtained. A desired voltage V_(POG) can be obtained when the numberof stages is changed. In the voltage generation circuit 5903A in FIG.43A, the off-state current of each of the transistors M1 to M10 can below when the transistors M1 to M10 are OS transistors, and leakage ofcharge held in the capacitors C11 to C14 can be inhibited. Accordingly,efficient voltage increase from the voltage V_(ORG) to the voltageV_(POG) is possible.

A voltage generation circuit 5903B illustrated in FIG. 43B includestransistors M11 to M14, capacitors C15 and C16, and an inverter INV2.The clock signal CLK is supplied to gates of the transistors M11 to M14directly or through the inverter INV2. By application of the clocksignal CLK, the voltage V_(POG), which has been increased to a positivevoltage having a positively doubled value of the voltage V_(ORG), can beobtained. In the voltage generation circuit 5903B in FIG. 43B, theoff-state current of each of the transistors M11 to M14 can be low whenthe transistors M11 to M14 are OS transistors, and leakage of chargeheld in the capacitors C15 and C16 can be inhibited. Accordingly,efficient voltage increase from the voltage V_(ORG) to the voltageV_(POG) is possible.

A voltage generation circuit 5903C in FIG. 43C includes an inductor I11,a transistor M15, a diode D6, and a capacitor C17. The conduction stateof the transistor M15 is controlled by a control signal EN. Owing to thecontrol signal EN, the voltage V_(POG) which is obtained by increasingthe voltage V_(ORG) can be obtained. Since the voltage generationcircuit 5903C in FIG. 43C increases the voltage using the inductor I11,the voltage can be increased efficiently.

A voltage generation circuit 5903D in FIG. 44A has a configuration inwhich the diodes D1 to D5 of the voltage generation circuit 5903 in FIG.42A are replaced with diode-connected transistors M16 to M20. In thevoltage generation circuit 5903D in FIG. 44A, the off-state current ofeach of the transistors M16 to M20 can be low when the transistors M16to M20 are OS transistors, and leakage of charge held in the capacitorsC1 to C5 can be inhibited. Thus, efficient voltage increase from thevoltage V_(ORG) to the voltage V_(POG) is possible.

A voltage generation circuit 5903E in FIG. 44B has a configuration inwhich the transistors M16 to M20 of the voltage generation circuit 5903Din FIG. 44A are replaced with transistor M21 to M25 having back gates.In the voltage generation circuit 5903E in FIG. 44B, the back gates canbe supplied with voltages that are the same as those of the gates, sothat the current flowing through the transistors can be increased. Thus,efficient voltage increase from the voltage V_(ORG) to the voltageV_(POG) is possible.

Note that the modification examples of the voltage generation circuit5903 can also be applied to the voltage generation circuit 5905 in FIG.42B. The configurations of a circuit diagram in this case areillustrated in FIGS. 45A to 45C and FIGS. 46A and 46B. In a voltagegeneration circuit 5905A illustrated in FIG. 45A, the voltage V_(NEG)which has been reduced from the voltage V_(SS) to a negative voltagehaving a negatively tripled value of the voltage V_(ORG) by applicationof the clock signal CLK can be obtained. In a voltage generation circuit5905B illustrated in FIG. 45B, the voltage V_(NEG) which has beenreduced from the voltage V_(SS) to a negative voltage having anegatively doubled value of the voltage V_(ORG) by application of theclock signal CLK can be obtained.

The voltage generation circuits 5905A and 5905B and voltage generationcircuits 5905C to 5905E illustrated in FIGS. 45A to 45C and FIGS. 46Aand 46B have configurations formed by changing the voltages applied tothe wirings or the arrangement of the elements of the voltage generationcircuits 5903A to 5903E illustrated in FIGS. 43A to 43C and FIGS. 44Aand 44B. In the voltage generation circuits 5905A to 5905E illustratedin FIGS. 45A to 45C and FIGS. 46A and 46B, as in the voltage generationcircuits 5903A to 5903E, efficient voltage decrease from the voltageV_(SS) to the voltage V_(NEG) is possible.

As described above, in any of the structures of this embodiment, avoltage required for circuits included in a semiconductor device can beinternally generated. Thus, in the semiconductor device, the kinds ofpower supply voltages supplied from the outside can be reduced.

The structures described in this embodiment can be combined with any ofthe structures described in the other embodiments as appropriate.

Embodiment 8

In this embodiment, examples of CPUs including semiconductor devicessuch as the transistor of one embodiment of the present invention andthe above-described memory device will be described.

<Configuration of CPU>

A semiconductor device 5400 shown in FIG. 47 includes a CPU core 5401, apower management unit 5421, and a peripheral circuit 5422. The powermanagement unit 5421 includes a power controller 5402 and a power switch5403. The peripheral circuit 5422 includes a cache 5404 including cachememory, a bus interface (BUS I/F) 5405, and a debug interface (DebugI/F) 5406. The CPU core 5401 includes a data bus 5423, a control unit5407, a PC (program counter) 5408, a pipeline register 5409, a pipelineregister 5410, an ALU (arithmetic logic unit) 5411, and a register file5412. Data is transmitted between the CPU core 5401 and the peripheralcircuit 5422 such as the cache 5404 via the data bus 5423.

The semiconductor device (cell) can be used for many logic circuitstypified by the power controller 5402 and the control unit 5407,particularly for all logic circuits that can be constituted usingstandard cells. Accordingly, the semiconductor device 5400 can be small.The semiconductor device 5400 can have reduced power consumption. Thesemiconductor device 5400 can have a higher operating speed. Thesemiconductor device 5400 can have a smaller power supply voltagevariation.

When p-channel Si transistors and the transistor described in the aboveembodiment which includes an oxide semiconductor (preferably an oxidecontaining In, Ga, and Zn) in a channel formation region are used in thesemiconductor device (cell) and the semiconductor device (cell) is usedin the semiconductor device 5400, the semiconductor device 5400 can besmall. The semiconductor device 5400 can have reduced power consumption.The semiconductor device 5400 can have a higher operating speed.Particularly when the Si transistors are only p-channel ones, themanufacturing cost can be reduced.

The control unit 5407 has functions of decoding and executinginstructions contained in a program such as inputted applications bycontrolling the overall operations of the PC 5408, the pipelineregisters 5409 and 5410, the ALU 5411, the register file 5412, the cache5404, the bus interface 5405, the debug interface 5406, and the powercontroller 5402.

The ALU 5411 has a function of performing a variety of arithmeticoperations such as four arithmetic operations and logic operations.

The cache 5404 has a function of temporarily storing frequently useddata. The PC 5408 is a register having a function of storing an addressof an instruction to be executed next. Note that although not shown inFIG. 47 , the cache 5404 is provided with a cache controller forcontrolling the operation of the cache memory.

The pipeline register 5409 has a function of temporarily storinginstruction data.

The register file 5412 includes a plurality of registers including ageneral purpose register and can store data that is read from the mainmemory, data obtained as a result of arithmetic operations in the ALU5411, or the like.

The pipeline register 5410 has a function of temporarily storing dataused for arithmetic operations of the ALU 5411, data obtained as aresult of arithmetic operations of the ALU 5411, or the like.

The bus interface 5405 has a function of a path for data between thesemiconductor device 5400 and various devices outside the semiconductordevice 5400. The debug interface 5406 has a function of a path of asignal for inputting an instruction to control debugging to thesemiconductor device 5400.

The power switch 5403 has a function of controlling supply of a powersupply voltage to various circuits included in the semiconductor device5400 other than the power controller 5402. The above various circuitsbelong to several different power domains. The power switch 5403controls whether the power supply voltage is supplied to the variouscircuits in the same power domain. In addition, the power controller5402 has a function of controlling the operation of the power switch5403.

The semiconductor device 5400 having the above structure is capable ofperforming power gating. A description will be given of an example ofthe power gating operation sequence.

First, by the CPU core 5401, timing for stopping the supply of the powersupply voltage is set in a register of the power controller 5402. Then,an instruction of starting power gating is sent from the CPU core 5401to the power controller 5402. Then, various registers and the cache 5404included in the semiconductor device 5400 start data saving. Then, thepower switch 5403 stops the supply of a power supply voltage to thevarious circuits other than the power controller 5402 included in thesemiconductor device 5400. Then, an interrupt signal is input to thepower controller 5402, whereby the supply of the power supply voltage tothe various circuits included in the semiconductor device 5400 isstarted. Note that a counter may be provided in the power controller5402 to be used to determine the timing of starting the supply of thepower supply voltage regardless of input of an interrupt signal. Next,the various registers and the cache 5404 start data restoration. Then,execution of an instruction is resumed in the control unit 5407.

Such power gating can be performed in the whole processor or one or aplurality of logic circuits included in the processor. Furthermore,power supply can be stopped even for a short time. Consequently, powerconsumption can be reduced at a fine spatial or temporal granularity.

In performing power gating, data held by the CPU core 5401 or theperipheral circuit 5422 is preferably saved in a short time. In thatcase, the power can be turned on or off in a short time, and an effectof saving power becomes significant.

In order that the data held by the CPU core 5401 or the peripheralcircuit 5422 be saved in a short time, the data is preferably saved in aflip-flop circuit itself (referred to as a flip-flop circuit capable ofbackup operation). Furthermore, the data is preferably saved in an SRAMcell itself (referred to as an SRAM cell capable of backup operation).The flip-flop circuit and SRAM cell which are capable of backupoperation preferably include transistors including an oxidesemiconductor (preferably an oxide containing In, Ga, and Zn) in achannel formation region. Consequently, the transistor has a lowoff-state current; thus, the flip-flop circuit and SRAM cell which arecapable of backup operation can retain data for a long time withoutpower supply. When the transistor has a high switching speed, theflip-flop circuit and SRAM cell which are capable of backup operationcan save and restore data in a short time in some cases.

An example of the flip-flop circuit capable of backup operation isdescribed with reference to FIG. 48 .

A semiconductor device 5500 shown in FIG. 48 is an example of theflip-flop circuit capable of backup operation. The semiconductor device5500 includes a first memory circuit 5501, a second memory circuit 5502,a third memory circuit 5503, and a read circuit 5504. As a power supplyvoltage, a potential difference between a potential V1 and a potentialV2 is supplied to the semiconductor device 5500. One of the potential V1and the potential V2 is at a high level, and the other is at a lowlevel. An example of the structure of the semiconductor device 5500 whenthe potential V1 is at a low level and the potential V2 is at a highlevel will be described below.

The first memory circuit 5501 has a function of retaining data when asignal D including the data is input in a period during which the powersupply voltage is supplied to the semiconductor device 5500.Furthermore, the first memory circuit 5501 outputs a signal Q includingthe retained data in the period during which the power supply voltage issupplied to the semiconductor device 5500. On the other hand, the firstmemory circuit 5501 cannot retain data in a period during which thepower supply voltage is not supplied to the semiconductor device 5500.That is, the first memory circuit 5501 can be referred to as a volatilememory circuit.

The second memory circuit 5502 has a function of reading the data heldin the first memory circuit 5501 to store (or save) it. The third memorycircuit 5503 has a function of reading the data held in the secondmemory circuit 5502 to store (or save) it. The read circuit 5504 has afunction of reading the data held in the second memory circuit 5502 orthe third memory circuit 5503 to store (or restore) it in the firstmemory circuit 5501.

In particular, the third memory circuit 5503 has a function of readingthe data held in the second memory circuit 5502 to store (or save) iteven in the period during which the power supply voltage is not suppliedto the semiconductor device 5500.

As shown in FIG. 48 , the second memory circuit 5502 includes atransistor 5512 and a capacitor 5519. The third memory circuit 5503includes a transistor 5513, a transistor 5515, and a capacitor 5520. Theread circuit 5504 includes a transistor 5510, a transistor 5518, atransistor 5509, and a transistor 5517.

The transistor 5512 has a function of charging and discharging thecapacitor 5519 in accordance with data held in the first memory circuit5501. The transistor 5512 is desirably capable of charging anddischarging the capacitor 5519 at a high speed in accordance with dataheld in the first memory circuit 5501. Specifically, the transistor 5512desirably contains crystalline silicon (preferably polycrystallinesilicon, more preferably single crystal silicon) in a channel formationregion.

The conduction state or the non-conduction state of the transistor 5513is determined in accordance with the charge held in the capacitor 5519.The transistor 5515 has a function of charging and discharging thecapacitor 5520 in accordance with the potential of a wiring 5544 whenthe transistor 5513 is in a conduction state. It is desirable that theoff-state current of the transistor 5515 be extremely low. Specifically,the transistor 5515 desirably contains an oxide semiconductor(preferably an oxide containing In, Ga, and Zn) in a channel formationregion.

Specific connection relations between the elements will be described.One of a source and a drain of the transistor 5512 is connected to thefirst memory circuit 5501. The other of the source and the drain of thetransistor 5512 is connected to one electrode of the capacitor 5519, agate of the transistor 5513, and a gate of the transistor 5518. Theother electrode of the capacitor 5519 is connected to a wiring 5542. Oneof a source and a drain of the transistor 5513 is connected to thewiring 5544. The other of the source and the drain of the transistor5513 is connected to one of a source and a drain of the transistor 5515.The other of the source and the drain of the transistor 5515 isconnected to one electrode of the capacitor 5520 and a gate of thetransistor 5510. The other electrode of the capacitor 5520 is connectedto a wiring 5543. One of a source and a drain of the transistor 5510 isconnected to the wiring 5541. The other of the source and the drain ofthe transistor 5510 is connected to one of a source and a drain of thetransistor 5518. The other of the source and the drain of the transistor5518 is connected to one of a source and a drain of the transistor 5509.The other of the source and the drain of the transistor 5509 isconnected to one of a source and a drain of the transistor 5517 and thefirst memory circuit 5501. The other of the source and the drain of thetransistor 5517 is connected to a wiring 5540. Although a gate of thetransistor 5509 is connected to a gate of the transistor 5517 in FIG. 48, it is not necessarily connected to the gate of the transistor 5517.

The transistor described in the above embodiment as an example can beapplied to the transistor 5515. Because of the low off-state current ofthe transistor 5515, the semiconductor device 5500 can retain data for along time without power supply. The favorable switching characteristicsof the transistor 5515 allow the semiconductor device 5500 to performhigh-speed backup and recovery.

The structures described in this embodiment can be combined with any ofthe structures described in the other embodiments as appropriate.

Embodiment 9

In this embodiment, an example of an imaging device including thetransistor or the like of one embodiment of the present invention isdescribed.

<Imaging Device>

An imaging device of one embodiment of the present invention isdescribed below.

FIG. 49A is a plan view illustrating an example of an imaging device2200 of one embodiment of the present invention. The imaging device 2200includes a pixel portion 2210 and peripheral circuits for driving thepixel portion 2210 (a peripheral circuit 2260, a peripheral circuit2270, a peripheral circuit 2280, and a peripheral circuit 2290). Thepixel portion 2210 includes a plurality of pixels 2211 arranged in amatrix with p rows and q columns (p and q are each an integer of 2 ormore). The peripheral circuit 2260, the peripheral circuit 2270, theperipheral circuit 2280, and the peripheral circuit 2290 are eachconnected to the plurality of pixels 2211 and have a function ofsupplying a signal for driving the plurality of pixels 2211. In thisspecification and the like, in some cases, a “peripheral circuit” or a“driver circuit” indicates all of the peripheral circuits 2260, 2270,2280, and 2290 and the like. For example, the peripheral circuit 2260can be regarded as part of the peripheral circuit.

The imaging device 2200 preferably includes a light source 2291. Thelight source 2291 can emit detection light P1.

The peripheral circuit includes at least one of a logic circuit, aswitch, a buffer, an amplifier circuit, and a converter circuit. Theperipheral circuit may be formed over a substrate where the pixelportion 2210 is formed. A semiconductor device such as an IC chip may beused as part or the whole of the peripheral circuit. Note that as theperipheral circuit, one or more of the peripheral circuits 2260, 2270,2280, and 2290 may be omitted.

As illustrated in FIG. 49B, the pixels 2211 may be provided to beinclined in the pixel portion 2210 included in the imaging device 2200.When the pixels 2211 are obliquely arranged, the distance between pixels(pitch) can be shortened in the row direction and the column direction.Accordingly, the quality of an image taken with the imaging device 2200can be improved.

Configuration Example 1 of Pixel

The pixel 2211 included in the imaging device 2200 is formed with aplurality of subpixels 2212, and each of the subpixels 2212 is combinedwith a filter (a color filter) which transmits light in a specificwavelength band, whereby data for achieving color image display can beobtained.

FIG. 50A is a top view showing an example of the pixel 2211 with which acolor image is obtained. The pixel 2211 illustrated in FIG. 50A includesa subpixel 2212 provided with a color filter that transmits light in ared (R) wavelength band (also referred to as a subpixel 2212R), asubpixel 2212 provided with a color filter that transmits light in agreen (G) wavelength band (also referred to as a subpixel 2212G), and asubpixel 2212 provided with a color filter that transmits light in ablue (B) wavelength band (also referred to as a subpixel 2212B). Thesubpixel 2212 can function as a photosensor.

The subpixels 2212 (the subpixel 2212R, the subpixel 2212G, and thesubpixel 2212B) are electrically connected to a wiring 2231, a wiring2247, a wiring 2248, a wiring 2249, and a wiring 2250. In addition, thesubpixel 2212R, the subpixel 2212G, and the subpixel 2212B are connectedto respective wirings 2253 which are independently provided. In thisspecification and the like, for example, the wiring 2248 and the wiring2249 that are connected to the pixel 2211 in the n-th row are referredto as a wiring 2248[n] and a wiring 2249[n]. For example, the wiring2253 connected to the pixel 2211 in the m-th column is referred to as awiring 2253[m]. Note that in FIG. 50A, the wirings 2253 connected to thesubpixel 2212R, the subpixel 2212G, and the subpixel 2212B in the pixel2211 in the m-th column are referred to as a wiring 2253[m]R, a wiring2253[m]G, and a wiring 2253[m]B. The subpixels 2212 are electricallyconnected to the peripheral circuit through the above wirings.

The imaging device 2200 has a structure in which the subpixel 2212 iselectrically connected to the subpixel 2212 in an adjacent pixel 2211which is provided with a color filter transmitting light in the samewavelength band as the subpixel 2212, via a switch. FIG. 50B shows aconnection example of the subpixels 2212: the subpixel 2212 in the pixel2211 provided in the n-th row (n is an integer greater than or equal to1 and less than or equal to p) and the m-th column (m is an integergreater than or equal to 1 and less than or equal to q) and the subpixel2212 in the adjacent pixel 2211 provided in an (n+1)-th row and the m-thcolumn. In FIG. 50B, the subpixel 2212R provided in the n-th row and them-th column and the subpixel 2212R provided in the (n+1)-th row and them-th column are connected to each other via a switch 2201. The subpixel2212G provided in the n-th row and the m-th column and the subpixel2212G provided in the (n+1)-th row and the m-th column are connected toeach other via a switch 2202. The subpixel 2212B provided in the n-throw and the m-th column and the subpixel 2212B provided in the (n+1)-throw and the m-th column are connected to each other via a switch 2203.

Note that the color filters used in the subpixel 2212 are not limited tored (R), green (G), and blue (B) color filters, and color filters thattransmit light of cyan (C), yellow (Y), and magenta (M) may be used. Byprovision of the subpixels 2212 that sense light in three differentwavelength bands in one pixel 2211, a full-color image can be obtained.

The pixel 2211 including the subpixel 2212 provided with a color filtertransmitting yellow (Y) light may be provided, in addition to thesubpixels 2212 provided with the color filters transmitting red (R),green (G), and blue (B) light. The pixel 2211 including the subpixel2212 provided with a color filter transmitting blue (B) light may beprovided, in addition to the subpixels 2212 provided with the colorfilters transmitting cyan (C), yellow (Y), and magenta (M) light. Whenthe subpixels 2212 sensing light in four different wavelength bands areprovided in one pixel 2211, the reproducibility of colors of an obtainedimage can be increased.

For example, in FIG. 50A, the pixel number ratio (or the light receivingarea ratio) of the subpixel 2212 sensing light in a red wavelength bandto the subpixel 2212 sensing light in a green wavelength band and thesubpixel 2212 sensing light in a blue wavelength band is not necessarily1:1:1. For example, the Bayer arrangement in which the pixel numberratio (the light receiving area ratio) of red to green and blue is 1:2:1may be employed. Alternatively, the pixel number ratio (the lightreceiving area ratio) of red to green and blue may be 1:6:1.

Note that the number of subpixels 2212 provided in the pixel 2211 may beone, but is preferably two or more. For example, when two or moresubpixels 2212 sensing light in the same wavelength band are provided,the redundancy is increased, and the reliability of the imaging device2200 can be increased.

When an infrared (IR) filter that transmits infrared light and absorbsor reflects visible light is used as the filter, the imaging device 2200that senses infrared light can be achieved.

Furthermore, when a neutral density (ND) filter (dark filter) is used,output saturation which occurs when a large amount of light enters aphotoelectric conversion element (a light-receiving element) can beprevented. With a combination of ND filters with different dimmingcapabilities, the dynamic range of the imaging device can be increased.

Besides the above-described filter, the pixel 2211 may be provided witha lens. An arrangement example of the pixel 2211, a filter 2254, and alens 2255 is described with reference to cross-sectional views in FIGS.51A and 51B. With the lens 2255, the photoelectric conversion elementcan receive incident light efficiently. Specifically, as illustrated inFIG. 51A, light 2256 enters a photoelectric conversion element 2220through the lens 2255, the filter 2254 (a filter 2254R, a filter 2254G,and a filter 2254B), a pixel circuit 2230, and the like which areprovided in the pixel 2211.

As indicated by a region surrounded with dashed dotted lines, however,part of the light 2256 indicated by arrows might be blocked by somewirings 2257. Thus, a preferable structure is that the lens 2255 and thefilter 2254 are provided on the photoelectric conversion element 2220side as illustrated in FIG. 51B, whereby the photoelectric conversionelement 2220 can efficiently receive the light 2256. When the light 2256enters the photoelectric conversion element 2220 from the photoelectricconversion element 2220 side, the imaging device 2200 with highsensitivity can be provided.

As the photoelectric conversion element 2220 illustrated in FIGS. 51Aand 51B, a photoelectric conversion element in which a p-n junction or ap-i-n junction is formed may be used.

The photoelectric conversion element 2220 may be formed using asubstance that has a function of absorbing radiation and generatingcharges. Examples of the substance that has a function of absorbingradiation and generating charges include selenium, lead iodide, mercuryiodide, gallium arsenide, cadmium telluride, and a cadmium zinc alloy.

For example, when selenium is used for the photoelectric conversionelement 2220, the photoelectric conversion element 2220 can have a lightabsorption coefficient in a wide wavelength band, such as visible light,ultraviolet light, infrared light, X-rays, and gamma rays.

One pixel 2211 included in the imaging device 2200 may include thesubpixel 2212 with a first filter in addition to the subpixel 2212illustrated in FIGS. 50A and 50B.

Configuration Example 2 of Pixel

An example of a pixel including a transistor including silicon and atransistor including an oxide semiconductor is described below. Atransistor similar to any of the transistors described in the aboveembodiment can be used as each of the transistors.

FIG. 52 is a cross-sectional view of an element included in an imagingdevice. The imaging device illustrated in FIG. 52 includes a transistor2351 including silicon on a silicon substrate 2300, transistors 2352 and2353 which include an oxide semiconductor and are stacked over thetransistor 2351, and a photodiode 2360 provided in the silicon substrate2300. The transistors and a cathode 2362 of the photodiode 2360 areelectrically connected to various plugs 2370 and wirings 2371. Inaddition, an anode 2361 of the photodiode 2360 is electrically connectedto the plug 2370 through a low-resistance region 2363.

The imaging device includes a layer 2310 including the transistor 2351provided on the silicon substrate 2300 and the photodiode 2360 providedin the silicon substrate 2300, a layer 2320 which is in contact with thelayer 2310 and includes the wirings 2371, a layer 2330 which is incontact with the layer 2320 and includes the transistors 2352 and 2353,and a layer 2340 which is in contact with the layer 2330 and includeswirings 2372 and wirings 2373.

In the example of the cross-sectional view in FIG. 52 , alight-receiving surface of the photodiode 2360 is provided on the sideopposite to a surface of the silicon substrate 2300 where the transistor2351 is formed. With this structure, a light path can be secured withoutan influence of the transistors and the wirings. Thus, a pixel with ahigh aperture ratio can be formed. Note that the light-receiving surfaceof the photodiode 2360 can be the same as the surface where thetransistor 2351 is formed.

In the case where a pixel is formed with use of only transistorsincluding an oxide semiconductor, the layer 2310 may include thetransistor including an oxide semiconductor. Alternatively, the layer2310 may be omitted, and the pixel may include only transistorsincluding an oxide semiconductor.

Note that the silicon substrate 2300 may be an SOI substrate.Furthermore, the silicon substrate 2300 can be replaced with a substrateincluding germanium, silicon germanium, silicon carbide, galliumarsenide, aluminum gallium arsenide, indium phosphide, gallium nitride,or an organic semiconductor.

Here, an insulator 2380 is provided between the layer 2310 including thetransistor 2351 and the photodiode 2360 and the layer 2330 including thetransistors 2352 and 2353. However, there is no limitation on theposition of the insulator 2380. An insulator 2379 is provided under theinsulator 2380, and an insulator 2381 is provided over the insulator2380.

Conductors 2390 a to 2390 e are provided in openings formed in theinsulators 2379 and 2381. The conductors 2390 a, 2390 b, and 2390 efunction as plugs and wirings. The conductor 2390 c functions as a backgate of the transistor 2353. The conductor 2390 d functions as a backgate of the transistor 2352.

Hydrogen in an insulator provided in the vicinity of a channel formationregion of the transistor 2351 terminates dangling bonds of silicon;accordingly, the reliability of the transistor 2351 can be improved. Incontrast, hydrogen in the insulator provided in the vicinity of thetransistor 2352, the transistor 2353, and the like becomes one offactors generating a carrier in the oxide semiconductor. Thus, thehydrogen may cause a reduction of the reliability of the transistor2352, the transistor 2353, and the like. For this reason, in the casewhere the transistor including an oxide semiconductor is provided overthe transistor including a silicon-based semiconductor, it is preferablethat the insulator 2380 having a function of blocking hydrogen beprovided between the transistors. When hydrogen is confined in layersbelow the insulator 2380, the reliability of the transistor 2351 can beimproved. In addition, hydrogen can be prevented from diffusing from thelayers below the insulator 2380 into layers above the insulator 2380;thus, the reliability of the transistor 2352, the transistor 2353, andthe like can be increased. The conductors 2390 a, 2390 b, and 2390 e canprevent hydrogen from diffusing into the layers provided thereoverthrough the via holes formed in the insulator 2380, resulting inimprovement in the reliability of the transistors 2352 and 2353 and thelike.

In the cross-sectional view in FIG. 52 , the photodiode 2360 in thelayer 2310 and the transistor in the layer 2330 can be formed so as tooverlap with each other. Thus, the degree of integration of pixels canbe increased. In other words, the resolution of the imaging device canbe increased.

Part or the whole of the imaging device may be bent. The bent imagingdevice enables the curvature of field and astigmatism to be reduced.Thus, the optical design of a lens or the like, which is used incombination of the imaging device, can be facilitated. For example, thenumber of lenses used for aberration correction can be reduced;accordingly, a reduction in size or weight of electronic devices usingthe imaging device, and the like, can be achieved. In addition, thequality of a captured image can be improved.

The structures described in this embodiment can be combined with any ofthe structures described in the other embodiments as appropriate.

Embodiment 10

In this embodiment, a semiconductor wafer, a chip, and an electroniccomponent of one embodiment of the present invention will be described.

<Semiconductor Wafer and Chip>

FIG. 53A is a top view illustrating a substrate 5711 before dicingtreatment. As the substrate 5711, a semiconductor substrate (alsoreferred to as a “semiconductor wafer”) can be used, for example. Aplurality of circuit regions 5712 are provided over the substrate 5711.A semiconductor device, a CPU, an RF tag, an image sensor, or the likeof one embodiment of the present invention can be provided in thecircuit region 5712.

The plurality of circuit regions 5712 are each surrounded by aseparation region 5713. Separation lines (also referred to as “dicinglines”) 5714 are set at a position overlapping with the separationregion 5713. The substrate 5711 can be cut along the separation lines5714 into chips 5715 including the circuit regions 5712. FIG. 53B is anenlarged view of the chip 5715.

A conductive layer or a semiconductor layer may be provided in theseparation region 5713. Providing a conductive layer or a semiconductorlayer in the separation region 5713 relieves ESD that might be caused ina dicing step, preventing a decrease in the yield of the dicing step. Adicing step is generally performed while letting pure water whosespecific resistance is decreased by dissolution of a carbonic acid gasor the like flow to a cut portion, in order to cool down a substrate,remove swarf, and prevent electrification, for example. Providing aconductive layer or a semiconductor layer in the separation region 5713allows a reduction in the usage of the pure water. Therefore, the costof manufacturing semiconductor devices can be reduced. Thus,semiconductor devices can be manufactured with improved productivity.

For a semiconductor layer provided in the separation region 5713, amaterial having a band gap greater than or equal to 2.5 eV and less thanor equal to 4.2 eV, preferably greater than or equal to 2.7 eV and lessthan or equal to 3.5 eV is preferably used. The use of such a materialallows accumulated charges to be released slowly; thus, the rapid moveof charges due to ESD can be suppressed and electrostatic breakdown isless likely to occur.

<Electronic Component>

FIGS. 54A and 54B show an example where the chip 5715 is used to make anelectronic component. Note that the electronic component is alsoreferred to as a semiconductor package or an IC package. This electroniccomponent has a plurality of standards and names depending on a terminalextraction direction and a terminal shape.

The electronic component is completed when the semiconductor devicedescribed in the above embodiment is combined with components other thanthe semiconductor device in an assembly process (post-process).

The post-process will be described with reference to a flow chart inFIG. 54A. After an element substrate including the semiconductor devicedescribed in the above embodiment is completed in a pre-process, a backsurface grinding step in which a back surface (a surface where thesemiconductor device and the like are not formed) of the elementsubstrate is ground is performed (Step S5721). When the elementsubstrate is thinned by grinding, warpage or the like of the elementsubstrate is reduced, so that the size of the electronic component canbe reduced.

Next, the element substrate is divided into a plurality of chips (chips5715) in a dicing step (Step S5722). Then, the separated chips areindividually picked up to be bonded to a lead frame in a die bondingstep (Step S5723). To bond a chip and a lead frame in the die bondingstep, a method such as bonding with a resin or a tape is selected asappropriate depending on products. Note that the chip may be bonded toan interposer substrate instead of the lead frame.

Next, a wire bonding step for electrically connecting a lead of the leadframe and an electrode on the chip through a metal wire is performed(Step S5724). A silver line or a gold line can be used as the metal fineline. Ball bonding or wedge bonding can be used as the wire bonding.

The wire-bonded chip is subjected to a sealing step (a molding step) ofsealing the chip with an epoxy resin or the like (Step S5725). Throughthe sealing step, the inside of the electronic component is filled witha resin, so that a circuit portion incorporated in the chip and a wirefor connecting the chip to the lead can be protected from externalmechanical force, and deterioration of characteristics (a decrease inreliability) due to moisture or dust can be reduced.

Subsequently, the lead of the lead frame is plated in a lead platingstep (Step S5726). This plating process prevents rust of the lead andfacilitates soldering at the time of mounting the chip on a printedcircuit board in a later step. Then, the lead is cut and processed in ashaping step (Step S5727).

Next, a printing (marking) step is performed on a surface of the package(Step S5728). After a testing step (Step S5729) for checking whether anexternal shape is good and whether there is a malfunction, for example,the electronic component is completed.

FIG. 54B is a schematic perspective diagram of a completed electroniccomponent. FIG. 54B is a schematic perspective diagram illustrating aquad flat package (QFP) as an example of the electronic component. Anelectronic component 5750 in FIG. 54B includes a lead 5755 and asemiconductor device 5753. As the semiconductor device 5753, thesemiconductor device described in the above embodiment or the like canbe used.

The electronic component 5750 in FIG. 54B is mounted on a printedcircuit board 5752, for example. A plurality of electronic components5750 that are combined and electrically connected to each other over theprinted circuit board 5752; thus, a substrate on which the electroniccomponents are mounted (a circuit board 5754) is completed. Thecompleted circuit board 5754 is provided in an electronic device or thelike.

The structures described in this embodiment can be combined with any ofthe structures described in the other embodiments as appropriate.

Embodiment 11

In this embodiment, electronic devices including the transistor or thelike of one embodiment of the present invention are described.

<Electronic Device>

The semiconductor device of one embodiment of the present invention canbe used for display devices, personal computers, or image reproducingdevices provided with recording media (typically, devices whichreproduce the content of recording media such as digital versatile discs(DVDs) and have displays for displaying the reproduced images). Otherexamples of electronic devices that can be equipped with thesemiconductor device of one embodiment of the present invention aremobile phones, game machines including portable game machines, portabledata terminals, e-book readers, cameras such as video cameras anddigital still cameras, goggle-type displays (head mounted displays),navigation systems, audio reproducing devices (e.g., car audio systemsand digital audio players), copiers, facsimiles, printers, multifunctionprinters, automated teller machines (ATM), and vending machines. FIGS.55A to 55F illustrate specific examples of these electronic devices.

FIG. 55A illustrates a portable game machine, which includes a housing1901, a housing 1902, a display portion 1903, a display portion 1904, amicrophone 1905, a speaker 1906, an operation key 1907, a stylus 1908,and the like. Although the portable game machine in FIG. 55A has the twodisplay portions 1903 and 1904, the number of display portions includedin a portable game machine is not limited to this.

FIG. 55B illustrates a portable data terminal, which includes a firsthousing 1911, a second housing 1912, a first display portion 1913, asecond display portion 1914, a joint 1915, an operation key 1916, andthe like. The first display portion 1913 is provided in the firsthousing 1911, and the second display portion 1914 is provided in thesecond housing 1912. The first housing 1911 and the second housing 1912are connected to each other with the joint 1915, and the angle betweenthe first housing 1911 and the second housing 1912 can be changed withthe joint 1915. Images displayed on the first display portion 1913 maybe switched in accordance with the angle at the joint 1915 between thefirst housing 1911 and the second housing 1912. A display device with aposition input function may be used as at least one of the first displayportion 1913 and the second display portion 1914. Note that the positioninput function can be added by providing a touch panel in a displaydevice. Alternatively, the position input function can be added byproviding a photoelectric conversion element also called a photosensorin a pixel portion of a display device.

FIG. 55C illustrates a notebook personal computer, which includes ahousing 1921, a display portion 1922, a keyboard 1923, a pointing device1924, and the like.

FIG. 55D illustrates an electric refrigerator-freezer, which includes ahousing 1931, a door for a refrigerator 1932, a door for a freezer 1933,and the like.

FIG. 55E illustrates a video camera, which includes a first housing1941, a second housing 1942, a display portion 1943, operation keys1944, a lens 1945, a joint 1946, and the like. The operation keys 1944and the lens 1945 are provided for the first housing 1941, and thedisplay portion 1943 is provided for the second housing 1942. The firsthousing 1941 and the second housing 1942 are connected to each otherwith the joint 1946, and the angle between the first housing 1941 andthe second housing 1942 can be changed with the joint 1946. Imagesdisplayed on the display portion 1943 may be switched in accordance withthe angle at the joint 1946 between the first housing 1941 and thesecond housing 1942.

FIG. 55F illustrates a passenger car, which includes a car body 1951,wheels 1952, a dashboard 1953, lights 1954, and the like.

In this embodiment, one embodiment of the present invention has beendescribed. Note that one embodiment of the present invention is notlimited thereto. In other words, since various embodiments of theinvention are described in this embodiment and the like, one embodimentof the present invention is not limited to a particular embodiment. Forexample, an example in which a channel formation region, source anddrain regions, and the like of a transistor include an oxidesemiconductor is described as one embodiment of the present invention;however, one embodiment of the present invention is not limited to thisexample. Alternatively, depending on circumstances or conditions,various semiconductors may be included in various transistors, a channelformation region of a transistor, source and drain regions of atransistor, or the like of one embodiment of the present invention.Depending on circumstances or conditions, at least one of silicon,germanium, silicon germanium, silicon carbide, gallium arsenide,aluminum gallium arsenide, indium phosphide, gallium nitride, an organicsemiconductor, and the like may be included in various transistors, achannel formation region of a transistor, source and drain regions of atransistor, or the like of one embodiment of the present invention.Alternatively, depending on circumstances or conditions, an oxidesemiconductor is not necessarily included in various transistors, achannel formation region of a transistor, source and drain regions of atransistor, or the like of one embodiment of the present invention, forexample.

The structures described in this embodiment can be combined with any ofthe structures described in the other embodiments as appropriate.

Example 1

In this example, results of elemental analysis and crystallinityevaluation of In—Ga—Zn oxide films (hereinafter referred to as IGZOfilms) formed by any of the methods described in the above embodimentswill be described.

An IGZO film of a sample 1A of this example was formed over a glasssubstrate with the intended thickness set to 100 nm by a sputteringmethod using an In—Ga—Zn oxide target (with an atomic ratio ofIn:Ga:Zn=4:2:4.1). The IGZO film was formed in an atmosphere includingan argon gas at 180 sccm and an oxygen gas at 20 sccm, where thepressure was controlled to 0.6 Pa, the substrate temperature was roomtemperature, and an alternating-current power of 2.5 kW was applied.

A cross section of the IGZO film of the sample 1A was subjected tomeasurement using energy dispersive X-ray spectroscopy (EDX). The EDXmeasurement was performed using an atomic resolution analytical electronmicroscope JEM-ARM200F manufactured by JEOL Ltd. under conditions wherethe acceleration voltage was 200 kV, and irradiation with an electronbeam with a diameter of approximately 0.1 nmϕ was performed. An energydispersive X-ray spectrometer JED-2300T was used as an elementalanalysis apparatus. A Si drift detector was used to detect X-raysemitted from the sample 1A.

In the EDX measurement, an EDX spectrum of a point is obtained in such amanner that electron beam irradiation is performed on the point in ananalysis target region of a sample, and the energy of characteristicX-rays of the sample generated by the irradiation and its frequency aremeasured. In this example, peaks of an EDX spectrum of the point wereattributed to electron transitions in an In atom, a Ga atom, a Zn atom,and an O atom, and the proportions of the atoms in the point werecalculated. An EDX mapping image indicating distributions of proportionsof the atoms can be obtained through this process in an analysis targetregion of the sample 1A.

FIG. 56 shows an EDX mapping image of In atoms in the cross section ofthe IGZO film of the sample 1A. The EDX mapping image in FIG. 56 showsthe proportions [atomic %] of In atoms in some points of the IGZO film.The proportions of In atoms in relatively dark regions in FIG. 56 arelow, and the lowest proportion is 10.85 atomic %. The proportions of Inatoms in relatively light regions in FIG. 56 are high, and the highestproportion is 25.21 atomic %.

The EDX mapping image in FIG. 56 shows the distribution of light anddark, indicating segregation of In atoms in the cross section of theIGZO film. Here, many of the relatively light regions in the EDX mappingimage have a substantially circular or elliptical shape. In addition,regions formed by connection of a plurality of regions having asubstantially circular or elliptical shape are observed. In other words,regions having a substantially circular or elliptical shape are formedin a net-like manner. As described above, the relatively light regionsare regions where In exists at a high concentration, and correspond tothe regions A described in the above embodiment. Note that each of theregions A is not so large as to cross the analysis target regionlongitudinally or transversely, and is formed in an island-like mannerand surrounded by a relatively dark region (corresponding to the regionB described in the above embodiment). Regions with an intermediate shadeare also formed between the regions A and the region B, and in someportions, the boundary between the regions A and B is not clear. Many ofthe regions A having a substantially circular or elliptical shape have asize in the range from approximately 0.1 nm to 5 nm.

As described above, the IGZO film of the sample 1A is a composite oxidesemiconductor where the In-rich regions A and the In-poor region B areformed. The regions A contribute to the on-state current andfield-effect mobility of a transistor, and the region B contributes tothe switching characteristics of a transistor. Therefore, with the useof the composite oxide semiconductor, a transistor with favorableelectrical characteristics can be manufactured.

Furthermore, since the regions A are formed in an island-like manner andsurrounded by the region B, it is possible to suppress an increase inoff-state current due to connection of a source and a drain of atransistor to each other through the regions A.

Unlike the IGZO film of the sample 1A, an IGZO film of a sample 1B wasformed in an atmosphere including an argon gas at 140 sccm and an oxygengas at 60 sccm, where the substrate temperature was 170° C. Note thatthe other conditions for forming the IGZO film of the sample 1B aresimilar to those for the IGZO film of the sample 1A.

Bright-field scanning transmission electron microscopy (BF-STEM) imagesof cross sections of the samples 1A and 1B were taken at a magnificationof 2000000 times. FIG. 57A shows the BF-STEM image of the sample 1A, andFIG. 57B shows the BF-STEM image of the sample 1B.

As shown in FIG. 57A, although the area is small, a layered crystalportion is formed and a crystal portion with c-axis alignment is alsoobserved in the IGZO film of the sample 1A. In contrast, in the IGZOfilm of the sample 1B shown in FIG. 57B, a layered crystal portion isformed in a larger area than in the IGZO film of the sample 1A. Thus,such a layered crystal portion is also observed in the IGZO film of thesample 1A, which shows segregation of In atoms. It is also suggestedthat the crystallinity of an IGZO film can possibly be improved byincreasing the flow rate ratio of oxygen and increasing the substratetemperature during formation of the IGZO film.

More samples were fabricated by forming IGZO films at different oxygenflow rates and different substrate temperatures, and were subjected tocrystallinity evaluation. The IGZO films of these samples were eachformed at an oxygen flow rate ratio of 10% (an oxygen gas at 20 sccm andan argon gas at 180 sccm), 30% (an oxygen gas at 60 sccm and an argongas at 140 sccm), 50% (an oxygen gas at 100 sccm and an argon gas at 100sccm), 70% (an oxygen gas at 140 sccm and an argon gas at 60 sccm), or100% (an oxygen gas at 200 sccm) and a substrate temperature of roomtemperature, 130° C., or 170° C. Note that the other conditions forforming the IGZO film of each sample are similar to those for the IGZOfilm of the sample 1A.

The crystallinity of the IGZO film of each sample was evaluated by XRDmeasurement. The XRD measurement was performed using a powder method(also referred to as a θ-2θ method), which is a kind of out-of-planemethod. In a θ-2θ method, X-ray diffraction intensity is measured whilean incident angle of an X-ray is changed and the angle of a detectorfacing an X-ray source is equal to the incident angle.

FIG. 58A shows XRD measurement results of the samples. As shown in FIG.58B, the measurement was performed at three points within the glasssubstrate of each sample.

In FIG. 58A, the vertical axis represents diffraction intensity in anarbitrary unit, and the horizontal axis represents angle 20. Inaddition, in FIG. 58A, three XRD profiles corresponding to the threepoints in FIG. 58B are shown together in each graph.

As shown in FIG. 58A, from the IGZO film formed under conditions similarto those for the IGZO film of the sample 1A, a diffraction intensitypeak at around 2θ=31° is not clearly observed, an extremely lowdiffraction intensity peak at around 2θ=31° is observed, or nodiffraction intensity peak at around 2θ=31° is observed. In contrast,from the IGZO film formed under conditions similar to those for the IGZOfilm of the sample 1B, a diffraction intensity peak at around 2θ=31° isclearly observed.

Note that the diffraction angle (at around 2θ=31°) at which thediffraction intensity peak is observed corresponds to a diffractionangle on the (009) plane of the structure model of single crystalInGaZnO₄. Accordingly, the above-described peak observed from the IGZOfilm formed under conditions similar to those for the IGZO film of thesample 1B confirms that the film includes a crystal portion with c-axisalignment.

In contrast, it is difficult to determine whether or not the IGZO filmformed under conditions similar to those for the IGZO film of the sample1A includes a crystal portion with c-axis alignment, by XRD measurement.However, a crystal portion with c-axis alignment in a microscopic regioncan be observed by taking a BF-STEM image or the like as shown in FIG.57A.

As shown in FIG. 58A, the higher the oxygen flow rate ratio or thesubstrate temperature is during the formation of the IGZO film, thesharper the peak of its XRD profile is. This suggests that an IGZO filmwith higher crystallinity can be formed when the oxygen flow rate ratioor the substrate temperature is higher during formation of the IGZOfilm.

EXPLANATION OF REFERENCE

100: capacitor, 101: capacitor, 102: capacitor, 112: conductor, 112 a:conductor, 112 b: conductor, 116: conductor, 124: conductor, 130:insulator, 132: insulator, 134: insulator, 150: insulator, 200:transistor, 201: transistor, 202: transistor, 205: conductor, 205 a:conductor, 205A: conductor, 205 b: conductor, 205B: conductor, 205 c:conductor, 210: insulator, 212: insulator, 213: insulator, 214:insulator, 216: insulator, 218: conductor, 219: conductor, 220:insulator, 222: insulator, 224: insulator, 230: oxide, 230 a: oxide,230A: oxide, 230 b: oxide, 230B: oxide, 230 c: oxide, 230 d: oxide, 240a: conductor, 240A: conductive film, 240 b: conductor, 240B: conductivelayer, 241 a: conductor, 241 b: conductor, 243 a: insulator, 243 b:insulator, 244: conductor, 246: conductor, 250: insulator, 260:conductor, 260 a: conductor, 260A: conductive film, 260 b: conductor,260 c: conductor, 270: insulator, 271: barrier layer, 279: insulator,280: insulator, 281: barrier layer, 282: insulator, 284: insulator, 286:insulator, 290: resist mask, 292: resist mask, 294: resist mask, 296:resist mask, 300: transistor, 301: transistor, 302: transistor, 311:substrate, 312: semiconductor region, 314: insulator, 316: conductor,318 a: low-resistance region, 318 b: low-resistance region, 320:insulator, 322: insulator, 324: insulator, 326: insulator, 328:conductor, 330: conductor, 350: insulator, 352: insulator, 354:insulator, 356: conductor, 358: insulator, 600: target, 600 a: target,600 b: target, 601: deposition chamber, 610: backing plate, 610 a:backing plate, 610 b: backing plate, 620: target holder, 620 a: targetholder, 620 b: target holder, 622: target holder, 623: target shield,630: magnet unit, 630 a: magnet unit, 630 b: magnet unit, 630N: magnet,630N1: magnet, 630N2: magnet, 630S: magnet, 632: magnet holder, 640:plasma, 642: member, 660: substrate, 670: substrate holder, 680 a:magnet line of force, 680 b: magnet line of force, 690: power source,691: power source, 1901: housing, 1902: housing, 1903: display portion,1904: display portion, 1905: microphone, 1906: speaker, 1907: operationkey, 1908: stylus, 1911: housing, 1912: housing, 1913: display portion,1914: display portion, 1915: joint, 1916: operation key, 1921: housing,1922: display portion, 1923: keyboard, 1924: pointing device, 1931:housing, 1932: door for refrigerator, 1933: door for freezer, 1941:housing, 1942: housing, 1943: display portion, 1944: operation key,1945: lens, 1946: joint, 1951: car body, 1952: wheel, 1953: dashboard,1954: light, 2200: imaging device, 2201: switch, 2202: switch, 2203:switch, 2210: pixel portion, 2211: pixel, 2212: subpixel, 2212B:subpixel, 2212G: subpixel, 2212R: subpixel, 2220: photoelectricconversion element, 2230: pixel circuit, 2231: wiring, 2247: wiring,2248: wiring, 2249: wiring, 2250: wiring, 2253: wiring, 2254: filter,2254B: filter, 2254G: filter, 2254R: filter, 2255: lens, 2256: light,2257: wiring, 2260: peripheral circuit, 2270: peripheral circuit, 2280:peripheral circuit, 2290: peripheral circuit, 2291: light source, 2300:silicon substrate, 2310: layer, 2320: layer, 2330: layer, 2340: layer,2351: transistor, 2352: transistor, 2353: transistor, 2360: photodiode,2361: anode, 2363: low-resistance region, 2370: plug, 2371: wiring,2372: wiring, 2373: wiring, 2379: insulator, 2380: insulator, 2381:insulator, 2390 a: conductor, 2390 b: conductor, 2390 c: conductor, 2390d: conductor, 2390 e: conductor, 2700: deposition apparatus, 2701:atmosphere-side substrate supply chamber, 2702: atmosphere-sidesubstrate transfer chamber, 2703 a: load lock chamber, 2703 b: unloadlock chamber, 2704: transfer chamber, 2705: substrate heating chamber,2706 a: deposition chamber, 2706 b: deposition chamber, 2706 c:deposition chamber, 2751: cryotrap, 2752: stage, 2761: cassette port,2762: alignment port, 2763: transfer robot, 2764: gate valve, 2765:heating stage, 2766: target, 2766 a: target, 2766 b: target, 2767:target shield, 2767 a: target shield, 2767 b: target shield, 2768:substrate holder, 2769: substrate, 2770: vacuum pump, 2771: cryopump,2772: turbo molecular pump, 2780: mass flow controller, 2781: refiner,2782: gas heating mechanism, 2784: adjustment member, 2790 a: magnetunit, 2790 b: magnet unit, 2791: power source, 3001: wiring, 3002:wiring, 3003: wiring, 3004: wiring, 3005: wiring, 3006: wiring, 3400:transistor, 4001: wiring, 4003: wiring, 4005: wiring, 4006: wiring,4007: wiring, 4008: wiring, 4009: wiring, 4021: layer, 4023: layer,4100: transistor, 4200: transistor, 4300: transistor, 4400: transistor,4500: capacitor, 4600: capacitor, 5400: semiconductor device, 5401: CPUcore, 5402: power control, 5403: power switch, 5404: cache, 5405: businterface, 5406: debug interface, 5407: control unit, 5409: pipelineregister, 5410: pipeline register, 5411: ALU, 5412: register file, 5421:power management unit, 5422: peripheral circuit, 5423: data bus, 5500:semiconductor device, 5501: memory circuit, 5502: memory circuit, 5503:memory circuit, 5504: circuit, 5509: transistor, 5510: transistor, 5512:transistor, 5513: transistor, 5515: transistor, 5517: transistor, 5518:transistor, 5519: capacitor, 5520: capacitor, 5540: wiring, 5541:wiring, 5542: wiring, 5543: wiring, 5544: wiring, 5711: substrate, 5712:circuit region, 5713: separation region, 5714: separation line, 5715:chip, 5750: electronic component, 5752: printed circuit board, 5753:semiconductor device, 5754: circuit board, 5755: lead, 5800: inverter,5810: OS transistor, 5820: OS transistor, 5831: signal waveform, 5832:signal waveform, 5840: dashed line, 5841: solid line, 5850: OStransistor, 5860: CMOS inverter, 5900: semiconductor device, 5901: powersupply circuit, 5902: circuit, 5903: voltage generation circuit, 5903A:voltage generation circuit, 5903B: voltage generation circuit, 5903C:voltage generation circuit, 5903D: voltage generation circuit, 5903E:voltage generation circuit, 5904: circuit, 5905: voltage generationcircuit, 5905A: voltage generation circuit, 5906: circuit, 5911:transistor, 5912: transistor, 5912A: transistor, 5921: control circuit,and 5922: transistor.

This application is based on Japanese Patent Application serial No.2016-048802 filed with Japan Patent Office on Mar. 11, 2016, the entirecontents of which are hereby incorporated by reference.

1. A semiconductor device comprising: a gate electrode; an oxidesemiconductor film; and a gate insulating film between the gateelectrode and the oxide semiconductor film, wherein the oxidesemiconductor film comprises a first region, a second region, and athird region, wherein the first region comprises indium, an element M,and zinc, wherein the element M is one or more of aluminum, gallium,yttrium, and tin, wherein each of the second region and the third regioncomprises indium and zinc, wherein a concentration of indium in thesecond region is higher than a concentration of indium in the firstregion, wherein a concentration of indium in the third region is higherthan the concentration of indium in the first region, and wherein atleast a part of the first region is between the second region and thethird region.
 2. The semiconductor device according to claim 1, whereinan atomic ratio of indium to the element M and zinc (In:M:Zn) is 5:1:6or a neighborhood thereof in the oxide semiconductor film.
 3. Thesemiconductor device according to claim 1, wherein an atomic ratio ofindium to the element M and zinc (In:M:Zn) in the first region is 4:2:3or a neighborhood thereof.
 4. The semiconductor device according toclaim 1, wherein an atomic ratio of indium to the element M and zinc(In:M:Zn) in the second region is 2:0:3 or a neighborhood thereof. 5.The semiconductor device according to claim 1, wherein an atomic ratioof indium to the element M and zinc (In:M:Zn) is 4:2:3 or a neighborhoodthereof in the oxide semiconductor.
 6. The semiconductor deviceaccording to claim 1, wherein an atomic ratio of indium to the element Mand zinc (In:M:Zn) in the first region is 1:1:1 or a neighborhoodthereof.
 7. The semiconductor device according to claim 1, wherein anatomic ratio of indium to the element M and zinc (In:M:Zn) in the secondregion is 2:0:1 or a neighborhood thereof.
 8. The semiconductor deviceaccording to claim 1, wherein the first region comprises nanocrystals.9. A semiconductor device comprising: a first insulating film; a firstoxide semiconductor film; a second oxide semiconductor film over thefirst oxide semiconductor film; a source electrode and a drain electrodeeach being over and in direct contact with the second oxidesemiconductor film; a second insulating film over the source electrode,the drain electrode, and the second oxide semiconductor film; an openingprovided in the second insulating film; a gate insulating film providedin the opening; and a gate electrode provided in the opening, the gateelectrode being over and in direct contact with the gate insulatingfilm, wherein the second oxide semiconductor film comprises a firstregion, a second region, and a third region, wherein the first regioncomprises indium, an element M, and zinc, wherein the element M is oneor more of aluminum, gallium, yttrium, and tin, wherein each of thesecond region and the third region comprises indium and zinc, wherein aconcentration of indium in the second region is higher than aconcentration of indium in the first region, wherein a concentration ofindium in the third region is higher than the concentration of indium inthe first region, and wherein at least a part of the first region isbetween the second region and the third region.
 10. The semiconductordevice according to claim 9, further comprising a third insulating filmover the second insulating film, wherein a level of a top surface of thegate electrode is equal to a level of a top surface of the secondinsulating film.
 11. The semiconductor device according to claim 9,wherein an atomic ratio of indium to the element M and zinc (In:M:Zn) is5:1:6 or a neighborhood thereof in the second oxide semiconductor film.12. The semiconductor device according to claim 9, wherein an atomicratio of indium to the element M and zinc (In:M:Zn) in the first regionis 4:2:3 or a neighborhood thereof.
 13. The semiconductor deviceaccording to claim 9, wherein an atomic ratio of indium to the element Mand zinc (In:M:Zn) in the second region is 2:0:3 or a neighborhoodthereof.
 14. The semiconductor device according to claim 9, wherein anatomic ratio of indium to the element M and zinc (In:M:Zn) is 4:2:3 or aneighborhood thereof in the second oxide semiconductor film.
 15. Thesemiconductor device according to claim 9, wherein an atomic ratio ofindium to the element M and zinc (In:M:Zn) in the first region is 1:1:1or a neighborhood thereof.
 16. The semiconductor device according toclaim 9, wherein an atomic ratio of indium to the element M and zinc(In:M:Zn) in the second region is 2:0:1 or a neighborhood thereof. 17.The semiconductor device according to claim 9, wherein the first regioncomprises nanocrystals.
 18. The semiconductor device according to claim9, wherein the gate insulating film comprises a first region, a secondregion, and a third region, wherein the first region overlaps the secondoxide semiconductor film, wherein the second region faces a first sidesurface of the second insulating film, and wherein the third regionfaces a second side surface of the second insulating film.